DLPS030E December   2013  – March 2019 DLPC2607

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Typical Current and Power Dissipation
    6. 6.6  I/O Characteristics
    7. 6.7  Internal Pullup and Pulldown Characteristics
    8. 6.8  Parallel I/F Frame Timing Requirements
    9. 6.9  Parallel I/F General Timing Requirements
    10. 6.10 Parallel I/F Maximum Parallel Interface Horizontal Line Rate
    11. 6.11 BT.656 I/F General Timing Requirements
    12. 6.12 100- to 120-Hz Operational Limitations
    13. 6.13 Flash Interface Timing Requirements
    14. 6.14 DMD Interface Timing Requirements
    15. 6.15 mDDR Memory Interface Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Parallel Bus Interface
      2. 7.3.2 100- to 120-Hz 3-D Display Operation
    4. 7.4 Programming
      1. 7.4.1 Serial Flash Interface
      2. 7.4.2 Serial Flash Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 System Functional Modes
      2. 8.2.2 Design Requirements
        1. 8.2.2.1 Reference Clock
        2. 8.2.2.2 mDDR DRAM Compatibility
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Hot-Plug Usage
        2. 8.2.3.2 Maximum Signal Transition Time
        3. 8.2.3.3 Configuration Control
        4. 8.2.3.4 White Point Correction Light Sensor
      4. 8.2.4 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 System Power Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 System Power I/O State Considerations
    4. 9.4 Power-Up Initialization Sequence
    5. 9.5 Power-Good (PARK) Support
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1  Internal ASIC PLL Power
      2. 10.1.2  General Handling Guidelines for Unused CMOS-Type Pins
      3. 10.1.3  SPI Signal Routing
      4. 10.1.4  mDDR Memory and DMD Interface Considerations
      5. 10.1.5  PCB Design
      6. 10.1.6  General PCB Routing (Applies to All Corresponding PCB Signals)
      7. 10.1.7  Maximum, Pin-to-Pin, PCB Interconnects Etch Lengths
      8. 10.1.8  I/F Specific PCB Routing
      9. 10.1.9  Number of Layer Changes
      10. 10.1.10 Stubs
      11. 10.1.11 Termination Requirements:
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Marking
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZVB|176
Thermal pad, mechanical data (Package|Pins)

6.8 Parallel I/F Frame Timing Requirements

MIN MAX UNIT
tp_vsw Pulse duration – VSYNC_WE high 50% reference points 1 lines
tp_vbp Vertical back porch – Time from the leading edge of VSYNC_WE to the leading edge HSYNC_CS for the first active line.(2) 50% reference points 2 lines
tp_vfp Vertical front porch – Time from the leading edge of the HSYNC_CS following the last active line in a frame to the leading edge of VSYNC_WE.(2) 50% reference points 1 lines
tp_tvb Total vertical blanking – Time from the leading edge of HSYNC_CS following the last active line of one frame to the leading edge of HSYNC_CS for the first active line in the next frame. This is equal to the sum of Vertical back porch (tp_vbp) + Vertical front porch (tp_vfp). 50% reference points 12 lines
tp_hsw Pulse duration – HSYNC_CS high 50% reference points 4 128 PCLKs
tp_hbp Horizontal back porch – Time from rising edge of HSYNC_CS to rising edge of DATAEN_CMD. 50% reference points 4 PCLKs
tp_hfp Horizontal front porch – Time from falling edge of DATAEN_CMD to rising edge of HSYNC_CS. 50% reference points 8 PCLKs
tp_thh Total horizontal blanking – Sum of horizontal front and back porches 50% reference points (1) PCLKs
(1) Total horizontal blanking is driven by the max line rate for a given source, which is a function of resolution and orientation. See Parallel I/F Maximum Parallel Interface Horizontal Line Rate for max line rate for each source and display combination. tp_thb = Roundup [(1000 x ƒclock)/ LR] – APPL where ƒclock = Pixel clock rate in MHz, LR = Line rate in kHz, and the number of active pixels per (horizontal) line is APPL. If tp_thb is calculated to be less than tp_hbp + tp_hfp, then the pixel clock rate is too low, or the line rate is too high, and one or both must be adjusted.
(2) The programmable parameter vertical sync line delay (I2C: 0x23) must be set such that:
6 – Vertical front porch (tp_vfp)’ (min 0) ≤ Vertical sync line delay ≤ Vertical back porch (tp_vbp) – 2 (max 15). The default value for vertical sync line delay is set to 5; thus, only a vertical back porch less than 7 requires potential action.