DLPS231B October   2021  – October 2024 DLPC3421

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Electrical Characteristics
    6. 5.6  Pin Electrical Characteristics
    7. 5.7  Internal Pullup and Pulldown Electrical Characteristics
    8. 5.8  DMD Sub-LVDS Interface Electrical Characteristics
    9. 5.9  DMD Low-Speed Interface Electrical Characteristics
    10. 5.10 System Oscillator Timing Requirements
    11. 5.11 Power Supply and Reset Timing Requirements
    12. 5.12 Parallel Interface Video Frame Timing Requirements
    13. 5.13 Parallel Interface General Timing Requirements
    14. 5.14 DSI Host Timing Requirements
    15. 5.15 Flash Interface Timing Requirements
    16. 5.16 Other Timing Requirements
    17. 5.17 DMD Sub-LVDS Interface Switching Characteristics
    18. 5.18 DMD Parking Switching Characteristics
    19. 5.19 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Source Requirements
        1. 6.3.1.1 Supported Resolution and Frame Rates
        2. 6.3.1.2 3D Display
        3. 6.3.1.3 Parallel Interface
          1. 6.3.1.3.1 PDATA Bus - Parallel Interface Bit Mapping Modes
        4. 6.3.1.4 DSI Interface
      2. 6.3.2 Device Startup
      3. 6.3.3 SPI Flash
        1. 6.3.3.1 SPI Flash Interface
        2. 6.3.3.2 SPI Flash Programming
      4. 6.3.4 I2C Interface
      5. 6.3.5 Content Adaptive Illumination Control (CAIC)
      6. 6.3.6 3D Glasses Operation
        1. 6.3.6.1 43
      7. 6.3.7 Test Point Support
      8. 6.3.8 DMD Interface
        1. 6.3.8.1 Sub-LVDS (HS) Interface
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
    6. 6.6 Features and System Configuration
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application—nHD Mode
      2. 7.2.2 Typical Application—HD Mode
      3. 7.2.3 Design Requirements
      4. 7.2.4 Detailed Design Procedure
      5. 7.2.5 Application Curve
  9. 8 Power Supply Recommendations
    1. 8.1 PLL Design Considerations
    2. 8.2 System Power-Up and Power-Down Sequence
    3. 8.3 Power-Up Initialization Sequence
    4. 8.4 DMD Fast Park Control (PARKZ)
    5. 8.5 Hot Plug I/O Usage
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1  PLL Power Layout
      2. 9.1.2  Reference Clock Layout
        1. 9.1.2.1 Recommended Crystal Oscillator Configuration
      3. 9.1.3  DSI Interface Layout
      4. 9.1.4  Unused Pins
      5. 9.1.5  DMD Control and SubLVDS Signals
      6. 9.1.6  Layer Changes
      7. 9.1.7  Stubs
      8. 9.1.8  Terminations
      9. 9.1.9  Routing Vias
      10. 9.1.10 Thermal Considerations
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Device Nomenclature
        1. 10.1.2.1 Device Markings
      3. 10.1.3 Video Timing Parameter Definitions
    2. 10.2 Related Documentation
    3. 10.3 Related Links
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
  14. 13Package Option Addendum
    1. 13.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

4 Pin Configuration and Functions

DLPC3421 ZVB Package176-Pin NFBGABottom View Figure 4-1 ZVB Package176-Pin NFBGABottom View
DLPC3421
Note: The lower image view is from the top.
Table 4-1 Test Pins and General Control
PIN I/O TYPE(4) DESCRIPTION
NAME NO.
HWTEST_EN C10 I 6 Manufacturing test enable signal. Connect this signal directly to ground on the PCB for normal operation.
PARKZ C13 I 6 DMD fast park control (active low Input with a hysteresis buffer). This signal is used to quickly park the DMD when loss of power is imminent. The longest lifetime of the DMD may not be achieved with the fast park operation; therefore, this signal is intended to only be asserted when a normal park operation is unable to be completed. The PARKZ signal is typically provided from the DLPA200x interrupt output signal.
JTAGTCK P12 I 6 TI internal use. Leave this pin unconnected.
JTAGTDI P13 I 6 TI internal use. Leave this pin unconnected.
JTAGTDO1 N13(1) O 1 TI internal use. Leave this pin unconnected.
JTAGTDO2 N12(1) O 1 TI internal use. Leave this pin unconnected.
JTAGTMS1 M13 I 6 TI internal use. Leave this pin unconnected.
JTAGTMS2 N11 I 6 TI internal use. Leave this pin unconnected.
JTAGTRSTZ P11 I 6 TI internal use.
This pin must be tied to ground, through an external resistor for normal operation. Failure to tie this pin low during normal operation can cause start up and initialization problems.(2)
RESETZ C11 I 6 Power-on reset (active low input with a hysteresis buffer). Self-configuration starts when a low-to-high transition is detected on RESETZ. All controller power and clocks must be stable before this reset is de-asserted. No signals are in their active state while RESETZ is asserted. This pin is typically connected to the RESETZ pin of the DLPA200x.
TSTPT_0 R12 I/O 1 Test pins (includes weak internal pulldown). Pins are tri-stated while RESETZ is asserted low. Sampled as an input test mode selection control approximately 1.5µs after de-assertion of RESETZ, and then driven as outputs.(2)(3)

Normal use: reserved for test output. Leave open for normal use.
Note: An external pullup may put the DLPC34xx in a test mode. See Section 6.3.7 for more information.
TSTPT_1 R13 I/O 1
TSTPT_2 R14 I/O 1
TSTPT_3 R15 I/O 1
TSTPT_4 P14 I/O 1
TSTPT_5 P15 I/O 1
TSTPT_6 N14 I/O 1
TSTPT_7 N15 I/O 1
(1) If the application design does not require an external pullup, and there is no external logic that can overcome the weak internal pulldown resistor, then this I/O pin can be left open or unconnected for normal operation. If the application design does not require an external pullup, but there is external logic that might overcome the weak internal pulldown resistor, then an external pulldown is recommended to ensure a logic low.
(2) External resistor must have a value of 8kΩ or less to compensate for pins that provide internal pullup or pulldown resistors.
(3) If the application design does not require an external pullup and there is no external logic that can overcome the weak internal pulldown, then the TSTPT I/O can be left open (unconnected) for normal operation. If operation does not call for an external pullup, but there is external logic that might overcome the weak internal pulldown resistor, then an external pulldown resistor is recommended to ensure a logic low.
(4) See Table 4-11 for type definitions.
Table 4-2 Parallel Port Input
PIN(1)(2) I/O TYPE(4) DESCRIPTION
NAME NO. PARALLEL RGB MODE
PCLK P3 I 11 Pixel clock
PDM_CVS_TE N4 I/O 5 Parallel data mask. Programable polarity with default of active high. Optional signal.
VSYNC_WE P1 I 11 Vsync(3)
HSYNC_CS N5 I 11 Hsync(3)
DATAEN_CMD P2 I 11 Data valid
(TYPICAL RGB 888)
PDATA_0
PDATA_1
PDATA_2
PDATA_3
PDATA_4
PDATA_5
PDATA_6
PDATA_7		 K2
K1
L2
L1
M2
M1
N2
N1		 I 11 Blue (bit weight 1)
Blue (bit weight 2)
Blue (bit weight 4)
Blue (bit weight 8)
Blue (bit weight 16)
Blue (bit weight 32)
Blue (bit weight 64)
Blue (bit weight 128)
(TYPICAL RGB 888)
PDATA_8
PDATA_9
PDATA_10
PDATA_11
PDATA_12
PDATA_13
PDATA_14
PDATA_15		 R1
R2
R3
P4
R4
P5
R5
P6		 I 11 Green (bit weight 1)
Green (bit weight 2)
Green (bit weight 4)
Green (bit weight 8)
Green (bit weight 16)
Green (bit weight 32)
Green (bit weight 64)
Green (bit weight 128)
(TYPICAL RGB 888)
PDATA_16
PDATA_17
PDATA_18
PDATA_19
PDATA_20
PDATA_21
PDATA_22
PDATA_23		 R6
P7
R7
P8
R8
P9
R9
P10		 I 11 Red (bit weight 1)
Red (bit weight 2)
Red (bit weight 4)
Red (bit weight 8)
Red (bit weight 16)
Red (bit weight 32)
Red (bit weight 64)
Red (bit weight 128)
3DR N6 I 11 3D reference
  • For 3D applications: left or right 3D reference (left = 1, right = 0). To be provided by the host. Must transition in the middle of each frame (no closer than 1 ms to the active edge of VSYNC).
  • If a 3D application is not used, pull this input low through an external resistor.
(1) PDATA(23:0) bus mapping depends on pixel format and source mode. See later sections for details.
(2) Connect unused inputs to ground or pulldown to ground through an external resistor (8kΩ or less).
(3) VSYNC and HSYNC polarity can be adjusted by software.
(4) See Table 4-11 for type definitions.
Table 4-3 DSI Input Data and Clock
PIN I/O TYPE(2) DESCRIPTION
NAME NO.
DCLKN
DCLKP		 E2
E1		 I/O 10 DSI LVDS differential clock for DSI interface.
DD0N
DD0P
DD1N
DD1P
DD2N
DD2P
DD3N
DD3P		 G2
G1
F2
F1
D2
D1
C2
C1		 I/O 10 Differential data bus for DSI data lane LVDS differential pair inputs 0 through 3.
(support a maximum of 4 input DSI lanes)(1)
RREF F3 — DSI reference resistor. RREF is an analog signal that requires a fixed precision 30kΩ ±1% resistor connected from this pin to ground when DSI is used. If DSI is NOT used, leave this pin unconnected and floating.
(1) Differential data bus 0 (DD0x) is required for DSI operation. The remaining three data lanes are optional and only needed depending on the implementation and required video bandwidth. Leave any unused DSI LVDS pairs unconnected and floating.
(2) See Table 4-11 for type definitions.
Table 4-4 DMD Reset and Bias Control
PIN I/O TYPE(1) DESCRIPTION
NAME NO.
DMD_DEN_ARSTZ B1 O 2 DMD driver enable (active high). DMD reset (active low). When corresponding I/O power is supplied, the controller drives this signal low after the DMD is parked and before power is removed from the DMD. If the 1.8V power to the DLPC34xx is independent of the 1.8V power to the DMD, then TI recommends including a weak, external pulldown resistor to hold the signal low in case DLPC34xx power is inactive while DMD power is applied.
DMD_LS_CLK A1 O 3 DMD low speed (LS) interface clock
DMD_LS_WDATA A2 O 3 DMD low speed (LS) serial write data
DMD_LS_RDATA B2 I 6 DMD low speed (LS) serial read data
(1) See Table 4-11 for type definitions.
Table 4-5 DMD Sub-LVDS Interface
PIN I/O TYPE(1) DESCRIPTION
NAME NO.
DMD_HS_CLK_P
DMD_HS_CLK_N		 A7
B7		 O 4 DMD high speed (HS) interface clock
DMD_HS_WDATA_H_P
DMD_HS_WDATA_H_N
DMD_HS_WDATA_G_P
DMD_HS_WDATA_G_N
DMD_HS_WDATA_F_P
DMD_HS_WDATA_F_N
DMD_HS_WDATA_E_P
DMD_HS_WDATA_E_N
DMD_HS_WDATA_D_P
DMD_HS_WDATA_D_N
DMD_HS_WDATA_C_P
DMD_HS_WDATA_C_N
DMD_HS_WDATA_B_P
DMD_HS_WDATA_B_N
DMD_HS_WDATA_A_P
DMD_HS_WDATA_A_N		 A3
B3
A4
B4
A5
B5
A6
B6
A8
B8
A9
B9
A10
B10
A11
B11		 O 4 DMD sub-LVDS high speed (HS) interface write data lanes. The true numbering and application of the DMD_HS_WDATA pins depend on the software configuration. See Table 6-10.
(1) See Table 4-11 for type definitions.
Table 4-6 Peripheral Interface
PIN(1) I/O TYPE(2) DESCRIPTION
NAME NO.
CMP_OUT A12 I 6 Successive approximation ADC (analog-to-digital converter) comparator output (DLPC34xx Input). To implement, use a successive approximation ADC with a thermistor feeding one input of the external comparator and the DLPC34xx controller GPIO_10 (RC_CHARGE) pin driving the other side of the comparator. It is recommended to use the DLPA200x to achieve this function. CMP_OUT must be pulled-down to ground if this function is not used. (hysteresis buffer)
CMP_PWM A15 O 1 TI internal use. Leave this pin unconnected.
HOST_IRQ(3) N8 O 9 Host interrupt (output)
HOST_IRQ indicates when the DLPC34xx auto-initialization is in progress and most importantly when it completes.
This pin is tri-stated during reset. An external pullup must be included on this signal.
IIC0_SCL(4) N10 I/O 7 I2C secondary (port 0) SCL (bidirectional, open-drain signal with input hysteresis): This pin requires an external pullup resistor. The secondary I2C I/Os are 3.6V tolerant (high-voltage-input tolerant) and are powered by VCC_INTF (which can be 1.8, 2.5, or 3.3V). External I2C pullups must be connected to a host supply with an equal or higher supply voltage, up to a maximum of 3.6V (a lower pullup supply voltage does not typically satisfy the VIH specification of the secondary I2C input buffers).
IIC1_SCL R11 I/O 8 TI internal use. TI recommends an external pullup resistor.
IIC0_SDA(4) N9 I/O 7 I2C secondary (port 0) SDA. (bidirectional, open-drain signal with input hysteresis): This pin requires an external pullup resistor. The secondary I2C port is the control port of controller. The secondary I2C I/O pins are 3.6V tolerant (high-volt-input tolerant) and are powered by VCC_INTF (which can be 1.8, 2.5, or 3.3V). External I2C pullups must be connected to a host supply with an equal or higher supply voltage, up to a maximum of 3.6V (a lower pullup supply voltage does not typically satisfy the VIH specification of the secondary I2C input buffers).
IIC1_SDA R10 I/O 8 TI internal use. TI recommends an external pullup resistor.
LED_SEL_0 B15 O 1 LED enable select. Automatically controlled by the DLPC34xx programmable DMD sequence.
LED_SEL(1:0)
00
01
10
11		 Enabled LED
None
Red
Green
Blue
LED_SEL_1 B14 O 1 The controller drives these signals low when RESETZ is asserted and the corresponding I/O power is supplied. The controller continues to drive these signals low throughout the auto-initialization process. A weak, external pulldown resistor is recommended to ensure that the LEDs are disabled when I/O power is not applied.
SPI0_CLK A13 O 13 SPI (Serial Peripheral Interface) port 0, clock. This pin is typically connected to the flash memory clock.
SPI0_CSZ0 A14 O 13 SPI port 0, chip select 0 (active low output). This pin is typically connected to the flash memory chip select.
TI recommends an external pullup resistor to avoid floating inputs to the external SPI device during controller reset assertion.
SPI0_CSZ1 C12 O 13 SPI port 0, chip select 1 (active low output). This pin typically remains unused.
TI recommends an external pullup resistor to avoid floating inputs to the external SPI device during controller reset assertion.
SPI0_DIN B12 I 12 Synchronous serial port 0, receive data in. This pin is typically connected to the flash memory data out.
SPI0_DOUT B13 O 13 Synchronous serial port 0, transmit data out. This pin is typically connected to the flash memory data in.
(1) External pullup resistor must be 8 kΩ or less.
(2) See Table 4-11 for type definitions.
(3) For more information about usage, see Section 6.3.2.
(4) When VCC_INTF is powered and VDD is not powered, the controller may drive the IIC0_xxx pins low which prevents communication on this I2C bus. Do not power up the VCC_INTF pin before powering up the VDD pin for any system that has additional secondary devices on this bus.
Table 4-7 GPIO Peripheral Interface
PIN(1) I/O TYPE(3) DESCRIPTION(2)
NAME NO.
GPIO_19 M15 I/O 1 General purpose I/O 19 (hysteresis buffer). Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_18 M14 I/O 1 General purpose I/O 18 (hysteresis buffer). Options:
  1. Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
  2. MTR_SENSE, Motor Sense (Input): For focus motor control applications, this GPIO must be configured as an input to the DLPC34xx and supplied from the focus motor position sensor.
GPIO_17 L15 I/O 1 General purpose I/O 17 (hysteresis buffer). Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_16 L14 I/O 1 General purpose I/O 16 (hysteresis buffer). Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_15 K15 I/O 1 General purpose I/O 15 (hysteresis buffer). Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_14 K14 I/O 1 General purpose I/O 14 (hysteresis buffer). Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_13 J15 I/O 1 General purpose I/O 13 (hysteresis buffer). Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_12 J14 I/O 1 General purpose I/O 12 (hysteresis buffer). Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_11 H15 I/O 1 General purpose I/O 11 (hysteresis buffer). Options:
  1. Thermistor power enable (output). Turns on the power to the thermistor when it is used and enabled.
  2. Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_10 H14 I/O 1 General purpose I/O 10 (hysteresis buffer). Options:
  1. RC_CHARGE (output): Intended to feed the RC charge circuit of the thermistor interface.
  2. Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_09 G15 I/O 1 General purpose I/O 09 (hysteresis buffer). Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_08 G14 I/O 1 General purpose I/O 08 (hysteresis buffer). Normal mirror parking request (active low): To be driven by the PROJ_ON output of the host. A logic low on this signal causes the DLPC34xx to PARK the DMD, but it does not power down the DMD (the DLPA200x does that instead). At power-up, GPIO_08 must remain high until HOST_IRQ goes low (see Section 8.3).
GPIO_07 F15 I/O 1 General purpose I/O 07 (hysteresis buffer). If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_06 F14 I/O 1 General purpose I/O 06 (hysteresis buffer). Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_05 E15 I/O 1 General purpose I/O 05 (hysteresis buffer). Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_04 E14 I/O 1 General purpose I/O 04 (hysteresis buffer). Options:
  1. 3D glasses control (output): Controls the shutters on 3D glasses (Left = 1, Right = 0).
  2. SPI1_CSZ1 (active-low output): Optional SPI1 chip select 1 signal. Requires an external pullup resistor to deactivate this signal during reset and auto-initialization processes.
  3. Optional GPIO. If unused TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_03 D15 I/O 1 General purpose I/O 03 (hysteresis buffer). SPI1_CSZ0 (active low output): SPI1 chip select 0 signal. This pin is typically connected to the DLPA200x SPI_CSZ pin. Requires an external pullup resistor to deactivate this signal during reset and auto-initialization processes.
GPIO_02 D14 I/O 1 General purpose I/O 02 (hysteresis buffer). Options:
  1. SPI1_DOUT (output): SPI1 data output signal. This pin is typically connected to the DLPA200x SPI_DIN pin.
  2. Optional DSI Bus Width Config 1 (input): The controller samples this pin during boot and is used to define the number of lanes used for DSI operation. Requires an external pullup or pulldown resistor to configure as defined in Table 4-8. After boot, this GPIO pin will continue to be used as SPI1_DOUT. Select the external pullup or pulldown resistor to not interfere.
GPIO_01 C15 I/O 1 General purpose I/O 01 (hysteresis buffer). Options:
  1. SPI1_CLK (output): SPI1 clock signal. This pin is typically connected to the DLPA200x SPI_CLK pin.
  2. Optional DSI Bus Width Config 0 (input): The controller samples this pin during boot and is used to define the number of lanes used for DSI operation. Requires an external pullup or pulldown resistor to configure as defined in Table 4-8. After boot, this GPIO pin will continue to be used as SPI1_CLK. Select the external pullup or pulldown resistor to not interfere.
GPIO_00 C14 I/O 1 General purpose I/O 00 (hysteresis buffer). SPI1_DIN (input): SPI1 data input signal. This pin is typically connected to the DLPA200x SPI_DOUT pin.
(1) GPIO pins must be configured through software for input, output, bidirectional, or open-drain operation. Some GPIO pins have one or more alternative use modes, which are also software configurable. An external pullup resistor is required for each signal configured as open-drain.
(2) General purpose I/O for the DLPC3421 controllers. These GPIO pins are software configurable.
(3) See Table 4-11 for type definitions.
Table 4-8 GPIO_01 and GPIO_02
GPIO_02 GPIO_01 Number of DSI Data Lanes
DSI Lane Config 1 DSI Lane Config 0
0 0 1
0 1 2
1 0 3
1 1 4
Table 4-9 Clock and PLL Support
PIN I/O TYPE(1) DESCRIPTION
NAME NO.
PLL_REFCLK_I H1 I 11 Reference clock crystal input. If an external oscillator is used instead of a crystal, use this pin as the oscillator input.
PLL_REFCLK_O J1 O 5 Reference clock crystal return. If an external oscillator is used instead of a crystal, leave this pin unconnected (floating with no added capacitive load).
(1) See Table 4-11 for type definitions.
Table 4-10 Power and Ground
PIN I/O TYPE DESCRIPTION
NAME NO.
VDD C5, D5, D7, D12, J4, J12, K3, L4, L12, M6, M9, D9, D13, F13, H13, L13, M10, D3, E3 — PWR Core 1.1V power (main 1.1V)
VDDLP12 C3 — PWR DSI PHY Low Power mode driver supply. It is recommended to externally tie this pin to VDD.
VSS C4, D6, D8, D10, E4, E13, F4, G4, G12, H4, H12, J3, J13, K4, K12, L3, M4, M5, M8, M12, G13, C6, C8 — GND Core ground (eDRAM, DSI, I/O ground, thermal ground)
VCC18 C7, C9, D4, E12, F12, K13, M11 — PWR All 1.8V I/O power:
(1.8V power supply for RESETZ, PARKZ, LED_SEL, CMP_OUT, GPIO, IIC1, TSTPT, and JTAG pins)
VCC_INTF M3, M7, N3, N7 — PWR Host or parallel interface I/O power: 1.8V to 3.3V (Includes IIC0, PDATA, video syncs, and HOST_IRQ pins)
VCC_FLSH D11 — PWR Flash interface I/O power: 1.8V to 3.3V
(Dedicated SPI0 power pin)
VDD_PLLM H2 — PWR MCG PLL (primary clock generator phase lock loop) 1.1V power
VSS_PLLM G3 — RTN MCG PLL return
VDD_PLLD J2 — PWR DCG PLL (DMD clock generator phase lock loop) 1.1V power
VSS_PLLD H3 — RTN DCG PLL return
Table 4-11 I/O Type Subscript Definition
I/O SUPPLY REFERENCE ESD STRUCTURE
SUBSCRIPT DESCRIPTION
1 1.8V LVCMOS I/O buffer with 8mA drive Vcc18 ESD diode to GND and supply rail
2 1.8V LVCMOS I/O buffer with 4mA drive Vcc18 ESD diode to GND and supply rail
3 1.8V LVCMOS I/O buffer with 24mA drive Vcc18 ESD diode to GND and supply rail
4 1.8V sub-LVDS output with 4mA drive Vcc18 ESD diode to GND and supply rail
5 1.8V, 2.5V, 3.3V LVCMOS with 4mA drive Vcc_INTF ESD diode to GND and supply rail
6 1.8V LVCMOS input Vcc18 ESD diode to GND and supply rail
7 1.8V, 2.5V, 3.3V I2C with 3mA drive Vcc_INTF ESD diode to GND and supply rail
8 1.8V I2C with 3mA drive Vcc18 ESD diode to GND and supply rail
9 1.8V, 2.5V, 3.3V LVCMOS with 8mA drive Vcc_INTF ESD diode to GND and supply rail
10 DSI LVDS I/O VDD for high speed transmit, high speed receive, and low power receive.
VDDLP12 for low power transmit		 ESD diode to GND and supply rail
11 1.8V, 2.5V, 3.3V LVCMOS input Vcc_INTF ESD diode to GND and supply rail
12 1.8V, 2.5V, 3.3V LVCMOS input Vcc_FLSH ESD diode to GND and supply rail
13 1.8V, 2.5V, 3.3V LVCMOS with 8mA drive Vcc_FLSH ESD diode to GND and supply rail