over operating free-air temperature (unless otherwise noted)(1) | MIN | MAX | UNIT |
---|
SUPPLY VOLTAGE(2) | | | |
V(VDD) | –0.3 | 1.21 | V |
V(VDDLP12) | –0.3 | 1.32 | V |
V(VCC18) | –0.3 | 1.96 | V |
DMD sub-LVDS interface (DMD_HS_CLK_x and
DMD_HS_WDATA_x_y) | –0.3 | 1.96 | V |
V(VCC_INTF) | –0.3 | 3.60 | V |
V(VCC_FLSH) | –0.3 | 3.60 | V |
V(VDD_PLLM) (MCG PLL) | –0.3 | 1.21 | V |
V(VDD_PLLD) (DCG PLL) | –0.3 | 1.21 | V |
VI2C buffer (I/O type 7) | –0.3 | See (3) | V |
GENERAL |
TJ | Operating junction temperature | –30 | 125 | °C |
Tstg | Storage temperature | –40 | 125 | °C |
(1) Stresses beyond those listed under
Section 6.1 may cause permanent damage to the device. These are stress ratings only,
which do not imply functional operation of the device at these or any other
conditions beyond those indicated under
Section 6.3. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
(2) All voltage values are with respect to VSS (GND).
(3) I/O is high voltage tolerant; that is, if VCC_INTF = 1.8 V, the input is 3.3-V tolerant, and if VCC_INTF = 3.3 V, the input is 5-V tolerant.