DLPS112C June   2018  – August 2021 DLPC3479

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  Internal Pullup and Pulldown Electrical Characteristics
    8. 6.8  DMD Sub-LVDS Interface Electrical Characteristics
    9. 6.9  DMD Low-Speed Interface Electrical Characteristics
    10. 6.10 System Oscillator Timing Requirements
    11. 6.11 Power Supply and Reset Timing Requirements
    12. 6.12 Parallel Interface Frame Timing Requirements
    13. 6.13 Parallel Interface General Timing Requirements
    14. 6.14 Flash Interface Timing Requirements
    15. 6.15 Other Timing Requirements
    16. 6.16 DMD Sub-LVDS Interface Switching Characteristics
    17. 6.17 DMD Parking Switching Characteristics
    18. 6.18 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Source Requirements
        1. 7.3.1.1 Supported Resolution and Frame Rates
        2. 7.3.1.2 3D Display
        3. 7.3.1.3 Parallel Interface
          1. 7.3.1.3.1 PDATA Bus – Parallel Interface Bit Mapping Modes
      2. 7.3.2  Pattern Display
        1. 7.3.2.1 External Pattern Mode
          1. 7.3.2.1.1 8-bit Monochrome Patterns
          2. 7.3.2.1.2 1-Bit Monochrome Patterns
        2. 7.3.2.2 Internal Pattern Mode
          1. 7.3.2.2.1 Free Running Mode
          2. 7.3.2.2.2 Trigger In Mode
      3. 7.3.3  Device Start-Up
      4. 7.3.4  SPI Flash
        1. 7.3.4.1 SPI Flash Interface
        2. 7.3.4.2 SPI Flash Programming
      5. 7.3.5  I2C Interface
      6. 7.3.6  Content Adaptive Illumination Control (CAIC)
      7. 7.3.7  Local Area Brightness Boost (LABB)
      8. 7.3.8  3D Glasses Operation
      9. 7.3.9  Test Point Support
      10. 7.3.10 DMD Interface
        1. 7.3.10.1 Sub-LVDS (HS) Interface
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 PLL Design Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 Power-Up Initialization Sequence
    4. 9.4 DMD Fast Park Control (PARKZ)
    5. 9.5 Hot Plug I/O Usage
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PLL Power Layout
      2. 10.1.2 Reference Clock Layout
        1. 10.1.2.1 Recommended Crystal Oscillator Configuration
      3. 10.1.3 Unused Pins
      4. 10.1.4 DMD Control and Sub-LVDS Signals
      5. 10.1.5 Layer Changes
      6. 10.1.6 Stubs
      7. 10.1.7 Terminations
      8. 10.1.8 Routing Vias
      9. 10.1.9 Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Markings
      3. 11.1.3 Video Timing Parameter Definitions
    2. 11.2 Documentation Support
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 DMD Sub-LVDS Interface Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VCMCommon mode voltage0.80.91.0V
VCM (Δpp)(1)VCM change peak-to-peak (during switching)75mV
VCM (Δss)(1)VCM change steady state–1010mV
|VOD|(2)Differential output voltage magnitude170250350mV
VOD (Δ)VOD change (between logic states)–1010mV
VOHSingle-ended output voltage high0.8251.0251.175V
VOLSingle-ended output voltage low0.6250.7750.975V
TxtermInternal differential termination80100120Ω
Txload100-Ω differential PCB trace
(50-Ω transmission lines)		0.56inches
(1) See Figure 6-1
(2) VOD is the differential voltage measured across a 100-Ω termination resistance connected directly between the transmitter differential pins. VOD = VP - VN, where P and N are the differential output pins. |VOD| is the magnitude of the peak-to-peak voltage swing across the P and N output pins (see Figure 6-2). VCM cancels out between signals when measured differentially, thus the reason VOD swings relative to zero.
GUID-8C2137B8-01FC-46A3-BAA2-65613815DD41-low.gifFigure 6-1 Common Mode Voltage
GUID-B12139D4-8117-4978-BFDD-4D4B47EC5185-low.gif
VCM is removed when the signals are viewed differentially
Figure 6-2 Differential Output Signal