DLPS223A December   2021  – February 2023 DLPC4430

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  System Oscillators Timing Requirements
    7. 6.7  Test and Reset Timing Requirements
    8. 6.8  JTAG Interface: I/O Boundary Scan Application Timing Requirements
    9. 6.9  Port 1 Input Pixel Timing Requirements
    10. 6.10 Port 3 Input Pixel Interface (via GPIO) Timing Requirements
    11. 6.11 DMD LVDS Interface Timing Requirements
    12. 6.12 Synchronous Serial Port (SSP) Interface Timing Requirements
    13. 6.13 Programmable Output Clocks Switching Characteristics
    14. 6.14 Synchronous Serial Port Interface (SSP) Switching Characteristics
    15. 6.15 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 System Reset Operation
        1. 7.3.1.1 Power-Up Reset Operation
        2. 7.3.1.2 System Reset Operation
      2. 7.3.2 Spread Spectrum Clock Generator Support
      3. 7.3.3 GPIO Interface
      4. 7.3.4 Source Input Blanking
      5. 7.3.5 Video Graphics Processing Delay
      6. 7.3.6 Program Memory Flash/SRAM Interface
      7. 7.3.7 Calibration and Debug Support
      8. 7.3.8 Board Level Test Support
    4. 7.4 Device Functional Modes
      1. 7.4.1 Standby Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Normal Configuration
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Recommended MOSC Crystal Oscillator Configuration
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 System Power Regulations
    2. 9.2 System Power-Up Sequence
    3. 9.3 Power-On Sense (POSENSE) Support
    4. 9.4 System Environment and Defaults
      1. 9.4.1 DLPC4430 System Power-Up and Reset Default Conditions
      2. 9.4.2 1.15V System Power
      3. 9.4.3 1.8V System Power
      4. 9.4.4 3.3V System Power
      5. 9.4.5 Power Good (PWRGOOD) Support
      6. 9.4.6 5V Tolerant Support
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout Guidelines for Internal DLPC4430 Power
      2. 10.1.2 PCB Layout Guidelines for Auto-Lock Performance
      3. 10.1.3 DMD Interface Considerations
      4. 10.1.4 Layout Example
      5. 10.1.5 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Device Support
      1. 11.2.1 Video Timing Parameter Definitions
      2. 11.2.2 Device Nomenclature
      3. 11.2.3 Device Markings
        1. 11.2.3.1 Device Marking
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1.1 Recommended MOSC Crystal Oscillator Configuration

Table 8-1 Crystal Port Characteristics
PARAMETERNOMINALUNIT
MOSC TO GROUND Capacitance1.5pF
MOSCZ TO GROUND Capacitance1.5pF
Table 8-2 Recommended Crystal Configuration
PARAMETERRECOMMENDEDUNIT
Crystal circuit configurationParallel resonant
Crystal typeFundamental (1st harmonic)
Crystal nominal frequency20MHz
Crystal frequency temperature stability+/– 30PPM
Overall crystal frequency tolerance (including accuracy, stability, aging, and trim sensitivity)+/– 100PPM
Crystal Equivalent Series Resistor (ESR)50 maxΩ
Crystal load20pF
Crystal shunt load7 maxpF
RS drive resistor (nominal)100Ω
RFB feedback resistor (nominal)1MΩ
CL1 external crystal load capacitor (MOSC)See (1).pF
CL2 external crystal load capacitor (MOSCN)See (1).pF
PCB layoutA ground isolation ring around the crystal is recommended.
(1) Typical drive level with the XSA020000FK1H-OCX Crystal (ESRmax = 40 Ω) = 50 µW.
GUID-1C9AF34E-C43A-4DC1-95DD-0CE0AAA02CE4-low.jpgFigure 8-3 Recommended Crystal Oscillator Configuration

Typically, the external crystal oscillator stabilizes within 50 ms after stable power is applied.