DLPS168C May   2021  – November 2022 DLPC6540

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  DMD HSSI Electrical Characteristics
    8. 6.8  DMD Low-Speed LVDS Electrical Characteristics
    9. 6.9  V-by-One Interface Electrical Characteristics
    10. 6.10 USB Electrical Characteristics
    11. 6.11 System Oscillator Timing Requirements
    12. 6.12 Power Supply and Reset Timing Requirements
    13. 6.13 DMD HSSI Timing Requirements
    14. 6.14 DMD Low-Speed LVDS Timing Requirements
    15. 6.15 V-by-One Interface General Timing Requirements
    16. 6.16 Source Frame Timing Requirements
    17. 6.17 Synchronous Serial Port Interface Timing Requirements
    18. 6.18 Master and Slave I2C Interface Timing Requirements
    19. 6.19 Programmable Output Clock Timing Requirements
    20. 6.20 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    21. 6.21 JTAG ARM Multi-Ice Interface Timing Requirements (Debug Only)
    22. 6.22 Multi-Trace ETM Interface Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Sources
      2. 7.3.2 Processing Delays
      3. 7.3.3 V-by-One Interface
      4. 7.3.4 DMD (HSSI) Interface
      5. 7.3.5 Program Memory Flash Interface
      6. 7.3.6 GPIO Supported Functionality
      7. 7.3.7 Debug Support
    4. 7.4 Device Operational Modes
      1. 7.4.1 Standby Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Normal Configuration
  8. 8 Power Supply Recommendations
    1. 8.1 Power Supply Management
    2. 8.2 Hot Plug Usage
    3. 8.3 Power Supplies for Unused Input Source Interfaces
    4. 8.4 Power Supplies
      1. 8.4.1 1.15-V Power Supplies
      2. 8.4.2 1.21V Power Supply
      3. 8.4.3 1.8-V Power Supplies
      4. 8.4.4 3.3-V Power Supplies
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 General Layout Guidelines
      2. 9.1.2 Power Supply Layout Guidelines
      3. 9.1.3 Layout Guidelines for Internal Controller PLL Power
      4. 9.1.4 Layout Guideline for DLPC6540 Reference Clock
        1. 9.1.4.1 Recommended Crystal Oscillator Configuration
      5. 9.1.5 V-by-One Interface Layout Considerations
      6. 9.1.6 USB Interface Layout Considerations
      7. 9.1.7 DMD Interface Layout Considerations
      8. 9.1.8 General Handling Guidelines for Unused CMOS-Type Pins
      9. 9.1.9 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
    2. 9.2 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Device Nomenclature
        1. 10.1.2.1 Device Markings
        2. 10.1.2.2 Package Data
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
      1. 10.6.1 Video Timing Parameter Definitions
  11. 11Mechanical, Packaging, and Orderable Information
    1.     79

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.15 V-by-One Interface General Timing Requirements

PARAMETER(1) MIN MAX UNIT
fclockSource clock frequency40 (1 lane)
20 (1 lane with Pixel Repeat) (2)		600 (8 lanes)MHz
flink-ckLink clock frequency per lane (3)8 lanes
4 lanes
2 lanes
1 lane		43
43
43
43 (21.5 with Pixel Repeat)		75
85
85
85		MHz
flinkLink transfer rate (3)3-Byte Mode
4-Byte Mode
5-Byte Mode		2
2
2.15		2.55
3.0
3.0		Gbps
tRBITUnit interval3-Byte Mode
4-Byte Mode
5-Byte Mode		392
294
294		500
500
500		ps
ps
ps
tA Jitter Margin 0.25 UI
tB Rise / Fall Time 0.05 UI
tEYE Differential Data Eye 0.5 UI
tskew_intraAllowable intra-pair skew0.3UI
tskew_interAllowable Inter-pair Skew5UI
foskew_interAllowable inter-pair frequency offset–300300ppm
TjTotal jitter—0.5UI
RjRandom jitter10^12 UI-0.2UI
Dj_ISIDeterministic jitter (ISI)-0.2UI
SjSinusoidal jitter-0.1UI
(1) V-by-One high-speed technology supports 1, 2, 4, or 8 lane operation, in addition to 3-byte, 4-byte, and 5-byte transfer modes.
(2) Pixel repeat is a method used to support slower clock rate sources, whereby, the source come at twice the original clock rate, with each data pixel being repeated once, and blanking being doubled as well. This method must operate external to DLPC6540. Once received, the DLPC6540 discards each duplicate data pixel and blanking clock. Pixel repeat is supported only during 1- lane operation.
(3) For V-by-One high-speed technology, both link clock rate and link transfer rate limits must be met for any source.
GUID-20200924-CA0I-G233-1QTN-NFDNLHRQVRCB-low.gif Figure 6-13 V-by-One Timing