DLPS168C May   2021  – November 2022 DLPC6540

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  DMD HSSI Electrical Characteristics
    8. 6.8  DMD Low-Speed LVDS Electrical Characteristics
    9. 6.9  V-by-One Interface Electrical Characteristics
    10. 6.10 USB Electrical Characteristics
    11. 6.11 System Oscillator Timing Requirements
    12. 6.12 Power Supply and Reset Timing Requirements
    13. 6.13 DMD HSSI Timing Requirements
    14. 6.14 DMD Low-Speed LVDS Timing Requirements
    15. 6.15 V-by-One Interface General Timing Requirements
    16. 6.16 Source Frame Timing Requirements
    17. 6.17 Synchronous Serial Port Interface Timing Requirements
    18. 6.18 Master and Slave I2C Interface Timing Requirements
    19. 6.19 Programmable Output Clock Timing Requirements
    20. 6.20 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    21. 6.21 JTAG ARM Multi-Ice Interface Timing Requirements (Debug Only)
    22. 6.22 Multi-Trace ETM Interface Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Sources
      2. 7.3.2 Processing Delays
      3. 7.3.3 V-by-One Interface
      4. 7.3.4 DMD (HSSI) Interface
      5. 7.3.5 Program Memory Flash Interface
      6. 7.3.6 GPIO Supported Functionality
      7. 7.3.7 Debug Support
    4. 7.4 Device Operational Modes
      1. 7.4.1 Standby Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Normal Configuration
  8. 8 Power Supply Recommendations
    1. 8.1 Power Supply Management
    2. 8.2 Hot Plug Usage
    3. 8.3 Power Supplies for Unused Input Source Interfaces
    4. 8.4 Power Supplies
      1. 8.4.1 1.15-V Power Supplies
      2. 8.4.2 1.21V Power Supply
      3. 8.4.3 1.8-V Power Supplies
      4. 8.4.4 3.3-V Power Supplies
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 General Layout Guidelines
      2. 9.1.2 Power Supply Layout Guidelines
      3. 9.1.3 Layout Guidelines for Internal Controller PLL Power
      4. 9.1.4 Layout Guideline for DLPC6540 Reference Clock
        1. 9.1.4.1 Recommended Crystal Oscillator Configuration
      5. 9.1.5 V-by-One Interface Layout Considerations
      6. 9.1.6 USB Interface Layout Considerations
      7. 9.1.7 DMD Interface Layout Considerations
      8. 9.1.8 General Handling Guidelines for Unused CMOS-Type Pins
      9. 9.1.9 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
    2. 9.2 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Device Nomenclature
        1. 10.1.2.1 Device Markings
        2. 10.1.2.2 Package Data
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
      1. 10.6.1 Video Timing Parameter Definitions
  11. 11Mechanical, Packaging, and Orderable Information
    1.     79

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.4 3.3-V Power Supplies

The DLPC6540 can support a low cost power delivery system with a single 3.3-V power source derived from a switching regulator. To enable this approach, provide typical bulk (e.g. 10 µF, 22 µF) and high frequency (e.g. 0.1 µF) filtering for the main 3.3-V I/O power rail (VDD33). Ensure that the the high-frequency capacitors are evenly distributed amongst the power balls and that they are placed as close to the power balls as possible. Additional filtering must be provided for each of the uniquely defined 3.3-V power pins (e.g. VAD33_USB, VDD33_FPD). This is discussed further in Section 9.1 of the document.