DLPS271 April   2024 DLPC7530

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Electrical Characteristics
    6. 5.6  Pin Electrical Characteristics
    7. 5.7  DMD HSSI Electrical Characteristics
    8. 5.8  DMD Low-Speed LVDS Electrical Characteristics
    9. 5.9  V-by-One Interface Electrical Characteristics
    10. 5.10 FPD-Link LVDS Electrical Characteristics
    11. 5.11 USB Electrical Characteristics
    12. 5.12 System Oscillator Timing Requirements
    13. 5.13 Power Supply and Reset Timing Requirements
    14. 5.14 DMD HSSI Timing Requirements
    15. 5.15 DMD Low-Speed LVDS Timing Requirements
    16. 5.16 V-by-One Interface General Timing Requirements
    17. 5.17 FPD-Link Interface General Timing Requirements
    18. 5.18 Parallel Interface General Timing Requirements
    19. 5.19 Source Frame Timing Requirements
    20. 5.20 Synchronous Serial Port Interface Timing Requirements
    21. 5.21 Controller and Target I2C Interface Timing Requirements
    22. 5.22 Programmable Output Clock Timing Requirements
    23. 5.23 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    24. 5.24 JTAG ARM Multi-Ice Interface Timing Requirements (Debug Only)
    25. 5.25 Multi-Trace ETM Interface Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Sources
      2. 6.3.2 Processing Delays
      3. 6.3.3 Parallel Interface
      4. 6.3.4 FPD-Link Interface
      5. 6.3.5 V-by-One Interface
      6. 6.3.6 DMD (HSSI) Interface
      7. 6.3.7 Program Memory Flash Interface
      8. 6.3.8 GPIO Supported Functionality
      9. 6.3.9 Debug Support
    4. 6.4 Device Operational Modes
      1. 6.4.1 Standby Mode
      2. 6.4.2 Active Mode
        1. 6.4.2.1 Normal Configuration
        2. 6.4.2.2 Low Latency Configuration
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
  9. 8 Power Supply Recommendations
    1. 8.1 Power Supply Management
    2. 8.2 Hot Plug Usage
    3. 8.3 Power Supplies for Unused Input Source Interfaces
    4. 8.4 Power Supplies
      1. 8.4.1 1.15-V Power Supplies
      2. 8.4.2 1.21V Power Supply
      3. 8.4.3 1.8-V Power Supplies
      4. 8.4.4 3.3-V Power Supplies
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1  General Layout Guidelines
      2. 9.1.2  Power Supply Layout Guidelines
      3. 9.1.3  Layout Guidelines for Internal Controller PLL Power
      4. 9.1.4  Layout Guideline for DLPC7530 Reference Clock
        1. 9.1.4.1 Recommended Crystal Oscillator Configuration
      5. 9.1.5  V-by-One Interface Layout Considerations
      6. 9.1.6  FPD-Link Interface Layout Considerations
      7. 9.1.7  USB Interface Layout Considerations
      8. 9.1.8  DMD Interface Layout Considerations
      9. 9.1.9  General Handling Guidelines for Unused CMOS-Type Pins
      10. 9.1.10 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
    2. 9.2 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Device Nomenclature
        1. 10.1.2.1 Device Markings
        2. 10.1.2.2 Package Data
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
      1. 10.6.1 Video Timing Parameter Definitions
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     92

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.2 Power Supply Layout Guidelines

The following filtering circuits are recommended for the power supply inputs listed below.

  • VAD115_VX1
  • VAD18_VX1
  • VAD115_FPD
  • VDD33_FPD
  • VAD33_USB
  • VDD18_SCS

Because the PBC layout is critical to the performance of the interfaces associated with these power supplies, it is vital that these power supplies be treated like an analog signal. Specifically:

  • Place high-frequency components (such as ferrites and capacitors) as close to the power ball(s) as possible.
  • Choose high-frequency ceramic capacitors (such as those with a value of 0.1 µF, 0.01 µF, and 100 nF) that have low ESR and ESL values. Design the leads as short as possible, and as such, place these capacitors under the package on the opposite side of the board.
  • For each power pin, a single trace (as wide as possible) must be used from the controller to the capacitor and then through the series ferrite to the power source.
  • For each power pin, add a 100-nF decoupling capacitor placed near the escape via. Add this decoupling capacitance to the capacitance recommended for filters. These are minimum recommendations, so different layouts could require additional capacitance.
  • See Table 9-1 for the recommended series ferrite component for these supplies.
DLPC7530 VAD115_VX1 (V-by-One) Recommended Filter Figure 9-1 VAD115_VX1 (V-by-One) Recommended Filter
DLPC7530 VAD18_VX1 (V-by-One) Recommended Filter Figure 9-2 VAD18_VX1 (V-by-One) Recommended Filter
DLPC7530 VAD115_FPD (FPD-Link) Recommended Filter Figure 9-3 VAD115_FPD (FPD-Link) Recommended Filter
DLPC7530 VDD33_FPD (FPD-Link) Recommended Filter Figure 9-4 VDD33_FPD (FPD-Link) Recommended Filter
DLPC7530 VAD33_USB (USB) Recommended Filter Figure 9-5 VAD33_USB (USB) Recommended Filter
DLPC7530 VDD18_SCS (SCS DRAM) Recommended Filter Figure 9-6 VDD18_SCS (SCS DRAM) Recommended Filter