DLPS271 April   2024 DLPC7530

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Electrical Characteristics
    6. 5.6  Pin Electrical Characteristics
    7. 5.7  DMD HSSI Electrical Characteristics
    8. 5.8  DMD Low-Speed LVDS Electrical Characteristics
    9. 5.9  V-by-One Interface Electrical Characteristics
    10. 5.10 FPD-Link LVDS Electrical Characteristics
    11. 5.11 USB Electrical Characteristics
    12. 5.12 System Oscillator Timing Requirements
    13. 5.13 Power Supply and Reset Timing Requirements
    14. 5.14 DMD HSSI Timing Requirements
    15. 5.15 DMD Low-Speed LVDS Timing Requirements
    16. 5.16 V-by-One Interface General Timing Requirements
    17. 5.17 FPD-Link Interface General Timing Requirements
    18. 5.18 Parallel Interface General Timing Requirements
    19. 5.19 Source Frame Timing Requirements
    20. 5.20 Synchronous Serial Port Interface Timing Requirements
    21. 5.21 Controller and Target I2C Interface Timing Requirements
    22. 5.22 Programmable Output Clock Timing Requirements
    23. 5.23 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    24. 5.24 JTAG ARM Multi-Ice Interface Timing Requirements (Debug Only)
    25. 5.25 Multi-Trace ETM Interface Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Sources
      2. 6.3.2 Processing Delays
      3. 6.3.3 Parallel Interface
      4. 6.3.4 FPD-Link Interface
      5. 6.3.5 V-by-One Interface
      6. 6.3.6 DMD (HSSI) Interface
      7. 6.3.7 Program Memory Flash Interface
      8. 6.3.8 GPIO Supported Functionality
      9. 6.3.9 Debug Support
    4. 6.4 Device Operational Modes
      1. 6.4.1 Standby Mode
      2. 6.4.2 Active Mode
        1. 6.4.2.1 Normal Configuration
        2. 6.4.2.2 Low Latency Configuration
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
  9. 8 Power Supply Recommendations
    1. 8.1 Power Supply Management
    2. 8.2 Hot Plug Usage
    3. 8.3 Power Supplies for Unused Input Source Interfaces
    4. 8.4 Power Supplies
      1. 8.4.1 1.15-V Power Supplies
      2. 8.4.2 1.21V Power Supply
      3. 8.4.3 1.8-V Power Supplies
      4. 8.4.4 3.3-V Power Supplies
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1  General Layout Guidelines
      2. 9.1.2  Power Supply Layout Guidelines
      3. 9.1.3  Layout Guidelines for Internal Controller PLL Power
      4. 9.1.4  Layout Guideline for DLPC7530 Reference Clock
        1. 9.1.4.1 Recommended Crystal Oscillator Configuration
      5. 9.1.5  V-by-One Interface Layout Considerations
      6. 9.1.6  FPD-Link Interface Layout Considerations
      7. 9.1.7  USB Interface Layout Considerations
      8. 9.1.8  DMD Interface Layout Considerations
      9. 9.1.9  General Handling Guidelines for Unused CMOS-Type Pins
      10. 9.1.10 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
    2. 9.2 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Device Nomenclature
        1. 10.1.2.1 Device Markings
        2. 10.1.2.2 Package Data
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
      1. 10.6.1 Video Timing Parameter Definitions
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     92

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.19 Source Frame Timing Requirements

See Figure 5-16.
PARAMETER (1)MINMAXUNIT
tp_vswVSYNC active pulse width50% reference points1127lines
tp_vbpVertical back porch (VBP)(2)50% reference points2 (3)lines
tp_vƒpVertical front porch (VFP)(2)50% reference pointsMAX[ (TVBMIN – 65), 1](3)lines
tp_tvbTotal vertical blanking (TVB)(2)50% reference pointsSee (4).lines
tp_hswHSYNC active pulse width50% reference points16PCLKs
tp_hbpHorizontal back porch (HBP)(5)50% reference points5 (Digital Video Sources)
65 (Analog Video Sources)		PCLKs
tp_hfpHorizontal front porch (HFP)(5)50% reference points2PCLKs
tp_thbTotal horizontal blanking (THB) (5)50% reference points20 (Digital Video Sources)
80 (Analog Video Sources) (6)		PCLKs
flineHorizontal line rate37.354K Hz
APPLActive pixels per line6404096Pixels
ALPFActive lines per frame480 2160 (normal)Lines
(1) The requirements in the table apply to all external sources.
(2) Vertical Blanking Parameter Definitions:
  1. Vertical Back Porch: Time from the leading edge of VSYNC to the leading edge of HSYNC for the first active line, and includes the VSYNC pulse width tp_vsw.
  2. Vertical Front Porch: Time from the leading edge of HSYNC following the last active line in a frame to the leading edge of VSYNC
  3. Total Vertical Blanking: The sum of VBP + VFP = TVB.
(3) The vertical blanking required (per TVB) can be allocated as desired as long as the VFP and VBP minimum values are met.
(4) The minimum TVB can be calculated using the following:
TVBmin = 11 + ROUNDUP(LLS_VFP_MIN × (Source_ALPF/VPS_ALPF)), where:
  1. LLS_VFP_MIN (Normal Mode) = 22
  2. Source_ALPF = Active Lines Per Frame of the incoming source
  3. VPS_ALPF = 1080 (for 1920×1080 Native products and 3840×2160 4-way XPR products)
  4. Less TVBmin blanking can be required depending on the video processing being done. The configurations that drive the worst case minimum value are those configurations that combine the maximum (or near maximum) capabilities of functions such as scaling, warping, and keystone correction.
  5. This is applicable to all sources (Section 6.4). Other sources require directed testing in the end application.
  6. The minimum recommended TVB with CVT 1.2 sources is 23.
(5) Horizontal Blanking Parameter Definitions:
  1. Horizontal Back Porch: Time from the leading edge of HSYNC to the rising edge of DATEN, and includes the HSYNC pulse width tp_hsw.
  2. Horizontal Front Porch: Time from the falling edge of DATEN to the leading edge of HSYNC.
  3. Total Horizontal Blanking: The sum of HBP + HFP = THB.
(6) The horizontal blanking required (per THB) can be allocated as desired as long as the HFP and HBP minimum values are met.
DLPC7530 Source Frame TimingFigure 5-16 Source Frame Timing