DLPS271 April   2024 DLPC7530

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Electrical Characteristics
    6. 5.6  Pin Electrical Characteristics
    7. 5.7  DMD HSSI Electrical Characteristics
    8. 5.8  DMD Low-Speed LVDS Electrical Characteristics
    9. 5.9  V-by-One Interface Electrical Characteristics
    10. 5.10 FPD-Link LVDS Electrical Characteristics
    11. 5.11 USB Electrical Characteristics
    12. 5.12 System Oscillator Timing Requirements
    13. 5.13 Power Supply and Reset Timing Requirements
    14. 5.14 DMD HSSI Timing Requirements
    15. 5.15 DMD Low-Speed LVDS Timing Requirements
    16. 5.16 V-by-One Interface General Timing Requirements
    17. 5.17 FPD-Link Interface General Timing Requirements
    18. 5.18 Parallel Interface General Timing Requirements
    19. 5.19 Source Frame Timing Requirements
    20. 5.20 Synchronous Serial Port Interface Timing Requirements
    21. 5.21 Controller and Target I2C Interface Timing Requirements
    22. 5.22 Programmable Output Clock Timing Requirements
    23. 5.23 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    24. 5.24 JTAG ARM Multi-Ice Interface Timing Requirements (Debug Only)
    25. 5.25 Multi-Trace ETM Interface Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Sources
      2. 6.3.2 Processing Delays
      3. 6.3.3 Parallel Interface
      4. 6.3.4 FPD-Link Interface
      5. 6.3.5 V-by-One Interface
      6. 6.3.6 DMD (HSSI) Interface
      7. 6.3.7 Program Memory Flash Interface
      8. 6.3.8 GPIO Supported Functionality
      9. 6.3.9 Debug Support
    4. 6.4 Device Operational Modes
      1. 6.4.1 Standby Mode
      2. 6.4.2 Active Mode
        1. 6.4.2.1 Normal Configuration
        2. 6.4.2.2 Low Latency Configuration
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
  9. 8 Power Supply Recommendations
    1. 8.1 Power Supply Management
    2. 8.2 Hot Plug Usage
    3. 8.3 Power Supplies for Unused Input Source Interfaces
    4. 8.4 Power Supplies
      1. 8.4.1 1.15-V Power Supplies
      2. 8.4.2 1.21V Power Supply
      3. 8.4.3 1.8-V Power Supplies
      4. 8.4.4 3.3-V Power Supplies
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1  General Layout Guidelines
      2. 9.1.2  Power Supply Layout Guidelines
      3. 9.1.3  Layout Guidelines for Internal Controller PLL Power
      4. 9.1.4  Layout Guideline for DLPC7530 Reference Clock
        1. 9.1.4.1 Recommended Crystal Oscillator Configuration
      5. 9.1.5  V-by-One Interface Layout Considerations
      6. 9.1.6  FPD-Link Interface Layout Considerations
      7. 9.1.7  USB Interface Layout Considerations
      8. 9.1.8  DMD Interface Layout Considerations
      9. 9.1.9  General Handling Guidelines for Unused CMOS-Type Pins
      10. 9.1.10 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
    2. 9.2 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Device Nomenclature
        1. 10.1.2.1 Device Markings
        2. 10.1.2.2 Package Data
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
      1. 10.6.1 Video Timing Parameter Definitions
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     92

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.3 Layout Guidelines for Internal Controller PLL Power

The following guidelines are recommended to achieve the desired Controller performance relative to the internal PLLs. The DLPC7530 contains multiple internal PLLs which have dedicated 1.15-V supply pins and 1.8-V supply pins which are listed below:

  • VDD115_PLLMA
  • VDD115_PLLMB
  • VAD115_PLLS
  • VAD115_HSSI0_PLL
  • VAD115_HSSI1_PLL

and

  • VAD18_PLLMA
  • VAD18_PLLMB

It is important that each of these 1.15-V and 1.8-V supply pins have individual high frequency filtering in the form of a ferrite bead and a 0.1-µF ceramic capacitor. Ensure that the impedance of the ferrite bead is much greater than that of the capacitor at frequencies above 10 MHz. Locate these components very close to the individual PLL power supply balls. Recommended values, topology, and layout examples are shown in Table 9-1, Figure 9-7 and Figure 9-8, and Figure 9-9 respectively.

Table 9-1 Recommended PLL and Crystal Power Supply Filter Components
COMPONENTPARAMETERRECOMMENDED VALUEUNIT
Shunt capacitorCapacitance0.1µF
Series ferriteImpedance at 100 MHz> 100Ω
DC Resistance< 0.40Ω
DLPC7530 1.15-V PLL Power Supply Filter Topology Figure 9-7 1.15-V PLL Power Supply Filter Topology
DLPC7530 1.8-V PLL Power Supply Filter Topology Figure 9-8 1.8-V PLL Power Supply Filter Topology
DLPC7530 PLL Power Supply Filter Layout ExamplesFigure 9-9 PLL Power Supply Filter Layout Examples

Since the PCB layout is critical to PLL performance, it is vital that the PLL power is treated like an analog signal. Additional design guidelines are as follows:

  • Place all filter components as close to possible to each of the PLL supply package pins.
  • Keep the leads of the high-frequency capacitors as short as possible, and as such, it is recommended that these capacitors be placed under the package on the opposite side of the board.
  • Use a surface mount capacitor that is of high quality, low ESR, and monolithic.
  • For each PLL power pin, a single trace (as wide as possible) must be used from the DLPC7530 to the capacitor and then through the series ferrite to the power source.