DLPS253 September   2024 DLPC8445

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     6
    2. 4.1  Initialization, Board Level Test, and Debug
    3. 4.2  V-by-One Interface Input Data and Control
    4. 4.3  FPD Link Port(s) Input Data and Control (Not Supported in DLPC8445)
    5. 4.4  DSI Input Data and Clock (Not Supported in DLPC8445)
    6. 4.5  DMD SubLVDS Interface
    7. 4.6  DMD Reset and Low Speed Interfaces
    8. 4.7  Flash Interface
    9. 4.8  Peripheral Interfaces
    10. 4.9  GPIO Peripheral Interface
    11. 4.10 Clock and PLL Support
    12. 4.11 Power and Ground
    13. 4.12 I/O Type Subscript Definition
    14. 4.13 Internal Pullup and Pulldown Characteristics
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2.     22
    3. 5.2  ESD Ratings
    4. 5.3  Recommended Operating Conditions
    5. 5.4  Thermal Information
    6. 5.5  Power Electrical Characteristics
    7. 5.6  Pin Electrical Characteristics
    8. 5.7  DMD SubLVDS Interface Electrical Characteristics
    9.     29
    10. 5.8  DMD Low Speed Interface Electrical Characteristics
    11.     31
    12. 5.9  V-by-One Interface Electrical Characteristics
    13. 5.10 USB Electrical Characteristics
    14.     34
    15. 5.11 System Oscillator Timing Requirements
    16.     36
    17. 5.12 Power Supply and Reset Timing Requirements
    18.     38
    19. 5.13 V-by-One Interface General Timing Requirements
    20.     40
    21. 5.14 Flash Interface Timing Requirements
    22.     42
    23. 5.15 Source Frame Timing Requirements
    24.     44
    25. 5.16 Synchronous Serial Port Interface Timing Requirements
    26.     46
    27. 5.17 I2C Interface Timing Requirements
    28. 5.18 Programmable Output Clock Timing Requirements
    29. 5.19 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    30.     50
    31. 5.20 DMD Low Speed Interface Timing Requirements
    32.     52
    33. 5.21 DMD SubLVDS Interface Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Sources
      2. 6.3.2 V-by-One Interface
      3. 6.3.3 DMD (SubLVDS) Interface
      4. 6.3.4 Serial Flash Interface
      5. 6.3.5 GPIO Supported Functionality
        1.       63
      6. 6.3.6 Debug Support
  8. 7 Power Supply Recommendations
    1. 7.1 System Power-Up and Power-Down Sequence
    2. 7.2 DMD Fast Park Control (PARKZ)
    3. 7.3 Power Supply Management
    4. 7.4 Hot Plug Usage
    5. 7.5 Power Supplies for Unused Input Source Interfaces
    6. 7.6 Power Supplies
      1. 7.6.1 Power Supplies DLPA3085
  9. 8 Layout
    1. 8.1 Layout Guidelines
      1. 8.1.1 Layout Guideline for DLPC8445 Reference Clock
        1. 8.1.1.1 Recommended Crystal Oscillator Configuration
      2. 8.1.2 V-by-One Interface Layout Considerations
      3. 8.1.3 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      4. 8.1.4 Power Supply Layout Guidelines
    2. 8.2 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Device Nomenclature
      1. 9.5.1 Device Markings
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
      1. 9.8.1 Video Timing Parameter Definitions
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • AMD|484
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1.1.1 Recommended Crystal Oscillator Configuration

Table 8-1 Recommended Crystal Configurations
PARAMETERCRYSTALUNIT
Crystal circuit configurationParallel resonant
Crystal typeFundamental (first harmonic)
Crystal nominal frequency40MHz
Crystal frequency tolerance (1)±100 (200 p-p max)PPM
Crystal equivalent series resistance (ESR)60 (Max)Ω
Crystal load capacitance20 (Max)pF
Crystal Shunt Load capacitance7 (Max)pF
Temperature range–40°C to +85°C°C
Drive level100 (Nominal)µW
CL1 external crystal load capacitorSee equation in (2)pF
CL2 external crystal load capacitorSee equation in (3)pF
PCB layoutA ground isolation ring around the crystal is recommended.
(1) Crystal frequency tolerance to include accuracy, temperature, aging, and trim sensitivity. These are typically specified separately and the sum of all required to meet this requirement.
(2) CL1 = 2 × (CL – Cstray_pll_refclk_i), where: Cstray_pll_refclk_i = Sum of the package and PCB stray capacitance at the crystal pin associated with the Controller pin REFCLKx_I. See Table 8-2.
(3) CL2 = 2 × (CL – Cstray_pll_refclk_o), where: Cstray_pll_refclk_o = Sum of the package and PCB stray capacitance at the crystal pin associated with the Controller pin REFCLKx_O. See Table 8-2.
Table 8-2 Crystal Pin Capacitance
PARAMETERMINNOMMAXUNIT
Cstray_pll_refclk_iSum of package and PCB stray capacitance at REFCLKA_I0.4pF
Cstray_pll_refclk_oSum of package and PCB stray capacitance at REFCLKA_O0.4pF

The crystal circuits in the DLPC8445 have dedicated power (VDDS18_OSC) pins, with the recommended filtering for each shown in Figure 8-2, and recommended values shown in DLPC8445 Recommended Crystal Parts.

DLPC8445 Crystal Power Supply FilteringFigure 8-2 Crystal Power Supply Filtering
Table 8-3 DLPC8445 Recommended Crystal Parts
MANUFACT-
URER		 PART NUMBER NOMINAL FREQUENCY FREQUENCY TOLERANCE,
FREQUENCY STABILITY,
AGING/YEAR		 ESR LOAD CAPACITANCE OPERATING TEMPERATURE DRIVE LEVEL
TXC 7M40070041 (1) 40MHz Freq Tolerance:
±20ppm		 30Ω max 12pF –40°C to +85°C 100µW
Freq Stability:
±20ppm
Aging/Year: ±3ppm
(1) This device requires an RS resistor with value = 0.