DLPS253 September   2024 DLPC8445

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
    1.     6
    2. 4.1  Initialization, Board Level Test, and Debug
    3. 4.2  V-by-One Interface Input Data and Control
    4. 4.3  FPD Link Port(s) Input Data and Control (Not Supported in DLPC8445)
    5. 4.4  DSI Input Data and Clock (Not Supported in DLPC8445)
    6. 4.5  DMD SubLVDS Interface
    7. 4.6  DMD Reset and Low Speed Interfaces
    8. 4.7  Flash Interface
    9. 4.8  Peripheral Interfaces
    10. 4.9  GPIO Peripheral Interface
    11. 4.10 Clock and PLL Support
    12. 4.11 Power and Ground
    13. 4.12 I/O Type Subscript Definition
    14. 4.13 Internal Pullup and Pulldown Characteristics
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2.     22
    3. 5.2  ESD Ratings
    4. 5.3  Recommended Operating Conditions
    5. 5.4  Thermal Information
    6. 5.5  Power Electrical Characteristics
    7. 5.6  Pin Electrical Characteristics
    8. 5.7  DMD SubLVDS Interface Electrical Characteristics
    9.     29
    10. 5.8  DMD Low Speed Interface Electrical Characteristics
    11.     31
    12. 5.9  V-by-One Interface Electrical Characteristics
    13. 5.10 USB Electrical Characteristics
    14.     34
    15. 5.11 System Oscillator Timing Requirements
    16.     36
    17. 5.12 Power Supply and Reset Timing Requirements
    18.     38
    19. 5.13 V-by-One Interface General Timing Requirements
    20.     40
    21. 5.14 Flash Interface Timing Requirements
    22.     42
    23. 5.15 Source Frame Timing Requirements
    24.     44
    25. 5.16 Synchronous Serial Port Interface Timing Requirements
    26.     46
    27. 5.17 I2C Interface Timing Requirements
    28. 5.18 Programmable Output Clock Timing Requirements
    29. 5.19 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    30.     50
    31. 5.20 DMD Low Speed Interface Timing Requirements
    32.     52
    33. 5.21 DMD SubLVDS Interface Timing Requirements
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Sources
      2. 6.3.2 V-by-One Interface
      3. 6.3.3 DMD (SubLVDS) Interface
      4. 6.3.4 Serial Flash Interface
      5. 6.3.5 GPIO Supported Functionality
        1.       63
      6. 6.3.6 Debug Support
  8. Power Supply Recommendations
    1. 7.1 System Power-Up and Power-Down Sequence
    2. 7.2 DMD Fast Park Control (PARKZ)
    3. 7.3 Power Supply Management
    4. 7.4 Hot Plug Usage
    5. 7.5 Power Supplies for Unused Input Source Interfaces
    6. 7.6 Power Supplies
      1. 7.6.1 Power Supplies DLPA3085
  9. Layout
    1. 8.1 Layout Guidelines
      1. 8.1.1 Layout Guideline for DLPC8445 Reference Clock
        1. 8.1.1.1 Recommended Crystal Oscillator Configuration
      2. 8.1.2 V-by-One Interface Layout Considerations
      3. 8.1.3 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      4. 8.1.4 Power Supply Layout Guidelines
    2. 8.2 Thermal Considerations
  10. Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Device Nomenclature
      1. 9.5.1 Device Markings
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
      1. 9.8.1 Video Timing Parameter Definitions
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Synchronous Serial Port Interface Timing Requirements

PARAMETERMINMAXUNIT
SSP0 Host
FCLKSSP*_CLK FrequencyBroadcast Write Transfers (1) (2)0.45775MHz
Full-Duplex SPI Transfers0.45750MHz
TCLKSSP*_CLK Clock PeriodBroadcast Write Transfers (1) (2)13.332188ns
Full-Duplex SPI Transfers20.002188ns
tHPWSSP*_CLK high/low pulse widthBroadcast Write Transfers (1) (2) 6.0ns
Full-Duplex SPI Transfers9.2ns
tLPWSSP*_CLK high/low pulse widthBroadcast Write Transfers (1) (2) 6.0ns
Full-Duplex SPI Transfers9.2ns
tSSSP*_DI Input Setup TimeBefore SSP*_CLK ↓ (Modes 0&3)  (2) 9.4ns
Before SSP*_CLK ↑ (Modes 1&2)9.4ns
tHSSP*_DI Input Hold TimeBefore SSP*_CLK ↓ (Modes 0&3) (2)0ns
Before SSP*_CLK ↑ (Modes 1&2)0ns
tDOUTSSP*_DO Output Delay (2)After SSP*_CLK ↓ (Modes 0&3)–2.52.5ns
After SSP*_CLK ↑ (Modes 1&2)–2.52.5ns
After SSP*_(B)CSZ ↓ (Modes 0&2)–2.52.5ns
After SSP*_(B)CSZ ↑ (Modes 1&3)–2.52.5ns
SSP1 Target
tCSZDSSP*_(B)CSZ* de-assertion (that is, high) time between SPI transfers (3) 13.33ns
tCSSSSP*_(B)CSZ* Input Setup Time (4) SSP*_(B)CSZ ↓ before SSP*_CLK ↑ (Modes 0&1)6.0ns
SSP*_(B)CSZ ↓ before SSP*_CLK ↓ (Modes 2*3)6.0ns
tCSHSSP*_(B)CSZ* Input Setup Time (4) SSP*_(B)CSZ ↑ after SSP*_CLK ↓ (Modes 0&1)6.0ns
SSP*_(B)CSZ ↑ after SSP*_CLK ↑ (Modes 2*3)6.0ns
tSSSP*_DI Input Setup Time Before SSP*_CLK↑ (Modes 0&3)2.5ns
Before SSP*_CLK↓ (Modes 1&2)2.5
tHSSP*_DI Input Hold Time Before SSP*_CLK↑ (Modes 0&3)2.5ns
Before SSP*_CLK↓ (Modes 1&2)2.5ns
tDOUTSSP*_DO Output Delay After SSP*_CLK↓ (Modes 0&3)08.0ns
After SSP*_CLK↑ (Modes 1&2)08.0ns
After SSP*_CSZ↓ (Modes 0&3)08.0ns
After SSP*_CSZ↑ (Modes 1&2)08.0ns
Broadcast Write transfers are half-duplex transfers in which the SSP host outputs SSP*_DO but does not receive any SSP*_DI input; hence, SSP*_DI input setup/hold timing checks are not applicable during Broadcast Write transfers.
Applicable controller pins for SSP0 & SSP1 SPI interfaces are shown in Peripheral Interfaces.
At least 1 SSP*_CLK period
At least 0.5 SSP*_CLK period