SNLS610B
April 2021 – November 2021
DP83561-SP
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
5.1
Pin States
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.6.1
Timing Requirement Diagrams
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.1.1
Engineering Model (Parts With /EM Suffix)
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Copper Ethernet
7.3.1.1
1000BASE-T
7.3.1.2
100BASE-TX
7.3.1.3
10BASE-Te
7.3.2
MAC Interfaces
7.3.2.1
Reduced GMII (RGMII)
7.3.2.1.1
RGMII-TX Requirements
7.3.2.1.2
RGMII-RX Requirements
7.3.2.1.3
1000-Mbps Mode Operation
7.3.2.1.4
1000-Mbps Mode Timing
7.3.2.1.5
10- and 100-Mbps Mode
7.3.2.2
Media Independent Interface (MII)
7.3.3
Auto-Negotiation
7.3.3.1
Speed and Duplex Selection - Priority Resolution
7.3.3.2
Master and Slave Resolution
7.3.3.3
Pause and Asymmetrical Pause Resolution
7.3.3.4
Next Page Support
7.3.3.5
Parallel Detection
7.3.3.6
Restart Auto-Negotiation
7.3.3.7
Enabling Auto-Negotiation Through Software
7.3.3.8
Auto-Negotiation Complete Time
7.3.3.9
Auto-MDIX Resolution
7.3.4
Speed Optimization
7.3.5
Radiation Performance
7.3.5.1
Total Ionizing Dose (TID)
7.3.5.2
Single-Event Effects (SEE)
7.3.5.3
Single Event Functional Interrupt (SEFI) Monitor Suite
7.3.5.3.1
PCS State Machine Monitors
7.3.5.3.2
Configuration Register Monitors
7.3.5.3.3
Temperature Monitor
7.3.5.3.4
PLL Lock Monitor
7.3.6
WoL (Wake-on-LAN) Packet Detection
7.3.6.1
Magic Packet Structure
7.3.6.2
Magic Packet Example
7.3.6.3
Wake-on-LAN Configuration and Status
7.3.7
Start of Frame Detect for IEEE 1588 Time Stamp
7.3.7.1
SFD Latency Variation and Determinism
7.3.7.1.1
1000M SFD Variation in Master Mode
7.3.7.1.2
1000M SFD Variation in Slave Mode
7.3.7.1.3
100M SFD Variation
7.3.8
Cable Diagnostics
7.3.8.1
TDR
7.3.8.2
Fast Link Drop
7.3.8.3
Fast Link Detect
7.3.8.4
Energy Detect
7.3.8.5
IEEE 802.3 Test Modes
7.3.8.6
Jumbo Frames
7.3.9
Clock Output
7.4
Device Functional Modes
7.4.1
Mirror Mode
7.4.2
Loopback Mode
7.4.2.1
Near-End Loopback
7.4.2.1.1
MII Loopback
7.4.2.1.2
PCS Loopback
7.4.2.1.3
Digital Loopback
7.4.2.1.4
Analog Loopback
7.4.2.1.5
External Loopback
7.4.2.1.6
Far-End (Reverse) Loopback
7.4.2.2
Loopback Availability Exception
7.4.3
Power-Saving Modes
7.4.3.1
IEEE Power Down
7.4.3.2
Deep Power-Down Mode
7.4.3.3
Active Sleep
7.4.3.4
Passive Sleep
7.5
Programming
7.5.1
Serial Management Interface
7.5.1.1
Extended Address Space Access
7.5.1.1.1
Write Address Operation
7.5.1.1.2
Read Address Operation
7.5.1.1.3
Write (No Post Increment) Operation
7.5.1.1.4
Read (No Post Increment) Operation
7.5.1.1.5
Write (Post Increment) Operation
7.5.1.1.6
Read (Post Increment) Operation
7.5.1.1.7
Example of Read Operation Using Indirect Register Access
7.5.1.1.8
Example of Write Operation Using Indirect Register Access
7.5.2
Interrupt
7.5.3
BIST Configuration
7.5.4
Strap Configuration
7.5.5
LED Configuration
7.5.6
LED Operation From 1.8-V I/O VDD Supply
7.5.7
Reset Operation
7.5.7.1
Hardware Reset
7.5.7.2
IEEE Software Reset
7.5.7.3
Global Software Reset
7.5.7.4
Global Software Restart
7.5.7.5
PCS Restart
7.6
Register Maps
7.6.1
DP83561SP Registers
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Clock Input
8.2.2.1.1
Crystal Recommendations
8.2.2.1.2
External Clock Source Recommendations
8.2.2.2
MAC Interface
8.2.2.2.1
RGMII Layout Guidelines
8.2.2.2.2
MII Layout Guidelines
8.2.2.3
Media Dependent Interface (MDI)
8.2.2.3.1
MDI Layout Guidelines
8.2.2.4
Magnetics Requirements
8.2.2.4.1
Magnetics Connection
9
Power Supply Recommendations
9.1
Two-Supply Configuration
9.2
Three-Supply Configuration
10
Layout
10.1
Layout Guidelines
10.1.1
Signal Traces
10.1.2
Return Path
10.1.3
Transformer Layout
10.1.4
Metal Pour
10.1.5
PCB Layer Stacking
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
HBE|64
MCCF006A
Thermal pad, mechanical data (Package|Pins)
Orderable Information
snls610b_oa
snls610b_pm
6.7
Typical Characteristics
Figure 6-8
1000Base-T Test Mode 2 Signal
Figure 6-10
10Base-Te Link Pulse
Figure 6-9
100Base-TX Signal
Figure 6-11
Auto-Negotiation FLP