SNLS610B April   2021  – November 2021 DP83561-SP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Pin States
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
      1. 6.6.1 Timing Requirement Diagrams
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Engineering Model (Parts With /EM Suffix)
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Copper Ethernet
        1. 7.3.1.1 1000BASE-T
        2. 7.3.1.2 100BASE-TX
        3. 7.3.1.3 10BASE-Te
      2. 7.3.2 MAC Interfaces
        1. 7.3.2.1 Reduced GMII (RGMII)
          1. 7.3.2.1.1 RGMII-TX Requirements
          2. 7.3.2.1.2 RGMII-RX Requirements
          3. 7.3.2.1.3 1000-Mbps Mode Operation
          4. 7.3.2.1.4 1000-Mbps Mode Timing
          5. 7.3.2.1.5 10- and 100-Mbps Mode
        2. 7.3.2.2 Media Independent Interface (MII)
      3. 7.3.3 Auto-Negotiation
        1. 7.3.3.1 Speed and Duplex Selection - Priority Resolution
        2. 7.3.3.2 Master and Slave Resolution
        3. 7.3.3.3 Pause and Asymmetrical Pause Resolution
        4. 7.3.3.4 Next Page Support
        5. 7.3.3.5 Parallel Detection
        6. 7.3.3.6 Restart Auto-Negotiation
        7. 7.3.3.7 Enabling Auto-Negotiation Through Software
        8. 7.3.3.8 Auto-Negotiation Complete Time
        9. 7.3.3.9 Auto-MDIX Resolution
      4. 7.3.4 Speed Optimization
      5. 7.3.5 Radiation Performance
        1. 7.3.5.1 Total Ionizing Dose (TID)
        2. 7.3.5.2 Single-Event Effects (SEE)
        3. 7.3.5.3 Single Event Functional Interrupt (SEFI) Monitor Suite
          1. 7.3.5.3.1 PCS State Machine Monitors
          2. 7.3.5.3.2 Configuration Register Monitors
          3. 7.3.5.3.3 Temperature Monitor
          4. 7.3.5.3.4 PLL Lock Monitor
      6. 7.3.6 WoL (Wake-on-LAN) Packet Detection
        1. 7.3.6.1 Magic Packet Structure
        2. 7.3.6.2 Magic Packet Example
        3. 7.3.6.3 Wake-on-LAN Configuration and Status
      7. 7.3.7 Start of Frame Detect for IEEE 1588 Time Stamp
        1. 7.3.7.1 SFD Latency Variation and Determinism
          1. 7.3.7.1.1 1000M SFD Variation in Master Mode
          2. 7.3.7.1.2 1000M SFD Variation in Slave Mode
          3. 7.3.7.1.3 100M SFD Variation
      8. 7.3.8 Cable Diagnostics
        1. 7.3.8.1 TDR
        2. 7.3.8.2 Fast Link Drop
        3. 7.3.8.3 Fast Link Detect
        4. 7.3.8.4 Energy Detect
        5. 7.3.8.5 IEEE 802.3 Test Modes
        6. 7.3.8.6 Jumbo Frames
      9. 7.3.9 Clock Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mirror Mode
      2. 7.4.2 Loopback Mode
        1. 7.4.2.1 Near-End Loopback
          1. 7.4.2.1.1 MII Loopback
          2. 7.4.2.1.2 PCS Loopback
          3. 7.4.2.1.3 Digital Loopback
          4. 7.4.2.1.4 Analog Loopback
          5. 7.4.2.1.5 External Loopback
          6. 7.4.2.1.6 Far-End (Reverse) Loopback
        2. 7.4.2.2 Loopback Availability Exception
      3. 7.4.3 Power-Saving Modes
        1. 7.4.3.1 IEEE Power Down
        2. 7.4.3.2 Deep Power-Down Mode
        3. 7.4.3.3 Active Sleep
        4. 7.4.3.4 Passive Sleep
    5. 7.5 Programming
      1. 7.5.1 Serial Management Interface
        1. 7.5.1.1 Extended Address Space Access
          1. 7.5.1.1.1 Write Address Operation
          2. 7.5.1.1.2 Read Address Operation
          3. 7.5.1.1.3 Write (No Post Increment) Operation
          4. 7.5.1.1.4 Read (No Post Increment) Operation
          5. 7.5.1.1.5 Write (Post Increment) Operation
          6. 7.5.1.1.6 Read (Post Increment) Operation
          7. 7.5.1.1.7 Example of Read Operation Using Indirect Register Access
          8. 7.5.1.1.8 Example of Write Operation Using Indirect Register Access
      2. 7.5.2 Interrupt
      3. 7.5.3 BIST Configuration
      4. 7.5.4 Strap Configuration
      5. 7.5.5 LED Configuration
      6. 7.5.6 LED Operation From 1.8-V I/O VDD Supply
      7. 7.5.7 Reset Operation
        1. 7.5.7.1 Hardware Reset
        2. 7.5.7.2 IEEE Software Reset
        3. 7.5.7.3 Global Software Reset
        4. 7.5.7.4 Global Software Restart
        5. 7.5.7.5 PCS Restart
    6. 7.6 Register Maps
      1. 7.6.1 DP83561SP Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Clock Input
          1. 8.2.2.1.1 Crystal Recommendations
          2. 8.2.2.1.2 External Clock Source Recommendations
        2. 8.2.2.2 MAC Interface
          1. 8.2.2.2.1 RGMII Layout Guidelines
          2. 8.2.2.2.2 MII Layout Guidelines
        3. 8.2.2.3 Media Dependent Interface (MDI)
          1. 8.2.2.3.1 MDI Layout Guidelines
        4. 8.2.2.4 Magnetics Requirements
          1. 8.2.2.4.1 Magnetics Connection
  9. 9 Power Supply Recommendations
    1. 9.1 Two-Supply Configuration
    2. 9.2 Three-Supply Configuration
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Signal Traces
      2. 10.1.2 Return Path
      3. 10.1.3 Transformer Layout
      4. 10.1.4 Metal Pour
      5. 10.1.5 PCB Layer Stacking
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated