SNLS638A December 2018 – August 2019 DP83825I
PRODUCTION DATA.
THERMAL METRIC(1) | UNIT | ||
---|---|---|---|
RθJA | Junction-to-ambient thermal resistance | 53.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 49.6 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 28.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 2.3 | °C/W |
YJT | Junction-to-top characterization parameter | 28.5 | °C/W |
YJB | Junction-to-board characterization parameter | 14.9 | °C/W |