SNLS484H February 2015 – June 2024 DP83867CR , DP83867IR
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | DP83867IR | DP83867IR, DP83867CR | UNIT | |
---|---|---|---|---|
PAP (HTQFP) | RGZ (QFN) | |||
64 PINS | 48 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 30.9 | 30.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 13.6 | 18.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.9 | 1.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 15.6 | 7.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.4 | 0.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 15.5 | 7.5 | °C/W |