SNLS504E October 2015 – May 2024 DP83867CS , DP83867E , DP83867IS
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | DP83867xS, DP83867E | UNIT | ||
---|---|---|---|---|
RGZ (VQFN) | ||||
48 PINS | ||||
RθJA | Junction-to-ambient thermal resistance | 30.8 | °C/W | |
RθJC(top) | Junction-to-case (top) thermal resistance | 18.7 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.4 | °C/W | |
RθJB | Junction-to-board thermal resistance | 7.5 | °C/W | |
ψJT | Junction-to-top characterization parameter | 0.3 | °C/W | |
ψJB | Junction-to-board characterization parameter | 7.5 | °C/W |