SNLS614C September   2018  – April 2024 DP83869HM

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  WoL (Wake-on-LAN) Packet Detection
        1. 7.3.1.1 Magic Packet Structure
        2. 7.3.1.2 Wake-on-LAN Configuration and Status
      2. 7.3.2  Start of Frame Detect for IEEE 1588 Time Stamp
        1. 7.3.2.1 SFD Latency Variation and Determinism
          1. 7.3.2.1.1 1000Mb SFD Variation in Master Mode
          2. 7.3.2.1.2 1000Mb SFD Variation in Slave Mode
          3. 7.3.2.1.3 100-Mb SFD Variation
      3. 7.3.3  Clock Output
      4. 7.3.4  Loopback Mode
        1. 7.3.4.1 Near-End Loopback
          1. 7.3.4.1.1 MII Loopback
          2. 7.3.4.1.2 PCS Loopback
          3. 7.3.4.1.3 Digital Loopback
          4. 7.3.4.1.4 Analog Loopback
          5. 7.3.4.1.5 External Loopback
          6. 7.3.4.1.6 Far-End (Reverse) Loopback
        2.       37
      5. 7.3.5  BIST Configuration
      6. 7.3.6  Interrupt
      7. 7.3.7  Power-Saving Modes
        1. 7.3.7.1 IEEE Power Down
        2. 7.3.7.2 Active Sleep
        3. 7.3.7.3 Passive Sleep
      8. 7.3.8  Mirror Mode
      9. 7.3.9  Speed Optimization
      10. 7.3.10 Cable Diagnostics
        1. 7.3.10.1 TDR
      11. 7.3.11 Fast Link Drop
      12. 7.3.12 Jumbo Frames
    4. 7.4 Device Functional Modes
      1. 7.4.1  Copper Ethernet
        1. 7.4.1.1 1000BASE-T
        2. 7.4.1.2 100BASE-TX
        3. 7.4.1.3 10BASE-Te
      2. 7.4.2  Fiber Ethernet
        1. 7.4.2.1 1000BASE-X
        2. 7.4.2.2 100BASE-FX
      3. 7.4.3  Serial GMII (SGMII)
      4. 7.4.4  Reduced GMII (RGMII)
        1. 7.4.4.1 1000Mbps Mode Operation
        2. 7.4.4.2 1000Mbps Mode Timing
        3. 7.4.4.3 10 and 100Mbps Mode
      5. 7.4.5  Media Independent Interface (MII)
      6. 7.4.6  Bridge Modes
        1. 7.4.6.1 RGMII-to-SGMII Mode
        2. 7.4.6.2 SGMII-to-RGMII Mode
        3.       67
      7. 7.4.7  Media Convertor Mode
      8. 7.4.8  Register Configuration for Operational Modes
        1. 7.4.8.1 RGMII-to-Copper Ethernet Mode
        2. 7.4.8.2 RGMII-to-1000Base-X Mode
        3. 7.4.8.3 RGMII-to-100Base-FX Mode
        4. 7.4.8.4 RGMII-to-SGMII Bridge Mode
        5. 7.4.8.5 1000M Media Convertor Mode
        6. 7.4.8.6 100M Media Convertor Mode
        7. 7.4.8.7 SGMII-to-Copper Ethernet Mode
      9. 7.4.9  Serial Management Interface
        1. 7.4.9.1 Extended Register Space Access
          1. 7.4.9.1.1 Read (No Post Increment) Operation
          2. 7.4.9.1.2 Write (No Post Increment) Operation
      10. 7.4.10 Auto-Negotiation
        1. 7.4.10.1 Speed and Duplex Selection - Priority Resolution
        2. 7.4.10.2 Master and Slave Resolution
        3. 7.4.10.3 Pause and Asymmetrical Pause Resolution
        4. 7.4.10.4 Next Page Support
        5. 7.4.10.5 Parallel Detection
        6. 7.4.10.6 Restart Auto-Negotiation
        7. 7.4.10.7 Enabling Auto-Negotiation Through Software
        8. 7.4.10.8 Auto-Negotiation Complete Time
        9. 7.4.10.9 Auto-MDIX Resolution
    5. 7.5 Programming
      1. 7.5.1 Strap Configuration
        1. 7.5.1.1 Straps for PHY Address
        2. 7.5.1.2 Strap for DP83869HM Functional Mode Selection
        3. 7.5.1.3 LED Default Configuration Based on Device Mode
        4. 7.5.1.4 Straps for RGMII/SGMII to Copper
        5. 7.5.1.5 Straps for RGMII to 1000Base-X
        6. 7.5.1.6 Straps for RGMII to 100Base-FX
        7. 7.5.1.7 Straps for Bridge Mode (SGMII-RGMII)
        8. 7.5.1.8 Straps for 100M Media Convertor
        9. 7.5.1.9 Straps for 1000M Media Convertor
      2. 7.5.2 LED Configuration
      3. 7.5.3 Reset Operation
        1. 7.5.3.1 Hardware Reset
        2. 7.5.3.2 IEEE Software Reset
        3. 7.5.3.3 Global Software Reset
        4. 7.5.3.4 Global Software Restart
    6. 7.6 Register Maps
      1. 7.6.1 DP83869 Registers
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Copper Ethernet Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Clock Input
            1. 8.2.1.2.1.1 Crystal Recommendations
            2. 8.2.1.2.1.2 External Clock Source Recommendation
          2. 8.2.1.2.2 Magnetics Requirements
            1. 8.2.1.2.2.1 Magnetics Connection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Fiber Ethernet Typical Ethernet
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Transceiver Connections
        3. 8.2.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Two-Supply Configuration
      2. 8.3.2 Three-Supply Configuration
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Signal Traces
          1. 8.4.1.1.1 MAC Interface Layout Guidelines
            1. 8.4.1.1.1.1 SGMII Layout Guidelines
            2. 8.4.1.1.1.2 RGMII Layout Guidelines
          2. 8.4.1.1.2 MDI Layout Guidelines
        2. 8.4.1.2 Return Path
        3. 8.4.1.3 Transformer Layout
        4. 8.4.1.4 Metal Pour
        5. 8.4.1.5 PCB Layer Stacking
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Timing Requirements

PARAMETER MIN NOM MAX UNIT
POWER-UP TIMING (2, 3 supply mode)
T1 Last Supply power up To Reset Release: External or via R-C network 200 ms
T2 Powerup to SMI ready: Post power-up stabilization time prior to MDC preamble for register access 200 ms
T3 Powerup to Strap latchin: Hardware configuration pins transition to output drivers 200 ms
RESET TIMING
T1 Reset to SMI ready: Post reset stabilization time prior to MDC preamble for register access 30 us
T3 RESET PULSE Width: Miminum Reset pulse width to be able to reset 720 ns
T4 Reset to FLP 1750 ms
T4 Reset to 100M signaling (strapped mode) 194 us
T4 Reset to 1G signaling (strapped mode) 194 us
T4 Reset to Fiber 100M signaling 248 us
T4 Reset to Fiber 1G ANEG signaling 235 us
T4 Reset to Fiber 1G Forced signaling 235 us
T4 Reset to MAC clock (Cu mode) 195 us
T4 Reset to MAC clock (Fi mode) 248 us
T4 Reset to MAC clock (S2R) 248 us
T4 Reset to MAC clock (R2S) 248 us
COPPER LINK TIMING
T1 Loss of Idles to Link LED low in Fast link down mode (100M) 4.3 10 us
Loss of Idles to Link LED low in Fast link down mode (1000M) 7 10 us
MII TIMING (100M)
T1 TX_CLK High / Low Time 16 20 24 ns
T2 TX_D[3:0], TX_ER, TX_EN Setup to TX_CLK 10 ns
T3 TX_D[3:0], TX_ER, TX_EN Hold from TX_CLK 0 ns
T1 RX_CLK High / Low Time 16 20 24 ns
T2 RX_D[3:0], RX_ER, RX_DV Delay from RX_CLK rising 10 30 ns
RGMII OUTPUT TIMING (1G)
TskewT Data to Clock Output Skew (Non-Delay Mode) -600 600 ps
TskewT(Delay) Data to Clock Output Setup (Delay Mode) 1.4 2.6 ns
TsetupT Data to Clock Output Setup ( Delay Mode) 1.2 ns
TholdT Data to Clock Output Hold ( Delay Mode) 1.2 ns
Tcyc Clock Cycle Duration 7.2 8 8.8 ns
Duty Cycle 45 50 55 %
Rise / Fall Time ( 20% to 80%) 0.75 ns
RGMII INPUT TIMING (1G)
TsetupR TX data to clock input setup (Non-Delay Mode) 1 ns
TholdR TX clock to data input hold (Non-Delay Mode) 1 ns
TX data to clock input setup (Delay Mode, 2ns delay) -1 ns
TX clock to data input hold (Delay Mode, 2ns delay) 3 ns
SMI TIMING
T1 MDC to MDIO (Output) Delay Time 0 10 ns
T2 MDIO (Input) to MDC Setup Time 10 ns
T3 MDIO (Input) to MDC Hold Time 10 ns
T4 MDC Frequency 2.5 25 MHz
OUTPUT CLOCK TIMING (25MHz clockout)
Frequency (PPM) -100 100 -
Duty Cycle 40 60 %
Rise Time 5000 ps
Fall Time 5000 ps
Frequency 25 MHz
Jitter (Long Term) 375 ps
OUTPUT CLOCK TIMING (SyncE 125/5 MHz recovered clock)
Frequency (PPM) -100 100 ppm
Duty Cycle 40 60 %
Rise time 2500 ps
 Fall Time 2500 ps
Jitter (Long Term) 1000 ps
25MHz INPUT CLOCK tolerance
Frequency Tolerance -100 +100 ppm
Rise / Fall Time (10%-90%) 8 ns
Jitter Tolerance (Accumulated : TIE over 100K cycles) 75 ps
Duty Cycle 40 60 %
TRANSMIT LATENCY TIMING
Copper RGMII to Cu (100M): Rising edge TX_CLK with assertion TX_CTRL to SSD symbol on MDI 169 ns
Copper RGMII to Cu (1G): Roundtrip Latency (Transmit + Receive) 384 ns
RECEIVE LATENCY TIMING
Copper Cu to RGMII (100M): SSD symbol on MDI to a) Rising edge of RX_DV  with assertion of RX_CTRL b) Rising edge of RX_DV  with assertion of RX_Dx 192 ns