SNLS676 May   2022 DP83TC813R-Q1 , DP83TC813S-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Diagnostic Tool Kit
        1. 8.3.1.1 Signal Quality Indicator
        2. 8.3.1.2 Electrostatic Discharge Sensing
        3. 8.3.1.3 Time Domain Reflectometry
        4. 8.3.1.4 Voltage Sensing
        5. 8.3.1.5 BIST and Loopback Modes
          1. 8.3.1.5.1 Data Generator and Checker
          2. 8.3.1.5.2 xMII Loopback
          3. 8.3.1.5.3 PCS Loopback
          4. 8.3.1.5.4 Digital Loopback
          5. 8.3.1.5.5 Analog Loopback
          6. 8.3.1.5.6 Reverse Loopback
      2. 8.3.2 Compliance Test Modes
        1. 8.3.2.1 Test Mode 1
        2. 8.3.2.2 Test Mode 2
        3. 8.3.2.3 Test Mode 4
        4. 8.3.2.4 Test Mode 5
    4. 8.4 Device Functional Modes
      1. 8.4.1  Power Down
      2. 8.4.2  Reset
      3. 8.4.3  Standby
      4. 8.4.4  Normal
      5. 8.4.5  Sleep Ack
      6. 8.4.6  Sleep Request
      7. 8.4.7  Sleep Fail
      8. 8.4.8  Sleep
      9. 8.4.9  Wake-Up
      10. 8.4.10 TC10 System Example
      11. 8.4.11 Media Dependent Interface
        1. 8.4.11.1 100BASE-T1 Master and 100BASE-T1 Slave Configuration
        2. 8.4.11.2 Auto-Polarity Detection and Correction
        3. 8.4.11.3 Jabber Detection
        4. 8.4.11.4 Interleave Detection
      12. 8.4.12 MAC Interfaces
        1. 8.4.12.1 Media Independent Interface
        2. 8.4.12.2 Reduced Media Independent Interface
        3. 8.4.12.3 Reduced Gigabit Media Independent Interface
        4. 8.4.12.4 Serial Gigabit Media Independent Interface
      13. 8.4.13 Serial Management Interface
      14. 8.4.14 Direct Register Access
      15. 8.4.15 Extended Register Space Access
      16. 8.4.16 Write Address Operation
        1. 8.4.16.1 MMD1 - Write Address Operation
      17. 8.4.17 Read Address Operation
        1. 8.4.17.1 MMD1 - Read Address Operation
      18. 8.4.18 Write Operation (No Post Increment)
        1. 8.4.18.1 MMD1 - Write Operation (No Post Increment)
      19. 8.4.19 Read Operation (No Post Increment)
        1. 8.4.19.1 MMD1 - Read Operation (No Post Increment)
      20. 8.4.20 Write Operation (Post Increment)
        1. 8.4.20.1 MMD1 - Write Operation (Post Increment)
      21. 8.4.21 Read Operation (Post Increment)
        1. 8.4.21.1 MMD1 - Read Operation (Post Increment)
    5. 8.5 Programming
      1. 8.5.1 Strap Configuration
      2. 8.5.2 LED Configuration
      3. 8.5.3 PHY Address Configuration
    6. 8.6 Register Maps
      1. 8.6.1 Register Access Summary
      2. 8.6.2 DP83TC813 Registers
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Physical Medium Attachment
          1. 9.2.1.1.1 Common-Mode Choke Recommendations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Signal Traces
      2. 11.1.2 Return Path
      3. 11.1.3 Metal Pour
      4. 11.1.4 PCB Layer Stacking
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

Figure 6-1 DP83TC813S-Q1 RHF Package
28-Pin VQFN
Top View
Figure 6-2 DP83TC813R-Q1 RHF Package
28-Pin VQFN
Top View
Table 6-1 Pin Functions
PIN STATE1 DESCRIPTION
NAME2 NO.
MAC INTERFACE

RX_D3
RX_M

24 S, PD, O

Receive Data: Symbols received on the cable are decoded and transmitted out of these pins synchronous to the rising edge of RX_CLK. They contain valid data when RX_DV is asserted. A data nibble, RX_D[3:0], is transmitted in MII and RGMII modes. 2 bits; RX_D[1:0], are transmitted in RMII mode. RX_D[3:2] are not used when in RMII mode.

If the PHY is bootstrapped to RMII Master mode, a 50-MHz clock reference is automatically outputted on RX_D3. This clock must be fed to the MAC.

RX_M / RX_P: Differential SGMII Data Output. These pins transmit data from the PHY to the MAC.

RX_D2
RX_P

25

RX_D1

26

RX_D0

27
RX_CLK 28 S, PD, O

Receive Clock: In MII and RGMII modes, the receive clock provides a 25-MHz reference clock.

Unused in RMII and SGMII modes

RX_ER 21 S, PD, O

Receive Error: In MII and RMII modes, this pin indicates a receive error symbol has been detected within a received packet. In MII mode, RX_ER is asserted high synchronously to the rising edge of RX_CLK. In RMII mode, RX_ER is asserted high synchronously to the rising edge of the reference clock. This pin is not required to be used by the MAC in MII or RMII because the PHY will automatically corrupt data on a receive error.

Unused in RGMII and SGMII modes

RX_DV
CRS_DV
RX_CTRL
22 S, PD, O

Receive Data Valid: This pin indicates when valid data is presented on RX_D[3:0] for MII mode.

Carrier Sense Data Valid: This pin combines carrier sense and data valid into an asynchronous signal. When CRS_DV is asserted, data is presented on RX_D[1:0] in RMII mode.

RGMII Receive Control: Receive control combines receive data valid indication and receive error indication into a single signal. RX_DV is presented on the rising edge of RX_CLK and RX_ER is presented on the falling edge of RX_CLK.

Unused in SGMII mode

TX_CLK 1 PD, I, O

Transmit Clock: In MII mode, the transmit clock is a 25-MHz output and has constant phase referenced to the reference clock. In RGMII mode, this clock is sourced from the MAC layer to the PHY. A 25-MHz clock must be provided (not required to have constant phase to the reference clock unless synchronous RGMII is enabled).

Unused in RMII and SGMII modes

TX_EN
TX_CTRL
2 PD, I

Transmit Enable: In MII mode, transmit enable is presented prior to the rising edge of the transmit clock. TX_EN indicates the presence of valid data inputs on TX_D[3:0]. In RMII mode, transmit enable is presented prior to the rising edge of the reference clock. TX_EN indicates the presence of valid data inputs on TX_D[1:0].

RGMII Transmit Control: Transmit control combines transmit enable and transmit error indication into a single signal. TX_EN is presented prior to the rising edge of TX_CLK; TX_ER is presented prior to the falling edge of TX_CLK.

Unused in SGMII mode

TX_D3 3 PD, I

Transmit Data: In MII and RGMII modes, the transmit data nibble, TX_D[3:0], is received from the MAC prior to the rising edge of TX_CLK. In RMII mode, TX_D[1:0] is received from the MAC prior to the rising edge of the reference clock. TX_D[3:2] are not used in RMII mode.

TX_M / TX_P: Differential SGMII Data Input. These pins receive data that is transmitted from the MAC to the PHY.

TX_D2 4

TX_D1
TX_P

5

TX_D0
TX_M

6
SERIAL MANAGEMENT INTERFACE
MDC 9 I

Management Data Clock: Synchronous clock to the MDIO serial management input and output data. This clock may be asynchronous to the MAC transmit and receive clocks.

MDIO 8 OD, IO

Management Data Input/Output: Bidirectional management data signal that may be sourced by the management station or the PHY. This pin requires a pullup resistor. In systems with multiple PHYs using same MDIO-MDC bus, a single pull-up resistor must be used on MDIO line.

Recommended to use a resistor between 2.2 kΩ and 9 kΩ.

CONTROL INTERFACE
INT 10 PU, OD, IO

Interrupt: Active-LOW output, which will be asserted LOW when an interrupt condition occurs. This pin has a weak internal pullup. Register access is necessary to enable various interrupt triggers. Once an interrupt event flag is set, register access is required to clear the interrupt event. This pin can be configured as an Active-HIGH output using register 0x0011.

This pin can also operate as Power-Down control where asserting this pin low would put the PHY in power down mode and asserting high would put the PHY in normal mode. This feature can also be enabled via register 0x0011.

RESET 11 PU, I

Reset: Active-LOW input, which initializes or reinitializes the PHY. Asserting this pin LOW for at least 1 μs will force a reset process to occur. All internal registers will reinitialize to their default states as specified for each bit in the Register Maps section. All bootstrap pins are resampled upon deassertion of reset.

WAKE 16 PD, I/O

WAKE: Active-HIGH input, which wakes the PHY from TC-10 SLEEP. Asserting this pin HIGH at power-up will prevent the PHY from going to SLEEP. External 10kΩ pull down resistor can be used when implementing TC-10 circuit to prevent accidental wake-up. This pin can be directly tied to VSLEEP to wake the device.

INH 17 O, OD

INH: Active-HIGH output. This pin will be Hi-Z when the PHY is in TC-10 SLEEP. This pin is HIGH for all other PHY states. External 2kΩ - 10kΩ pull down resistor must be used when implementing TC-10 circuit. If multiple devices are sharing INH pin, then a single pull down resistor must be used.

CLOCK INTERFACE
XI 13 I

Reference Clock Input (RMII): Reference clock 50-MHz CMOS-level oscillator in RMII Slave mode. Reference clock 25-MHz crystal or oscillator in RMII Master mode.

Reference Clock Input (Other MAC Interfaces): Reference clock 25-MHz crystal or oscillator input. The device supports either an external crystal resonator connected across pins XI and XO, or an external CMOS-level oscillator connected to pin XI only and XO left floating.

XO 12 O

Reference Clock Output: XO pin is used for crystal only. This pin must be left floating when a CMOS-level oscillator is connected to XI.

LED/GPIO INTERFACE
CLKOUT / LED_1 14 IO

Clock Output: 25-MHz reference clock. This pin can be used as LED or GPIO via register configuration.

MEDIUM DEPENDENT INTERFACE
TRD_M 20 IO

Differential Transmit and Receive: Bidirectional differential signaling configured for 100BASE-T1 operation, IEEE 802.3bw compliant.

TRD_P 19
POWER CONNECTIONS
VDDA 18 SUPPLY

Core Supply: 3.3 V

Recommend using 0.47-µF and 0.01-µF ceramic decoupling capacitors; optional ferrite bead can also be used.

VDDIO 7 SUPPLY

IO Supply: 1.8 V, 2.5 V, or 3.3 V

Recommend using ferrite bead 0.47-µF, and 0.01-µF ceramic decoupling capacitors.

VDDMAC 23 SUPPLY

Optional MAC Interface Supply: 1.8 V, 2.5 V, or 3.3 V

Optional separate supply for MAC interface pins. This pin supplies power to the MAC interface pins and can be kept at a different voltage level as compared to other IO pins. Recommend using 0.47-µF, and 0.01-µF ceramic decoupling capacitors; optional ferrite bead. When separate VDDMAC is not required in the system then it must be connected to VDDIO. When connecting to VDDIO, 0.47-µF can be removed.

VSLEEP 15 SUPPLY

VSLEEP Supply: 3.3 V

Recommend using 0.1-µF ceramic decoupling capacitors.

GROUND DAP GROUND

Ground: This must always be connected to power ground.

  1. Pin Type:
    I = Input
    O = Output
    IO = Input/Output
    OD = Open Drain
    PD = Internal pulldown
    PU = Internal pullup
    S = Bootstrap configuration pin (all configuration pins have weak internal pullups or pulldowns)
  2. When pins are unused, follow the recommended connection requirements provided in the table above. If pins do not have required termination, they may be left floating.
Table 6-2 Pin Domain
PIN NO PIN NAME VOLTAGE DOMAIN
9 MDC VDDIO
10 INT_N VDDIO
11 RESET_N VDDIO
12 XO VDDIO
13 XI VDDIO
14 LED_1/GPIO_1 VDDIO
16 WAKE VSLEEP
17 INH VSLEEP
19 TRD_P VDDA
20 TRD_M VDDA
21 RX_ER VDDMAC
22 RX_DV/CRS_DV/RX_CTRL VDDMAC
24 RX_D3/RX_M VDDMAC
25 RX_D2/RX_P VDDMAC
26 RX_D1 VDDMAC
27 RX_D0 VDDMAC
28 RX_CLK VDDMAC
1 TX_CLK VDDMAC
2 TX_EN/TX_CTRL VDDMAC
3 TX_D3 VDDMAC
4 TX_D2 VDDMAC
5 TX_D1/TX_P VDDMAC
6 TX_D0/TX_M VDDMAC
8 MDIO VDDIO
Table 6-3 Pin States - POWER-UP / RESET
PIN NO PIN
NAME
POWER-UP / RESET
PIN STATE (1) PULL TYPE PULL VALUE
(kΩ)
9 MDC I none none
10 INT I PU 9
11 RESET I PU 9
12 XO O none none
13 XI I none none
15 VSLEEP SUPPLY none none
16 WAKE I/O PD 455
17 INH OD, O none none
18 VDDA SUPPLY none none
19 TRD_P IO none none
20 TRD_M IO none none
21 RX_ER I PD 6
22 RX_DV I PD 6
23 VDDMAC SUPPLY none none
24 RX_D3 I PD 9
25 RX_D2 I PD 9
26 RX_D1 I PD 9
27 RX_D0 I PD 9
28 RX_CLK I PD 9
1 TX_CLK I none none
2 TX_EN I none none
3 TX_D3 I none none
4 TX_D2 I none none
5 TX_D1 I none none
6 TX_D0 I none none
7 VDDIO SUPPLY none none
8 MDIO OD, IO none none
Table 6-4 Pin States - TC10 SLEEP
PIN NO PIN
NAME
TC10 SLEEP (All Supplies On)
PIN STATE (1) PULL TYPE PULL VALUE
(kΩ)
9 MDC I none none
10 INT I PU 9
11 RESET I PU 9
12 XO O none none
13 XI I none none
15 VSLEEP SUPPLY none none
16 WAKE I/O PD 455
17 INH OD, O none none
18 VDDA SUPPLY none none
19 TRD_P IO none none
20 TRD_M IO none none
21 RX_ER I PD 6
22 RX_DV I PD 6
23 VDDMAC SUPPLY none none
24 RX_D3 I PD 9
25 RX_D2 I PD 9
26 RX_D1 I PD 9
27 RX_D0 I PD 9
28 RX_CLK I PD 9
1 TX_CLK I none none
2 TX_EN I none none
3 TX_D3 I none none
4 TX_D2 I none none
5 TX_D1 I none none
6 TX_D0 I none none
7 VDDIO SUPPLY none none
8 MDIO OD, IO none none
Table 6-5 Pin States - MAC ISOLATE and IEEE PWDN
PIN NO PIN
NAME
MAC ISOLATE IEEE PWDN
PIN STATE (1) PULL TYPE PULL VALUE
(kΩ)
PIN STATE (1) PULL TYPE PULL VALUE
(kΩ)
9 MDC I none none I none none
10 INT OD, O PU 9 OD, O PU 9
11 RESET I PU 9 I PU 9
12 XO O none none O none none
13 XI I none none I none none
15 VSLEEP SUPPLY none none SUPPLY none none
16 WAKE IO PD 455 IO PD 455
17 INH OD, O none none OD, O none none
18 VDDA SUPPLY none none SUPPLY none none
19 TRD_P IO none none IO none none
20 TRD_M IO none none IO none none
21 RX_ER I PD 6 I PD 6
22 RX_DV I PD 6 O none none
23 VDDMAC SUPPLY none none SUPPLY none none
24 RX_D3 I PD 9 O none none
25 RX_D2 I PD 9 O none none
26 RX_D1 I PD 9 O none none
27 RX_D0 I PD 9 O none none
28 RX_CLK I PD 9 O none none
1 TX_CLK I PD 9 I none none
2 TX_EN I PD 9 I none none
3 TX_D3 I PD 9 I none none
4 TX_D2 I PD 9 I none none
5 TX_D1 I PD 9 I none none
6 TX_D0 I PD 9 I none none
7 VDDIO SUPPLY none none SUPPLY none none
8 MDIO OD, IO none none OD, IO none none
Table 6-6 Pin States - MII and RGMII
PIN NO PIN
NAME
MII RGMII
PIN STATE (1) PULL TYPE PULL VALUE
(kΩ)
PIN STATE (1) PULL TYPE PULL VALUE
(kΩ)
9 MDC I none none I none none
10 INT OD, O PU 9 OD, O PU 9
11 RESET I PU 9 I PU 9
12 XO O none none O none none
13 XI I none none I none none
15 VSLEEP SUPPLY none none SUPPLY none none
16 WAKE IO PD 455 IO PD 455
17 INH OD, O none none OD, O none none
18 VDDA SUPPLY none none SUPPLY none none
19 TRD_P IO none none IO none none
20 TRD_M IO none none IO none none
21 RX_ER O none none I PD 6
22 RX_DV O none none O none none
23 VDDMAC SUPPLY none none SUPPLY none none
24 RX_D3 O none none O none none
25 RX_D2 O none none O none none
26 RX_D1 O none none O none none
27 RX_D0 O none none O none none
28 RX_CLK O none none O none none
1 TX_CLK O none none I none none
2 TX_EN I none none I none none
3 TX_D3 I none none I none none
4 TX_D2 I none none I none none
5 TX_D1 I none none I none none
6 TX_D0 I none none I none none
7 VDDIO SUPPLY none none SUPPLY none none
8 MDIO OD, IO none none OD, IO none none
Table 6-7 Pin States - RMII MASTER and RMII SLAVE
PIN NO PIN
NAME
RMII MASTER RMII SLAVE
PIN STATE (1) PULL TYPE PULL VALUE
(kΩ)
PIN STATE (1) PULL TYPE PULL VALUE
(kΩ)
9 MDC I none none I none none
10 INT OD, O PU 9 OD, O PU 9
11 RESET I PU 9 I PU 9
12 XO O none none O none none
13 XI I none none I none none
15 VSLEEP SUPPLY none none SUPPLY none none
16 WAKE IO PD 455 IO PD 455
17 INH OD, O none none OD, O none none
18 VDDA SUPPLY none none SUPPLY none none
19 TRD_P IO none none IO none none
20 TRD_M IO none none IO none none
21 RX_ER O none none O none none
22 RX_DV O none none O none none
23 VDDMAC SUPPLY none none SUPPLY none none
24 RX_D3 O, 50MHz none none I PD 9
25 RX_D2 I PD 9 I PD 9
26 RX_D1 O none none O none none
27 RX_D0 O none none O none none
28 RX_CLK I PD 9 I PD 9
1 TX_CLK I none none I none none
2 TX_EN I none none I none none
3 TX_D3 I none none I none none
4 TX_D2 I none none I none none
5 TX_D1 I none none I none none
6 TX_D0 I none none I none none
7 VDDIO SUPPLY none none SUPPLY none none
8 MDIO OD, IO none none OD, IO none none
Table 6-8 Pin States - SGMII
PIN NO PIN
NAME
SGMII
PIN STATE (1) PULL TYPE PULL VALUE
(kΩ)
9 MDC I none none
10 INT OD, O PU 9
11 RESET I PU 9
12 XO O none none
13 XI I none none
15 VSLEEP SUPPLY none none
16 WAKE IO PD 455
17 INH OD, O none none
18 VDDA SUPPLY none none
19 TRD_P IO none none
20 TRD_M IO none none
21 RX_ER I PD 6
22 RX_DV I PD 6
23 VDDMAC SUPPLY none none
24 RX_D3 O none none
25 RX_D2 O none none
26 RX_D1 I PD 9
27 RX_D0 I PD 9
28 RX_CLK I PD 9
1 TX_CLK I none none
2 TX_EN I none none
3 TX_D3 I none none
4 TX_D2 I none none
5 TX_D1 I none none
6 TX_D0 I none none
7 VDDIO SUPPLY none none
8 MDIO OD, IO none none
Type: I = Input
O = Output
IO = Input/Output
OD = Open Drain
PD = Internal pulldown
PU = Internal pullup