SNLS676 May   2022 DP83TC813R-Q1 , DP83TC813S-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Diagnostic Tool Kit
        1. 8.3.1.1 Signal Quality Indicator
        2. 8.3.1.2 Electrostatic Discharge Sensing
        3. 8.3.1.3 Time Domain Reflectometry
        4. 8.3.1.4 Voltage Sensing
        5. 8.3.1.5 BIST and Loopback Modes
          1. 8.3.1.5.1 Data Generator and Checker
          2. 8.3.1.5.2 xMII Loopback
          3. 8.3.1.5.3 PCS Loopback
          4. 8.3.1.5.4 Digital Loopback
          5. 8.3.1.5.5 Analog Loopback
          6. 8.3.1.5.6 Reverse Loopback
      2. 8.3.2 Compliance Test Modes
        1. 8.3.2.1 Test Mode 1
        2. 8.3.2.2 Test Mode 2
        3. 8.3.2.3 Test Mode 4
        4. 8.3.2.4 Test Mode 5
    4. 8.4 Device Functional Modes
      1. 8.4.1  Power Down
      2. 8.4.2  Reset
      3. 8.4.3  Standby
      4. 8.4.4  Normal
      5. 8.4.5  Sleep Ack
      6. 8.4.6  Sleep Request
      7. 8.4.7  Sleep Fail
      8. 8.4.8  Sleep
      9. 8.4.9  Wake-Up
      10. 8.4.10 TC10 System Example
      11. 8.4.11 Media Dependent Interface
        1. 8.4.11.1 100BASE-T1 Master and 100BASE-T1 Slave Configuration
        2. 8.4.11.2 Auto-Polarity Detection and Correction
        3. 8.4.11.3 Jabber Detection
        4. 8.4.11.4 Interleave Detection
      12. 8.4.12 MAC Interfaces
        1. 8.4.12.1 Media Independent Interface
        2. 8.4.12.2 Reduced Media Independent Interface
        3. 8.4.12.3 Reduced Gigabit Media Independent Interface
        4. 8.4.12.4 Serial Gigabit Media Independent Interface
      13. 8.4.13 Serial Management Interface
      14. 8.4.14 Direct Register Access
      15. 8.4.15 Extended Register Space Access
      16. 8.4.16 Write Address Operation
        1. 8.4.16.1 MMD1 - Write Address Operation
      17. 8.4.17 Read Address Operation
        1. 8.4.17.1 MMD1 - Read Address Operation
      18. 8.4.18 Write Operation (No Post Increment)
        1. 8.4.18.1 MMD1 - Write Operation (No Post Increment)
      19. 8.4.19 Read Operation (No Post Increment)
        1. 8.4.19.1 MMD1 - Read Operation (No Post Increment)
      20. 8.4.20 Write Operation (Post Increment)
        1. 8.4.20.1 MMD1 - Write Operation (Post Increment)
      21. 8.4.21 Read Operation (Post Increment)
        1. 8.4.21.1 MMD1 - Read Operation (Post Increment)
    5. 8.5 Programming
      1. 8.5.1 Strap Configuration
      2. 8.5.2 LED Configuration
      3. 8.5.3 PHY Address Configuration
    6. 8.6 Register Maps
      1. 8.6.1 Register Access Summary
      2. 8.6.2 DP83TC813 Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Physical Medium Attachment
          1. 9.2.1.1.1 Common-Mode Choke Recommendations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Signal Traces
      2. 11.1.2 Return Path
      3. 11.1.3 Metal Pour
      4. 11.1.4 PCB Layer Stacking
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN TYP MAX UNIT
Input Voltage VDDA –0.3 4 V
Input Voltage VDDIO/VDDMAC (3.3V) –0.3 4 V
Input Voltage VDDIO/VDDMAC (2.5V) –0.3 4 V
Input Voltage VDDIO/VDDMAC (1.8V) –0.3 4 V
Input Voltage VSLEEP -0.3 4 V
Pins MDI –0.3 4 V
Pins MAC interface –0.3 VDDMAC + 0.3 V
Pins MDIO, MDC, GPIO, XI, XO, INT, RESET, CLKOUT –0.3 VDDIO + 0.3 V
Pins WAKE, INH –0.3 VSLEEP + 0.3 V
DC Output Voltage All Pins –0.3 4 V
TJ Junction Temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.