DRA72x Infotainment Applications Processor Silicon Revision 2.0 and 2.1

1 Device Overview

1.1 Features

• Architecture designed for infotainment applications
• Video, image, and graphics processing support
  • Full-HD video (1920 × 1080p, 60 fps)
  • Multiple video inputs and video outputs
  • 2D and 3D graphics
• Arm®Cortex®-A15 microprocessor subsystem
• C66x floating-point VLIW DSP cores
  • Fully object-code compatible with C67x and C64x+
  • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
• Up to 512KB of on-chip L3 RAM
• Level 3 (L3) and level 4 (L4) interconnects
• DDR3/DDR3L External Memory Interface (EMIF) module
  • Supports up to DDR3-1333 (667 MHz)
  • Up to 2GB across single chip select
• Dual Arm®Cortex®-M4 Image Processing Units (IPU)
• IVA-HD subsystem
• Display subsystem
  • Display controller with DMA engine and up to three pipelines
  • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
• 2D-graphics accelerator (BB2D) subsystem
  • Vivante® GC320 core
• Video Processing Engine (VPE)
• Single-core PowerVR™ SGX544 3D GPU
• One Video Input Port (VIP) module
  • Support for up to four multiplexed input ports
• General-Purpose Memory Controller (GPMC)
• Enhanced Direct Memory Access (EDMA) controller
• 2-Port Gigabit Ethernet switch
  • Up to two external ports
• Sixteen 32-bit general-purpose timers
• 32-bit MPU watchdog timer
• Six high speed Inter-Integrated Circuit (I2C™) ports
• HDQ/1-Wire® interface
• Ten configurable UART/IrDA/CIR modules
• Four Multichannel Serial Peripheral Interfaces (McSPI)
• Quad Serial Peripheral Interface (QSPI)
• Media Local Bus subsystem (MLBSS)
• Real-Time Clock subsystem (RTCSS)
• SATA interface
• Eight Multichannel Audio Serial Port (McASP) modules
• SuperSpeed USB 3.0 dual-role device
• High Speed USB 2.0 dual-role device
• High Speed USB 2.0 on-the-go
• Four MultiMedia Card/Secure Digital®/Secure Digital Input Output interfaces (MMC™/SD®/SDIO)
• PCI-Express® (PCIe®) revision 3.0 subsystems with two 5-Gbps lanes
  • One 2-lane Gen2-compliant port
  • or two 1-lane Gen2-compliant ports
• Dual Controller Area Network (DCAN) modules
  • CAN 2.0B Protocol
• MIPI® Camera Serial Interface 2 (CSI-2)
• Up to 215 General-Purpose I/O (GPIO) pins
• Device security features
  • Hardware crypto accelerators and DMA
  • Firewalls
  • JTAG lock
  • Secure keys
  • Secure ROM and Boot
  • Customer programmable keys (Silicon Revision 2.1)
• Power, reset, and clock management
• On-chip debug with CTools technology
• 28-nm CMOS technology
• 23 mm × 23 mm, 0.8-mm Pitch, 760-Pin BGA (ABC)