SPRS950F December 2015 – May 2019 DRA745 , DRA746 , DRA750 , DRA756
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
TI Component Level IEC ESD Test tests only the IC terminals that are exposed in system level applications. It can be used to determine the robustness of on-chip protection and the latch-up immunity. The IC can only pass the TI Component Level IEC ESD test when there is no latch-up and IC is fully functional after the test.