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DATA SHEET
DRA75x, DRA74x Infotainment Applications Processor Silicon Revision 2.0
1 Device Overview
1.1 Features
- Architecture designed for infotainment applications
- Video, image, and graphics processing support
- Full-HD video (1920 × 1080p, 60 fps)
- Multiple video input and video output
- 2D and 3D graphics
- Dual Arm®Cortex®-A15 microprocessor subsystem
- Up to two C66x floating-point VLIW DSP
- Fully object-code compatible with C67x and C64x+
- Up to thirty-two 16 x 16-Bit fixed-point multiplies per cycle
- Up to 2.5MB of on-chip L3 RAM
- Level 3 (L3) and level 4 (L4) interconnects
- Two DDR2/DDR3/DDR3L memory interface (EMIF) modules
- Supports up to DDR2-800 and DDR3-1066
- Up to 2GB supported per EMIF
- Dual Arm®Cortex®-M4 Image Processing Units (IPU)
- Up to two Embedded Vision Engines (EVEs)
- IVA subsystem
- Display subsystem
- Display controller with DMA engine and up to three pipelines
- HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
- Video Processing Engine (VPE)
- 2D-graphics accelerator (BB2D) subsystem
- Dual-core PowerVR® SGX544 3D GPU
- Three Video Input Port (VIP) modules
- Support for up to 10 multiplexed input ports
- General-Purpose Memory Controller (GPMC)
- Enhanced Direct Memory Access (EDMA) controller
- 2-port gigabit ethernet (GMAC)
- Sixteen 32-Bit general-purpose timers
- 32-Bit MPU watchdog timer
- Five Inter-Integrated Circuit (I2C™) ports
- HDQ™/1-Wire® interface
- SATA interface
- MediaLB® (MLB) subsystem
- Ten configurable UART/IrDA/CIR modules
- Four Multichannel Serial Peripheral Interfaces (McSPI)
- Quad SPI (QSPI)
- Eight Multichannel Audio Serial Port (McASP) modules
- SuperSpeed USB 3.0 dual-role device
- Three high-speed USB 2.0 dual-role devices
- Four Multimedia Card/Secure Digital/Secure Digital Input Output interfaces (MMC™/SD®/SDIO)
- PCI-Express® 3.0 subsystems with two 5-Gbps lanes
- One 2-lane gen2-compliant port
- or Two 1-lane gen2-compliant ports
- Dual Controller Area Network (DCAN) modules
- Up to 247 General-Purpose I/O (GPIO) pins
- Real-Time Clock SubSystem (RTCSS)
- Device security features
- Hardware crypto accelerators and DMA
- Firewalls
- JTAG® lock
- Secure keys
- Secure ROM and boot
- Power, Reset, and Clock Management (PRCM)
- On-chip debug with CTools technology
- 28-nm CMOS technology
- 23 mm × 23 mm, 0.8-mm pitch, 760-pin BGA (ABC)
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