SPRS993E March 2017 – December 2018 DRA76P , DRA77P
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
If separate power planes are used, they must be tied together at one point through a low-impedance bridge or preferably through a ferrite bead. Care must be taken to capacitively decouple each power rail close to the device. The analog ground, digital ground, and PLL ground must be tied together to the low-impedance circuit board ground plane.