SPRS993E March 2017 – December 2018 DRA76P , DRA77P
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
Table 5-15 provides the thermal resistance characteristics for the package used on this device.
NOTE
Power dissipation of 1.5 W and an ambient temperature of 85 ºC is assumed for ACD package.
NO. | PARAMETER | DESCRIPTION | °C/W(1)(3) | AIR FLOW (m/s)(2) |
---|---|---|---|---|
T1 | RΘJC | Junction-to-case | 0.16 | N/A |
T2 | RΘJB | Junction-to-board | 3.03 | N/A |
T3 | RΘJA | Junction-to-free air | 12.37 | 0 |
T4 | Junction-to-moving air | 7.61 | 1 | |
T5 | 6.69 | 2 | ||
T6 | 6.18 | 3 | ||
T7 | ΨJT | Junction-to-package top | 0.08 | 0 |
T8 | 0.09 | 1 | ||
T9 | 0.09 | 2 | ||
T10 | 0.09 | 3 | ||
T11 | ΨJB | Junction-to-board | 2.80 | 0 |
T12 | 2.67 | 1 | ||
T13 | 2.59 | 2 | ||
T14 | 2.54 | 3 |