SPRS993E March 2017 – December 2018 DRA76P , DRA77P
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
For reliability and operability concerns, the maximum junction temperature of the Device has to be at or below the TJ value identified in Section 5.4, Recommended Operating Conditions.
A BCI compact thermal model for this Device is available and recommended for use when modeling thermal performance in a system.
Therefore, it is recommended to perform thermal simulations at the system level with the worst case device power consumption.