SPRS993E March   2017  – December 2018 DRA76P , DRA77P

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Device Comparison Table
    2. 3.2 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. 4.3.1  VIP
      2. 4.3.2  DSS
      3. 4.3.3  HDMI
      4. 4.3.4  Camera Serial Interface 2 CAL bridge (CSI2)
      5. 4.3.5  EMIF
      6. 4.3.6  GPMC
      7. 4.3.7  Timers
      8. 4.3.8  I2C
      9. 4.3.9  HDQ1W
      10. 4.3.10 UART
      11. 4.3.11 McSPI
      12. 4.3.12 QSPI
      13. 4.3.13 McASP
      14. 4.3.14 USB
      15. 4.3.15 SATA
      16. 4.3.16 PCIe
      17. 4.3.17 DCAN and MCAN
      18. 4.3.18 GMAC_SW
      19. 4.3.19 MLB
      20. 4.3.20 eMMC/SD/SDIO
      21. 4.3.21 GPIO
      22. 4.3.22 KBD
      23. 4.3.23 PWM
      24. 4.3.24 ATL
      25. 4.3.25 Test Interfaces
      26. 4.3.26 System and Miscellaneous
        1. 4.3.26.1 Sysboot
        2. 4.3.26.2 PRCM
        3. 4.3.26.3 SDMA
        4. 4.3.26.4 INTC
        5. 4.3.26.5 Observability
        6. 4.3.26.6 Power Supplies
    4. 4.4 Pin Multiplexing
    5. 4.5 Connections for Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Operating Performance Points
      1. 5.5.1 AVS and ABB Requirements
      2. 5.5.2 Voltage And Core Clock Specifications
      3. 5.5.3 Maximum Supported Frequency
    6. 5.6  Power Consumption Summary
    7. 5.7  Electrical Characteristics
      1. Table 5-6  LVCMOS DDR DC Electrical Characteristics
      2. Table 5-7  Dual Voltage LVCMOS I2C DC Electrical Characteristics
      3. Table 5-8  IQ1833 Buffers DC Electrical Characteristics
      4. Table 5-9  LVCMOS CSI2 DC Electrical Characteristics
      5. Table 5-10 IHHV1833 Buffers DC Electrical Characteristics
      6. Table 5-11 BMLB18 Buffers DC Electrical Characteristics
      7. Table 5-12 Dual Voltage SDIO1833 DC Electrical Characteristics
      8. Table 5-13 Dual Voltage LVCMOS DC Electrical Characteristics
      9. 5.7.1      HDMIPHY DC Electrical Characteristics
      10. 5.7.2      USBPHY DC Electrical Characteristics
      11. 5.7.3      SATAPHY DC Electrical Characteristics
      12. 5.7.4      PCIEPHY DC Electrical Characteristics
    8. 5.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. Table 5-14 Recommended Operating Conditions for OTP eFuse Programming
      2. 5.8.1      Hardware Requirements
      3. 5.8.2      Programming Sequence
      4. 5.8.3      Impact to Your Hardware Warranty
    9. 5.9  Thermal Resistance Characteristics
      1. 5.9.1 Package Thermal Characteristics
    10. 5.10 Timing Requirements and Switching Characteristics
      1. 5.10.1 Timing Parameters and Information
        1. 5.10.1.1 Parameter Information
          1. 5.10.1.1.1 1.8V and 3.3V Signal Transition Levels
          2. 5.10.1.1.2 1.8V and 3.3V Signal Transition Rates
          3. 5.10.1.1.3 Timing Parameters and Board Routing Analysis
      2. 5.10.2 Interface Clock Specifications
        1. 5.10.2.1 Interface Clock Terminology
        2. 5.10.2.2 Interface Clock Frequency
      3. 5.10.3 Power Supply Sequences
      4. 5.10.4 Clock Specifications
        1. 5.10.4.1 Input Clocks / Oscillators
          1. 5.10.4.1.1 OSC0 External Crystal
          2. 5.10.4.1.2 OSC0 Input Clock
          3. 5.10.4.1.3 Auxiliary Oscillator OSC1 Input Clock
            1. 5.10.4.1.3.1 OSC1 External Crystal
            2. 5.10.4.1.3.2 OSC1 Input Clock
        2. 5.10.4.2 RC On-die Oscillator Clock
        3. 5.10.4.3 Output Clocks
        4. 5.10.4.4 DPLLs, DLLs
          1. 5.10.4.4.1 DPLL Characteristics
          2. 5.10.4.4.2 DLL Characteristics
          3. 5.10.4.4.3 DPLL and DLL Noise Isolation
      5. 5.10.5 Recommended Clock and Control Signal Transition Behavior
      6. 5.10.6 Peripherals
        1. 5.10.6.1  Timing Test Conditions
        2. 5.10.6.2  Virtual and Manual I/O Timing Modes
        3. 5.10.6.3  VIP
        4. 5.10.6.4  DSS
        5. 5.10.6.5  HDMI
        6. 5.10.6.6  EMIF
        7. 5.10.6.7  GPMC
          1. 5.10.6.7.1 GPMC/NOR Flash Interface Synchronous Timing
          2. 5.10.6.7.2 GPMC/NOR Flash Interface Asynchronous Timing
          3. 5.10.6.7.3 GPMC/NAND Flash Interface Asynchronous Timing
        8. 5.10.6.8  Timers
        9. 5.10.6.9  I2C
          1. Table 5-60 Timing Requirements for I2C Input Timings
          2. Table 5-61 Timing Requirements for I2C HS-Mode (I2C3/4/5 Only)
          3. Table 5-62 Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
        10. 5.10.6.10 HDQ1W
          1. 5.10.6.10.1 HDQ / 1-Wire — HDQ Mode
          2. 5.10.6.10.2 HDQ/1-Wire—1-Wire Mode
        11. 5.10.6.11 UART
          1. Table 5-67 Timing Requirements for UART
          2. Table 5-68 Switching Characteristics Over Recommended Operating Conditions for UART
        12. 5.10.6.12 McSPI
        13. 5.10.6.13 QSPI
        14. 5.10.6.14 McASP
          1. Table 5-75 Timing Requirements for McASP1
          2. Table 5-76 Timing Requirements for McASP2
          3. Table 5-77 Timing Requirements for McASP3/4/5/6/7/8
          4. Table 5-78 Switching Characteristics Over Recommended Operating Conditions for McASP1
          5. Table 5-79 Switching Characteristics Over Recommended Operating Conditions for McASP2
          6. Table 5-80 Switching Characteristics Over Recommended Operating Conditions for McASP3/4/5/6/7/8
        15. 5.10.6.15 USB
          1. 5.10.6.15.1 USB1 DRD PHY
          2. 5.10.6.15.2 USB2 PHY
          3. 5.10.6.15.3 USB3 and USB4 DRD ULPI—SDR—Slave Mode—12-pin Mode
        16. 5.10.6.16 SATA
        17. 5.10.6.17 PCIe
        18. 5.10.6.18 CAN
          1. 5.10.6.18.1 DCAN
          2. 5.10.6.18.2 MCAN-FD
          3. Table 5-95  Timing Requirements for CANx Receive
          4. Table 5-96  Switching Characteristics Over Recommended Operating Conditions for CANx Transmit
        19. 5.10.6.19 GMAC_SW
          1. 5.10.6.19.1 GMAC MII Timings
            1. Table 5-97  Timing Requirements for miin_rxclk - MII Operation
            2. Table 5-98  Timing Requirements for miin_txclk - MII Operation
            3. Table 5-99  Timing Requirements for GMAC MIIn Receive 10/100 Mbit/s
            4. Table 5-100 Switching Characteristics Over Recommended Operating Conditions for GMAC MIIn Transmit 10/100 Mbits/s
          2. 5.10.6.19.2 GMAC MDIO Interface Timings
          3. 5.10.6.19.3 GMAC RMII Timings
            1. Table 5-105 Timing Requirements for GMAC REF_CLK - RMII Operation
            2. Table 5-106 Timing Requirements for GMAC RMIIn Receive
            3. Table 5-107 Switching Characteristics Over Recommended Operating Conditions for GMAC REF_CLK - RMII Operation
            4. Table 5-108 Switching Characteristics Over Recommended Operating Conditions for GMAC RMIIn Transmit 10/100 Mbits/s
          4. 5.10.6.19.4 GMAC RGMII Timings
            1. Table 5-112 Timing Requirements for rgmiin_rxc - RGMIIn Operation
            2. Table 5-113 Timing Requirements for GMAC RGMIIn Input Receive for 10/100/1000 Mbps
            3. Table 5-114 Switching Characteristics Over Recommended Operating Conditions for rgmiin_txctl - RGMIIn Operation for 10/100/1000 Mbit/s
            4. Table 5-115 Switching Characteristics for GMAC RGMIIn Output Transmit for 10/100/1000 Mbps
        20. 5.10.6.20 MLB
        21. 5.10.6.21 eMMC/SD/SDIO
          1. 5.10.6.21.1 MMC1—SD Card Interface
            1. 5.10.6.21.1.1 Default speed, 4-bit Data, SDR, Half-Cycle
            2. 5.10.6.21.1.2 High-Speed, 4-bit Data, SDR, Half-Cycle
            3. 5.10.6.21.1.3 SDR12, 4-bit Data, Half-Cycle
            4. 5.10.6.21.1.4 SDR25, 4-bit Data, Half-Cycle
            5. 5.10.6.21.1.5 UHS-I SDR50, 4-bit Data, Half-Cycle
            6. 5.10.6.21.1.6 UHS-I SDR104, 4-bit Data, Half-Cycle
            7. 5.10.6.21.1.7 UHS-I DDR50, 4-bit Data
          2. 5.10.6.21.2 MMC2 — eMMC
            1. 5.10.6.21.2.1 Standard JC64 SDR, 8-bit Data, Half Cycle
            2. 5.10.6.21.2.2 High-Speed JC64 SDR, 8-bit Data, Half Cycle
            3. 5.10.6.21.2.3 High-Speed HS200 JC64 SDR, 8-bit Data, Half Cycle
            4. 5.10.6.21.2.4 High-Speed JC64 DDR, 8-bit Data
          3. 5.10.6.21.3 MMC3 and MMC4—SDIO/SD
            1. 5.10.6.21.3.1 MMC3 and MMC4, SD Default Speed
            2. 5.10.6.21.3.2 MMC3 and MMC4, SD High-Speed
            3. 5.10.6.21.3.3 MMC3 and MMC4, SD and SDIO SDR12 Mode
            4. 5.10.6.21.3.4 MMC3 and MMC4, SD SDR25 Mode
            5. 5.10.6.21.3.5 MMC3 SDIO High-Speed UHS-I SDR50 Mode, Half Cycle
        22. 5.10.6.22 GPIO
        23. 5.10.6.23 ATL
          1. 5.10.6.23.1 ATL Electrical Data/Timing
            1. Table 5-171 Switching Characteristics Over Recommended Operating Conditions for ATL_CLKOUTx
        24. 5.10.6.24 System and Miscellaneous Interfaces
      7. 5.10.7 Emulation and Debug Subsystem
        1. 5.10.7.1 JTAG
          1. 5.10.7.1.1 JTAG Electrical Data/Timing
            1. Table 5-172 Timing Requirements for IEEE 1149.1 JTAG
            2. Table 5-173 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
            3. Table 5-174 Timing Requirements for IEEE 1149.1 JTAG With RTCK
            4. Table 5-175 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG With RTCK
        2. 5.10.7.2 TPIU
          1. 5.10.7.2.1 TPIU PLL DDR Mode
  6. 6Detailed Description
    1. 6.1  Description
    2. 6.2  Functional Block Diagram
    3. 6.3  MPU
    4. 6.4  DSP Subsystem
    5. 6.5  ISS
    6. 6.6  IVA
    7. 6.7  EVE
    8. 6.8  IPU
    9. 6.9  VPE
    10. 6.10 GPU
    11. 6.11 ATL Overview
    12. 6.12 Memory Subsystem
      1. 6.12.1 EMIF
      2. 6.12.2 GPMC
      3. 6.12.3 ELM
      4. 6.12.4 OCMC
    13. 6.13 Interprocessor Communication
      1. 6.13.1 Mailbox
      2. 6.13.2 Spinlock
    14. 6.14 Interrupt Controller
    15. 6.15 EDMA
    16. 6.16 Peripherals
      1. 6.16.1  VIP
      2. 6.16.2  DSS
      3. 6.16.3  Timers
      4. 6.16.4  I2C
      5. 6.16.5  HDQ1W
      6. 6.16.6  UART
        1. 6.16.6.1 UART Features
        2. 6.16.6.2 IrDA Features
        3. 6.16.6.3 CIR Features
      7. 6.16.7  McSPI
      8. 6.16.8  QSPI
      9. 6.16.9  McASP
      10. 6.16.10 USB
      11. 6.16.11 SATA
      12. 6.16.12 PCIe
      13. 6.16.13 CAN
      14. 6.16.14 GMAC_SW
      15. 6.16.15 MLB
      16. 6.16.16 CSI2
        1. 6.16.16.1 CSI-2 MIPI D-PHY
      17. 6.16.17 eMMC/SD/SDIO
      18. 6.16.18 GPIO
      19. 6.16.19 ePWM
      20. 6.16.20 eCAP
      21. 6.16.21 eQEP
    17. 6.17 On-Chip Debug
  7. 7Applications, Implementation, and Layout
    1. 7.1 Introduction
      1. 7.1.1 Initial Requirements and Guidelines
    2. 7.2 Power Optimizations
      1. 7.2.1 Step 1: PCB Stack-up
      2. 7.2.2 Step 2: Physical Placement
      3. 7.2.3 Step 3: Static Analysis
        1. 7.2.3.1 PDN Resistance and IR Drop
      4. 7.2.4 Step 4: Frequency Analysis
      5. 7.2.5 System ESD Generic Guidelines
        1. 7.2.5.1 System ESD Generic PCB Guideline
        2. 7.2.5.2 Miscellaneous EMC Guidelines to Mitigate ESD Immunity
      6. 7.2.6 EMI / EMC Issues Prevention
        1. 7.2.6.1 Signal Bandwidth
        2. 7.2.6.2 Signal Routing
          1. 7.2.6.2.1 Signal Routing—Sensitive Signals and Shielding
          2. 7.2.6.2.2 Signal Routing—Outer Layer Routing
        3. 7.2.6.3 Ground Guidelines
          1. 7.2.6.3.1 PCB Outer Layers
          2. 7.2.6.3.2 Metallic Frames
          3. 7.2.6.3.3 Connectors
          4. 7.2.6.3.4 Guard Ring on PCB Edges
          5. 7.2.6.3.5 Analog and Digital Ground
    3. 7.3 Core Power Domains
      1. 7.3.1 General Constraints and Theory
      2. 7.3.2 Voltage Decoupling
      3. 7.3.3 Static PDN Analysis
      4. 7.3.4 Dynamic PDN Analysis
      5. 7.3.5 Power Supply Mapping
      6. 7.3.6 DPLL Voltage Requirement
      7. 7.3.7 Loss of Input Power Event
      8. 7.3.8 Example PCB Design
        1. 7.3.8.1 Example Stack-up
        2. 7.3.8.2 vdd_mpu Example Analysis
    4. 7.4 Single-Ended Interfaces
      1. 7.4.1 General Routing Guidelines
      2. 7.4.2 QSPI Board Design and Layout Guidelines
    5. 7.5 Differential Interfaces
      1. 7.5.1 General Routing Guidelines
      2. 7.5.2 USB 2.0 Board Design and Layout Guidelines
        1. 7.5.2.1 Background
        2. 7.5.2.2 USB PHY Layout Guide
          1. 7.5.2.2.1 General Routing and Placement
          2. 7.5.2.2.2 Specific Guidelines for USB PHY Layout
            1. 7.5.2.2.2.1  Analog, PLL, and Digital Power Supply Filtering
            2. 7.5.2.2.2.2  Analog, Digital, and PLL Partitioning
            3. 7.5.2.2.2.3  Board Stackup
            4. 7.5.2.2.2.4  Cable Connector Socket
            5. 7.5.2.2.2.5  Clock Routings
            6. 7.5.2.2.2.6  Crystals/Oscillator
            7. 7.5.2.2.2.7  DP/DM Trace
            8. 7.5.2.2.2.8  DP/DM Vias
            9. 7.5.2.2.2.9  Image Planes
            10. 7.5.2.2.2.10 JTAG Interface
            11. 7.5.2.2.2.11 Power Regulators
        3. 7.5.2.3 Electrostatic Discharge (ESD)
          1. 7.5.2.3.1 IEC ESD Stressing Test
            1. 7.5.2.3.1.1 Test Mode
            2. 7.5.2.3.1.2 Air Discharge Mode
            3. 7.5.2.3.1.3 Test Type
          2. 7.5.2.3.2 TI Component Level IEC ESD Test
          3. 7.5.2.3.3 Construction of a Custom USB Connector
          4. 7.5.2.3.4 ESD Protection System Design Consideration
        4. 7.5.2.4 References
      3. 7.5.3 USB 3.0 Board Design and Layout Guidelines
        1. 7.5.3.1 USB 3.0 interface introduction
        2. 7.5.3.2 USB 3.0 General routing rules
      4. 7.5.4 HDMI Board Design and Layout Guidelines
        1. 7.5.4.1 HDMI Interface Schematic
        2. 7.5.4.2 TMDS General Routing Guidelines
        3. 7.5.4.3 TPD5S115
        4. 7.5.4.4 HDMI ESD Protection Device (Required)
        5. 7.5.4.5 PCB Stackup Specifications
        6. 7.5.4.6 Grounding
      5. 7.5.5 SATA Board Design and Layout Guidelines
        1. 7.5.5.1 SATA Interface Schematic
        2. 7.5.5.2 Compatible SATA Components and Modes
        3. 7.5.5.3 PCB Stackup Specifications
        4. 7.5.5.4 Routing Specifications
      6. 7.5.6 PCIe Board Design and Layout Guidelines
        1. 7.5.6.1 PCIe Connections and Interface Compliance
          1. 7.5.6.1.1 Coupling Capacitors
          2. 7.5.6.1.2 Polarity Inversion
        2. 7.5.6.2 Non-standard PCIe connections
          1. 7.5.6.2.1 PCB Stackup Specifications
          2. 7.5.6.2.2 Routing Specifications
            1. 7.5.6.2.2.1 Impedance
            2. 7.5.6.2.2.2 Differential Coupling
            3. 7.5.6.2.2.3 Pair Length Matching
        3. 7.5.6.3 LJCB_REFN/P Connections
      7. 7.5.7 CSI2 Board Design and Routing Guidelines
        1. 7.5.7.1 CSI2_0 and CSI2_1 MIPI CSI-2 (1.5 Gbps)
          1. 7.5.7.1.1 General Guidelines
          2. 7.5.7.1.2 Length Mismatch Guidelines
            1. 7.5.7.1.2.1 CSI2_0 and CSI2_1 MIPI CSI-2 (1.5 Gbps)
          3. 7.5.7.1.3 Frequency-domain Specification Guidelines
    6. 7.6 DDR2/DDR3 Board Design and Layout Guidelines
      1. 7.6.1 DDR2/DDR3 General Board Layout Guidelines
      2. 7.6.2 DDR2 Board Design and Layout Guidelines
        1. 7.6.2.1 Board Designs
        2. 7.6.2.2 DDR2 Interface
          1. 7.6.2.2.1  DDR2 Interface Schematic
          2. 7.6.2.2.2  Compatible JEDEC DDR2 Devices
          3. 7.6.2.2.3  PCB Stackup
          4. 7.6.2.2.4  Placement
          5. 7.6.2.2.5  DDR2 Keepout Region
          6. 7.6.2.2.6  Bulk Bypass Capacitors
          7. 7.6.2.2.7  High-Speed Bypass Capacitors
          8. 7.6.2.2.8  Net Classes
          9. 7.6.2.2.9  DDR2 Signal Termination
          10. 7.6.2.2.10 VREF Routing
        3. 7.6.2.3 DDR2 CK and ADDR_CTRL Routing
      3. 7.6.3 DDR3 Board Design and Layout Guidelines
        1. 7.6.3.1  Board Designs
        2. 7.6.3.2  DDR3 EMIF
        3. 7.6.3.3  DDR3 Device Combinations
        4. 7.6.3.4  DDR3 Interface Schematic
          1. 7.6.3.4.1 32-Bit DDR3 Interface
          2. 7.6.3.4.2 16-Bit DDR3 Interface
        5. 7.6.3.5  Compatible JEDEC DDR3 Devices
        6. 7.6.3.6  PCB Stackup
        7. 7.6.3.7  Placement
        8. 7.6.3.8  DDR3 Keepout Region
        9. 7.6.3.9  Bulk Bypass Capacitors
        10. 7.6.3.10 High-Speed Bypass Capacitors
          1. 7.6.3.10.1 Return Current Bypass Capacitors
        11. 7.6.3.11 Net Classes
        12. 7.6.3.12 DDR3 Signal Termination
        13. 7.6.3.13 VREF_DDR Routing
        14. 7.6.3.14 VTT
        15. 7.6.3.15 CK and ADDR_CTRL Topologies and Routing Definition
          1. 7.6.3.15.1 Four DDR3 Devices
            1. 7.6.3.15.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. 7.6.3.15.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. 7.6.3.15.2 Two DDR3 Devices
            1. 7.6.3.15.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. 7.6.3.15.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. 7.6.3.15.3 One DDR3 Device
            1. 7.6.3.15.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
            2. 7.6.3.15.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
        16. 7.6.3.16 Data Topologies and Routing Definition
          1. 7.6.3.16.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
          2. 7.6.3.16.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
        17. 7.6.3.17 Routing Specification
          1. 7.6.3.17.1 CK and ADDR_CTRL Routing Specification
          2. 7.6.3.17.2 DQS and DQ Routing Specification
  8. 8Device and Documentation Support
    1. 8.1  Device Nomenclature
      1. 8.1.1 Standard Package Symbolization
      2. 8.1.2 Device Naming Convention
    2. 8.2  Tools and Software
    3. 8.3  Documentation Support
      1. 8.3.1 FCC Warning
      2. 8.3.2 Information About Cautions and Warnings
    4. 8.4  Receiving Notification of Documentation Updates
    5. 8.5  Related Links
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ACD|784
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.3.1 VIP

NOTE

For more information, see the Video Input Port (VIP) section of the Device TRM.

CAUTION

The I/O timings provided in Section 5.10, Timing Requirements and Switching Characteristics are applicable for all combinations of signals for vin1. However, the timings are only valid for vin2, vin3, and vin4 if signals within a single IOSET are used. The IOSETs are defined in the Table 5-31, Table 5-32, and Table 5-33.

Table 4-2 VIP Signal Descriptions

SIGNAL NAME DESCRIPTION TYPE BALL
Video Input 1
vin1a_clk0 Video Input 1 Port A Clock input. Input clock for 8-bit 16-bit or 24-bit Port A video capture. Input data is sampled on the CLK0 edge. I AD8
vin1a_d0 Video Input 1 Port A Data input (1) I AE9
vin1a_d1 Video Input 1 Port A Data input (1) I AF10
vin1a_d2 Video Input 1 Port A Data input (1) I AE7
vin1a_d3 Video Input 1 Port A Data input (1) I AE8
vin1a_d4 Video Input 1 Port A Data input (1) I AE6
vin1a_d5 Video Input 1 Port A Data input (1) I AF7
vin1a_d6 Video Input 1 Port A Data input (1) I AF8
vin1a_d7 Video Input 1 Port A Data input (1) I AF6
vin1a_d8 Video Input 1 Port A Data input (1) I AF4
vin1a_d9 Video Input 1 Port A Data input (1) I AF2
vin1a_d10 Video Input 1 Port A Data input (1) I AF3
vin1a_d11 Video Input 1 Port A Data input (1) I AF5
vin1a_d12 Video Input 1 Port A Data input (1) I AE5
vin1a_d13 Video Input 1 Port A Data input (1) I AF1
vin1a_d14 Video Input 1 Port A Data input (1) I AD6
vin1a_d15 Video Input 1 Port A Data input (1) I AE3
vin1a_d16 Video Input 1 Port A Data input (1) I AE4
vin1a_d17 Video Input 1 Port A Data input (1) I AE1
vin1a_d18 Video Input 1 Port A Data input (1) I AD5
vin1a_d19 Video Input 1 Port A Data input (1) I AD3
vin1a_d20 Video Input 1 Port A Data input (1) I AD4
vin1a_d21 Video Input 1 Port A Data input (1) I AE2
vin1a_d22 Video Input 1 Port A Data input (1) I AD1
vin1a_d23 Video Input 1 Port A Data input (1) I AD2
vin1a_de0 Video Input 1 Data Enable input (1) I AC9
vin1a_fld0 Video Input 1 Port A Field ID input (1) I AD9
vin1a_hsync0 Video Input 1 Port A Horizontal Sync input (1) I AC10
vin1a_vsync0 Video Input 1 Port A Vertical Sync input (1) I AD7
vin1b_clk1 Video Input 1 Port B Clock input (1) I AC8
vin1b_d0 Video Input 1 Port B Data input (1) I AD2, AE3
vin1b_d1 Video Input 1 Port B Data input (1) I AD1, AD6
vin1b_d2 Video Input 1 Port B Data input (1) I AE2, AF1
vin1b_d3 Video Input 1 Port B Data input (1) I AD4, AE5
vin1b_d4 Video Input 1 Port B Data input (1) I AD3, AF5
vin1b_d5 Video Input 1 Port B Data input (1) I AD5, AF3
vin1b_d6 Video Input 1 Port B Data input (1) I AE1, AF2
vin1b_d7 Video Input 1 Port B Data input (1) I AE4, AF4
vin1b_de1 Video Input 1 Port B Data Enable input (1) I AD7, M4
vin1b_fld1 Video Input 1 Port B Field ID input (1) I AC10
vin1b_hsync1 Video Input 1 Port B Horizontal Sync input (1) I AC9, N3
vin1b_vsync1 Video Input 1 Port B Vertical Sync input (1) I AD9
Video Input 2
vin2a_clk0 Video Input 2 Port A Clock input I F1, V1
vin2a_d0 Video Input 2 Port A Data input I F2, U3
vin2a_d1 Video Input 2 Port A Data input I E3, V2
vin2a_d2 Video Input 2 Port A Data input I E1, Y1
vin2a_d3 Video Input 2 Port A Data input I E2, T6
vin2a_d4 Video Input 2 Port A Data input I D2, U5
vin2a_d5 Video Input 2 Port A Data input I F3, U4
vin2a_d6 Video Input 2 Port A Data input I D1, V4
vin2a_d7 Video Input 2 Port A Data input I E4, W2
vin2a_d8 Video Input 2 Port A Data input I G3, V3
vin2a_d9 Video Input 2 Port A Data input I C5, Y2
vin2a_d10 Video Input 2 Port A Data input I D3, T5
vin2a_d11 Video Input 2 Port A Data input I F4, U2
vin2a_d12 Video Input 2 Port A Data input I E6
vin2a_d13 Video Input 2 Port A Data input I C1
vin2a_d14 Video Input 2 Port A Data input I C2
vin2a_d15 Video Input 2 Port A Data input I C3
vin2a_d16 Video Input 2 Port A Data input I B2
vin2a_d17 Video Input 2 Port A Data input I B5
vin2a_d18 Video Input 2 Port A Data input I D4
vin2a_d19 Video Input 2 Port A Data input I A3
vin2a_d20 Video Input 2 Port A Data input I B3
vin2a_d21 Video Input 2 Port A Data input I B4
vin2a_d22 Video Input 2 Port A Data input I C4
vin2a_d23 Video Input 2 Port A Data input I A4
vin2a_de0 Video Input 2 Port A Data Enable input I G2, T4
vin2a_fld0 Video Input 2 Port A Field ID input I D5, G2, W1
vin2a_hsync0 Video Input 2 Port A Horizontal Sync input I G1, T3
vin2a_vsync0 Video Input 2 Port A Vertical Sync input I E5, U6
vin2b_clk1 Video Input 2 Port B Clock input I AA5, D5
vin2b_d0 Video Input 2 Port B Data input I A4, AB5
vin2b_d1 Video Input 2 Port B Data input I AA6, C4
vin2b_d2 Video Input 2 Port B Data input I AC4, B4
vin2b_d3 Video Input 2 Port B Data input I AC6, B3
vin2b_d4 Video Input 2 Port B Data input I A3, W6
vin2b_d5 Video Input 2 Port B Data input I D4, Y6
vin2b_d6 Video Input 2 Port B Data input I AC7, B5
vin2b_d7 Video Input 2 Port B Data input I AC3, B2
vin2b_de1 Video Input 2 Port B Data Enable input I AB7, G2
vin2b_fld1 Video Input 2 Port B Field ID input I G2
vin2b_hsync1 Video Input 2 Port B Horizontal Sync input I AC5, G1
vin2b_vsync1 Video Input 2 Port B Vertical Sync input I AB4, E5
Video Input 3
vin3a_clk0 Video Input 3 Port A Clock input I AC8, B10, P1
vin3a_d0 Video Input 3 Port A Data input I AE4, B7, N5
vin3a_d1 Video Input 3 Port A Data input I AE1, B8, M2
vin3a_d2 Video Input 3 Port A Data input I A6, AD5, L5
vin3a_d3 Video Input 3 Port A Data input I A7, AD3, M1
vin3a_d4 Video Input 3 Port A Data input I AD4, C9, K6
vin3a_d5 Video Input 3 Port A Data input I A8, AE2, L4
vin3a_d6 Video Input 3 Port A Data input I AD1, B9, L3
vin3a_d7 Video Input 3 Port A Data input I A9, AD2, L2
vin3a_d8 Video Input 3 Port A Data input I B2, E8, L1
vin3a_d9 Video Input 3 Port A Data input I B5, D8, K1
vin3a_d10 Video Input 3 Port A Data input I D4, D6, J1
vin3a_d11 Video Input 3 Port A Data input I A3, D7, J2
vin3a_d12 Video Input 3 Port A Data input I A5, B3, H1
vin3a_d13 Video Input 3 Port A Data input I B4, B6, K2
vin3a_d14 Video Input 3 Port A Data input I C4, C8, H2
vin3a_d15 Video Input 3 Port A Data input I A4, C7, K3
vin3a_d16 Video Input 3 Port A Data input I F9, P6
vin3a_d17 Video Input 3 Port A Data input I E10, J6
vin3a_d18 Video Input 3 Port A Data input I D9, R4
vin3a_d19 Video Input 3 Port A Data input I C6, R5
vin3a_d20 Video Input 3 Port A Data input I E9, M6
vin3a_d21 Video Input 3 Port A Data input I F8, K4
vin3a_d22 Video Input 3 Port A Data input I F7, P5
vin3a_d23 Video Input 3 Port A Data input I E7, N6
vin3a_de0 Video Input 3 Port A Data Enable input I B3, C10, J5
vin3a_fld0 Video Input 3 Port A Field ID input I B4, D11, K5
vin3a_hsync0 Video Input 3 Port A Horizontal Sync input I A10, C4, N4
vin3a_vsync0 Video Input 3 Port A Vertical Sync input I A4, D10, R3
vin3b_clk1 Video Input 3 Port B Clock input I L6, M4
vin3b_d0 Video Input 3 Port B Data input I H6
vin3b_d1 Video Input 3 Port B Data input I G6
vin3b_d2 Video Input 3 Port B Data input I J4
vin3b_d3 Video Input 3 Port B Data input I F5
vin3b_d4 Video Input 3 Port B Data input I G5
vin3b_d5 Video Input 3 Port B Data input I J3
vin3b_d6 Video Input 3 Port B Data input I H4
vin3b_d7 Video Input 3 Port B Data input I H3
vin3b_de1 Video Input 3 Port B Data Enable input I N3
vin3b_fld1 Video Input 3 Port A Field ID input I M4
vin3b_hsync1 Video Input 3 Port A Horizontal Sync input I H5
vin3b_vsync1 Video Input 3 Port A Vertical Sync input I G4
Video Input 4
vin4a_clk0 Video Input 4 Port A Clock input I B10, B25, P4
vin4a_d0 Video Input 4 Port A Data input I A13, B7, P6
vin4a_d1 Video Input 4 Port A Data input I B8, F14, J6
vin4a_d2 Video Input 4 Port A Data input I A6, E13, R4
vin4a_d3 Video Input 4 Port A Data input I A7, E11, R5
vin4a_d4 Video Input 4 Port A Data input I C9, E12, M6
vin4a_d5 Video Input 4 Port A Data input I A8, D13, K4
vin4a_d6 Video Input 4 Port A Data input I B9, C11, P5
vin4a_d7 Video Input 4 Port A Data input I A9, D12, N6
vin4a_d8 Video Input 4 Port A Data input I E15, E8, T2
vin4a_d9 Video Input 4 Port A Data input I A19, D8, U1
vin4a_d10 Video Input 4 Port A Data input I B14, D6, P3
vin4a_d11 Video Input 4 Port A Data input I A14, D7, R1
vin4a_d12 Video Input 4 Port A Data input I A5, D15, H6
vin4a_d13 Video Input 4 Port A Data input I B15, B6, G6
vin4a_d14 Video Input 4 Port A Data input I B16, C8, J4
vin4a_d15 Video Input 4 Port A Data input I A16, C7, F5
vin4a_d16 Video Input 4 Port A Data input I C17, F9
vin4a_d17 Video Input 4 Port A Data input I A20, E10
vin4a_d18 Video Input 4 Port A Data input I D16, D9
vin4a_d19 Video Input 4 Port A Data input I C6, D17
vin4a_d20 Video Input 4 Port A Data input I AA3, E9
vin4a_d21 Video Input 4 Port A Data input I AB6, F8
vin4a_d22 Video Input 4 Port A Data input I AB3, F7
vin4a_d23 Video Input 4 Port A Data input I AA4, E7
vin4a_de0 Video Input 4 Port A Data Enable input I A22, C10, G4, L6
vin4a_fld0 Video Input 4 Port A Field ID input I D11, F18, G5, K5
vin4a_hsync0 Video Input 4 Port A Horizontal Sync input I A10, E21, L6, R2
vin4a_vsync0 Video Input 4 Port A Vertical Sync input I D10, F17, N1, R6
vin4b_clk1 Video Input 4 Port B Clock input I J5, V1
vin4b_d0 Video Input 4 Port B Data input I P6, U3
vin4b_d1 Video Input 4 Port B Data input I J6, V2
vin4b_d2 Video Input 4 Port B Data input I R4, Y1
vin4b_d3 Video Input 4 Port B Data input I R5, T6
vin4b_d4 Video Input 4 Port B Data input I M6, U5
vin4b_d5 Video Input 4 Port B Data input I K4, U4
vin4b_d6 Video Input 4 Port B Data input I P5, V4
vin4b_d7 Video Input 4 Port B Data input I N6, W2
vin4b_de1 Video Input 4 Port B Data Enable input I K5, T4
vin4b_fld1 Video Input 4 Port B Field ID input I P4, W1
vin4b_hsync1 Video Input 4 Port B Horizontal Sync input I N4, T3
vin4b_vsync1 Video Input 4 Port B Vertical Sync input I R3, U6
  1. The VIP1 interface (Video Input 1a and Video Input 1b in Table 4-2) signal sets are NOT supported in the DRA76xP device. For more details on the device differentiation, refer to the Table 3-1, Device Comparison.