SPRS975H August 2016 – February 2020 DRA780 , DRA781 , DRA782 , DRA783 , DRA785 , DRA786 , DRA787 , DRA788
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
Figure 7-33 shows the required placement for the processor as well as the DDR3 devices. The dimensions for this figure are defined in Table 7-27. The placement does not restrict the side of the PCB on which the devices are mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and allow for proper routing space. For a 16-bit DDR memory system, the high-word DDR3 devices are omitted from the placement.
No. | PARAMETER | MIN | MAX | UNIT |
---|---|---|---|---|
KOD31 | X1 | 1700 | Mils | |
KOD34 | Y1 | 1800 | Mils | |
KOD35 | Y2 | 600 | Mils | |
KOD36 | DDR3 keepout region(1) | |||
KOD37 | Clearance from non-DDR3 signal to DDR3 keepout region (2)(3) | 4 | W |