SPRSP57E april   2020  – june 2023 DRA821U , DRA821U-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Revision History
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
      1. 6.3.1  ADC
        1. 6.3.1.1 MCU Domain
      2. 6.3.2  DDRSS
        1. 6.3.2.1 MAIN Domain
        2. 6.3.2.2 DDRSS Mapping
      3. 6.3.3  GPIO
        1. 6.3.3.1 MAIN Domain
        2. 6.3.3.2 WKUP Domain
      4. 6.3.4  I2C
        1. 6.3.4.1 MAIN Domain
        2. 6.3.4.2 MCU Domain
        3. 6.3.4.3 WKUP Domain
      5. 6.3.5  I3C
        1. 6.3.5.1 MAIN Domain
        2. 6.3.5.2 MCU Domain
      6. 6.3.6  MCAN
        1. 6.3.6.1 MAIN Domain
        2. 6.3.6.2 MCU Domain
      7. 6.3.7  MCSPI
        1. 6.3.7.1 MAIN Domain
        2. 6.3.7.2 MCU Domain
      8. 6.3.8  UART
        1. 6.3.8.1 MAIN Domain
        2. 6.3.8.2 MCU Domain
        3. 6.3.8.3 WKUP Domain
      9. 6.3.9  MDIO
        1. 6.3.9.1 MCU Domain
        2. 6.3.9.2 MAIN Domain
      10. 6.3.10 CPSW2G
        1. 6.3.10.1 MCU Domain
      11. 6.3.11 CPSW5G
        1. 6.3.11.1 MAIN Domain
      12. 6.3.12 ECAP
        1. 6.3.12.1 MAIN Domain
      13. 6.3.13 EQEP
        1. 6.3.13.1 MAIN Domain
      14. 6.3.14 EPWM
        1. 6.3.14.1 MAIN Domain
      15. 6.3.15 USB
        1. 6.3.15.1 MAIN Domain
      16. 6.3.16 SERDES
        1. 6.3.16.1 MAIN Domain
      17. 6.3.17 OSPI
        1. 6.3.17.1 MCU Domain
      18. 6.3.18 Hyperbus
        1. 6.3.18.1 MCU Domain
      19. 6.3.19 GPMC
        1. 6.3.19.1 MAIN Domain
      20. 6.3.20 MMC
        1. 6.3.20.1 MAIN Domain
      21. 6.3.21 CPTS
        1. 6.3.21.1 MAIN Domain
        2. 6.3.21.2 MCU Domain
      22. 6.3.22 MCASP
        1. 6.3.22.1 MAIN Domain
      23. 6.3.23 DMTIMER
        1. 6.3.23.1 MAIN Domain
        2. 6.3.23.2 MCU Domain
      24. 6.3.24 Emulation and Debug
        1. 6.3.24.1 MAIN Domain
      25. 6.3.25 System and Miscellaneous
        1. 6.3.25.1 Boot Mode Configuration
          1. 6.3.25.1.1 MAIN Domain
          2. 6.3.25.1.2 MCU Domain
        2. 6.3.25.2 Clock
          1. 6.3.25.2.1 MAIN Domain
          2. 6.3.25.2.2 WKUP Domain
        3. 6.3.25.3 System
          1. 6.3.25.3.1 MAIN Domain
          2. 6.3.25.3.2 WKUP Domain
          3. 6.3.25.3.3 VMON
        4. 6.3.25.4 EFUSE
      26. 6.3.26 Power Supply
    4. 6.4 Pin Multiplexing
    5. 6.5 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Power-On-Hours (POH)
    5. 7.5 Operating Performance Points
    6. 7.6 Electrical Characteristics
      1. 7.6.1  I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.6.2  Fail-Safe Reset (FS Reset) Electrical Characteristics
      3. 7.6.3  HFOSC Electrical Characteristics
      4. 7.6.4  eMMCPHY Electrical Characteristics
      5. 7.6.5  SDIO Electrical Characteristics
      6. 7.6.6  ADC12BT Electrical Characteristics
      7. 7.6.7  LVCMOS Electrical Characteristics
      8. 7.6.8  USB2PHY Electrical Characteristics
      9. 7.6.9  SERDES Electrical Characteristics
      10. 7.6.10 DDR Electrical Characteristics
    7. 7.7 VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.7.2 Hardware Requirements
      3. 7.7.3 Programming Sequence
      4. 7.7.4 Impact to Your Hardware Warranty
    8. 7.8 Thermal Resistance Characteristics
      1. 7.8.1 Thermal Resistance Characteristics
    9. 7.9 Timing and Switching Characteristics
      1. 7.9.1 Timing Parameters and Information
      2. 7.9.2 Power Supply Sequencing
        1. 7.9.2.1 Power Supply Slew Rate Requirement
        2. 7.9.2.2 Combined MCU and Main Domains Power- Up Sequencing
        3. 7.9.2.3 Combined MCU and Main Domains Power- Down Sequencing
        4. 7.9.2.4 Independent MCU and Main Domains Power- Up Sequencing
        5. 7.9.2.5 Independent MCU and Main Domains Power- Down Sequencing
        6. 7.9.2.6 Independent MCU and Main Domains, Entry and Exit of MCU Only Sequencing
        7. 7.9.2.7 Independent MCU and Main Domains, Entry and Exit of DDR Retention State
        8. 7.9.2.8 Independent MCU and Main Domains, Entry and Exit of GPIO Retention Sequencing
      3. 7.9.3 System Timing
        1. 7.9.3.1 Reset Timing
        2. 7.9.3.2 Safety Signal Timing
        3. 7.9.3.3 Clock Timing
      4. 7.9.4 Clock Specifications
        1. 7.9.4.1 Input Clocks / Oscillators
          1. 7.9.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 7.9.4.1.1.1 Load Capacitance
            2. 7.9.4.1.1.2 Shunt Capacitance
          2. 7.9.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 7.9.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 7.9.4.1.3.1 Load Capacitance
            2. 7.9.4.1.3.2 Shunt Capacitance
          4. 7.9.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 7.9.4.1.5 Auxiliary OSC1 Not Used
          6. 7.9.4.1.6 WKUP_LF_CLKIN Internal Oscillator Clock Source
          7. 7.9.4.1.7 WKUP_LF_CLKIN Not Used
        2. 7.9.4.2 Output Clocks
        3. 7.9.4.3 PLLs
        4. 7.9.4.4 Recommended Clock and Control Signal Transition Behavior
        5. 7.9.4.5 Interface Clock Specifications
          1. 7.9.4.5.1 Interface Clock Terminology
          2. 7.9.4.5.2 Interface Clock Frequency
      5. 7.9.5 Peripherals
        1. 7.9.5.1  ATL
          1. 7.9.5.1.1 ATL_PCLK Timing Requirements
          2. 7.9.5.1.2 ATL_AWS[x] Timing Requirements
          3. 7.9.5.1.3 ATL_BWS[x] Timing Requirements
          4. 7.9.5.1.4 ATCLK[x] Switching Characteristics
        2. 7.9.5.2  CPSW2G
          1. 7.9.5.2.1 CPSW2G RMII Timings
            1. 7.9.5.2.1.1 Timing Requirements for RMII[x]_REFCLK – RMII Mode
            2. 7.9.5.2.1.2 Timing Requirements for RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RXER – RMII Mode
            3. 7.9.5.2.1.3 Switching Characteristics for RMII[x]_TXD[1:0], and RMII[x]_TXEN – RMII Mode
          2. 7.9.5.2.2 CPSW2G RGMII Timings
            1. 7.9.5.2.2.1 Timing Requirements for RGMII[x]_RCLK – RGMII Mode
            2. 7.9.5.2.2.2 Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 7.9.5.2.2.3 Switching Characteristics for RGMII[x]_TCLK – RGMII Mode
            4. 7.9.5.2.2.4 Switching Characteristics for RGMII[x]_TD[3:0], and RGMII[x]_TCTL – RGMII Mode
        3. 7.9.5.3  CPSW5G
          1. 7.9.5.3.1 CPSW5G MDIO Interface Timings
          2. 7.9.5.3.2 CPSW5G RMII Timings
            1. 7.9.5.3.2.1 Timing Requirements for RMII[x]_REFCLK – RMII Mode
            2. 7.9.5.3.2.2 Timing Requirements for RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RXER – RMII Mode
            3. 7.9.5.3.2.3 Switching Characteristics for RMII[x]_TXD[1:0], and RMII[x]_TXEN – RMII Mode
          3. 7.9.5.3.3 CPSW5G RGMII Timings
            1. 7.9.5.3.3.1 Timing Requirements for RGMII[x]_RCLK – RGMII Mode
            2. 7.9.5.3.3.2 Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 7.9.5.3.3.3 Switching Characteristics for RGMII[x]_TCLK – RGMII Mode
            4. 7.9.5.3.3.4 Switching Characteristics for RGMII[x]_TD[3:0], and RGMII[x]_TCTL – RGMII Mode
        4. 7.9.5.4  DDRSS
        5. 7.9.5.5  ECAP
          1. 7.9.5.5.1 Timing Requirements for ECAP
          2. 7.9.5.5.2 Switching Characteristics for ECAP
        6. 7.9.5.6  EPWM
          1. 7.9.5.6.1 Timing Requirements for EPWM
          2. 7.9.5.6.2 Switching Characteristics for EPWM
        7. 7.9.5.7  EQEP
          1. 7.9.5.7.1 Timing Requirements for EQEP
          2. 7.9.5.7.2 Switching Characteristics for EQEP
        8. 7.9.5.8  GPIO
        9. 7.9.5.9  GPMC
          1. 7.9.5.9.1 GPMC and NOR Flash — Synchronous Mode
            1. 7.9.5.9.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 7.9.5.9.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 7.9.5.9.2 GPMC and NOR Flash — Asynchronous Mode
            1. 7.9.5.9.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 7.9.5.9.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 7.9.5.9.3 GPMC and NAND Flash — Asynchronous Mode
            1. 7.9.5.9.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 7.9.5.9.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
        10. 7.9.5.10 HyperBus
          1. 7.9.5.10.1 Timing Requirements for HyperBus Initialization
          2. 7.9.5.10.2 HyperBus 166 MHz Switching Characteristics
          3. 7.9.5.10.3 HyperBus 100 MHz Switching Characteristics
        11. 7.9.5.11 I2C
        12. 7.9.5.12 I3C
        13. 7.9.5.13 MCAN
        14. 7.9.5.14 MCASP
          1. 7.9.5.14.1 Timing Requirements for MCASP
        15. 7.9.5.15 MCSPI
          1. 7.9.5.15.1 MCSPI — Controller Mode
          2. 7.9.5.15.2 MCSPI — Peripheral Mode
        16. 7.9.5.16 eMMC/SD/SDIO
          1. 7.9.5.16.1 MMCSD0 - eMMC Interface
            1. 7.9.5.16.1.1 Legacy SDR Mode
            2. 7.9.5.16.1.2 High Speed SDR Mode
            3. 7.9.5.16.1.3 High Speed DDR Mode
            4. 7.9.5.16.1.4 HS200 Mode
            5. 7.9.5.16.1.5 HS400 Mode
          2. 7.9.5.16.2 MMCSDi — MMCSD1 — SD/SDIO Interface
            1. 7.9.5.16.2.1 Default speed Mode
            2. 7.9.5.16.2.2 High Speed Mode
            3. 7.9.5.16.2.3 UHS–I SDR12 Mode
            4. 7.9.5.16.2.4 UHS–I SDR25 Mode
            5. 7.9.5.16.2.5 UHS–I SDR50 Mode
            6. 7.9.5.16.2.6 UHS–I DDR50 Mode
            7. 7.9.5.16.2.7 UHS–I SDR104 Mode
        17. 7.9.5.17 NAVSS
          1. 7.9.5.17.1 Timing Requirements for CPTS Input
          2. 7.9.5.17.2 Switching Characteristics for CPTS Output
        18. 7.9.5.18 OSPI
          1. 7.9.5.18.1 OSPI With Data Training
            1. 7.9.5.18.1.1 OSPI Switching Characteristics – Data Training
          2. 7.9.5.18.2 OSPI Without Data Training
            1. 7.9.5.18.2.1 OSPI Switching Characteristics – DDR Mode
            2. 7.9.5.18.2.2 OSPI Switching Characteristics – SDR Mode
            3. 7.9.5.18.2.3 OSPI Timing Requirements – DDR Mode
            4. 7.9.5.18.2.4 OSPI Timing Requirements – SDR Mode
        19. 7.9.5.19 PCIE
        20. 7.9.5.20 Timers
          1. 7.9.5.20.1 Timing Requirements for Timers
          2. 7.9.5.20.2 Switching Characteristics for Timers
        21. 7.9.5.21 UART
          1. 7.9.5.21.1 UART Timing Requirements
          2. 7.9.5.21.2 UART Switching Characteristics
        22. 7.9.5.22 USB
      6. 7.9.6 Emulation and Debug
        1. 7.9.6.1 Debug Trace
        2. 7.9.6.2 IEEE 1149.1 Standard–Test–Access Port (JTAG)
          1. 7.9.6.2.1 JTAG Electrical Data and Timing
            1. 7.9.6.2.1.1 Timing Requirements for IEEE 1149.1 JTAG
            2. 7.9.6.2.1.2 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-A72
      2. 8.2.2 Arm Cortex-R5F
    3. 8.3 Other Subsystems
      1. 8.3.1 MSMC
      2. 8.3.2 NAVSS
        1. 8.3.2.1 NAVSS0
        2. 8.3.2.2 MCU_NAVSS
      3. 8.3.3 PDMA Controller
      4. 8.3.4 Peripherals
        1. 8.3.4.1  ADC
        2. 8.3.4.2  ATL
        3. 8.3.4.3  CPSW2G
        4. 8.3.4.4  CPSW5G
        5. 8.3.4.5  DCC
        6. 8.3.4.6  DDRSS
        7. 8.3.4.7  ECAP
        8. 8.3.4.8  EPWM
        9. 8.3.4.9  ELM
        10. 8.3.4.10 ESM
        11. 8.3.4.11 EQEP
        12. 8.3.4.12 GPIO
        13. 8.3.4.13 GPMC
        14. 8.3.4.14 Hyperbus
        15. 8.3.4.15 I2C
        16. 8.3.4.16 I3C
        17. 8.3.4.17 MCAN
        18. 8.3.4.18 MCASP
        19. 8.3.4.19 MCRC Controller
        20. 8.3.4.20 MCSPI
        21. 8.3.4.21 MMC/SD
        22. 8.3.4.22 OSPI
        23. 8.3.4.23 PCIE
        24. 8.3.4.24 SerDes
        25. 8.3.4.25 WWDT
        26. 8.3.4.26 Timers
        27. 8.3.4.27 UART
        28. 8.3.4.28 USB
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Power Supply Mapping
    2. 9.2 Device Connection and Layout Fundamentals
      1. 9.2.1 Power Supply Decoupling and Bulk Capacitors
        1. 9.2.1.1 Power Distribution Network Implementation Guidance
      2. 9.2.2 External Oscillator
      3. 9.2.3 JTAG and EMU
      4. 9.2.4 Reset
      5. 9.2.5 Unused Pins
      6. 9.2.6 Hardware Design Guide for JacintoTM 7 Devices
    3. 9.3 Peripheral- and Interface-Specific Design Information
      1. 9.3.1 LPDDR4 Board Design and Layout Guidelines
      2. 9.3.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 9.3.2.1 No Loopback and Internal Pad Loopback
        2. 9.3.2.2 External Board Loopback
        3. 9.3.2.3 DQS (only available in Octal Flash devices)
      3. 9.3.3 USB VBUS Design Guidelines
      4. 9.3.4 System Power Supply Monitor Design Guidelines
      5. 9.3.5 High Speed Differential Signal Routing Guidance
      6. 9.3.6 Thermal Solution Guidance
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALM|433
Thermal pad, mechanical data (Package|Pins)
Orderable Information
7.9.5.16.2 MMCSDi — MMCSD1 — SD/SDIO Interface
Note:

The MMCSDi (i = 1) controller is also referred to as MMCi.

MMCSDi interface is compliant with the SD Host Controller Standard Specification 4.10 and SD Physical Layer Specification v3.01 as well as SDIO Specification v3.00 and it supports the following SD Card applications:

  • Default speed
  • High speed
  • UHS–I SDR12
  • UHS–I SDR25
  • UHS–I SDR50
  • UHS–I SDR104
  • UHS–I DDR50

Table 7-64 presents the required delay software configuration settings for MMC1 timing modes.

Table 7-64 MMC1 Delay Mapping for All Timing Modes
REGISTER NAME MMCSD12_SS_PHY_CTRL_4_REG MMCSD12_SS_PHY_CTRL_5_REG
BIT FIELD [20] [15:12] [8] [4:0] [2:0]
BIT FIELD NAME OTAPDLYENA OTAPDLYSEL ITAPDLYENA ITAPDLYSEL CLKBUFSEL
MODE DESCRIPTION DELAY
ENABLE		 DELAY
VALUE 		INPUT
DELAY
ENABLE 		INPUT
DELAY
VALUE		 DELAY
BUFFER
DURATION
Default
Speed		 4-bit PHY operating
3.3 V, 25 MHz		 0x1 0x0 0x0 0x0 0x7
High
Speed		 4-bit PHY operating
3.3 V, 50 MHz		 0x1 0x0 0x0 0x0 0x7
UHS-I
SDR12		 4-bit PHY operating
1.8 V, 25 MHz		 0x1 0xF 0x0 0x0 0x7
UHS-I
SDR25		 4-bit PHY operating
1.8 V, 50 MHz		 0x1 0xF 0x0 0x0 0x7
UHS-I
SDR50		 4-bit PHY operating
1.8 V, 100 MHz		 0x1 0xC 0x1 Tuning 0x7
UHS-I
DDR50		 4-bit PHY operating
1.8 V, 50 MHz		 0x1 0xC 0x1 Tuning 0x7
UHS-I
SDR104		 4-bit PHY operating
1.8, V 200 MHz		 0x1 0x5 0x1 Tuning 0x7

Table 7-84 represents MMCSD1 timing conditions.

Table 7-65 MMCSD1 Timing Conditions
PARAMETER DESCRIPTION MODE MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate Default Speed, High Speed 0.69 2.06 V/ns
UHS-I SDR12, UHS-I SDR25 0.34 1.34 V/ns
OUTPUT CONDITIONS
CL Output load capacitance All Speed Modes 1 10 pF
PCB CONNECTIVITY REQUIREMENTS
td(Trace Delay) Propagation delay of each trace Default Speed, High Speed 126 1200 ps
UHS-I DDR50 255 1134 ps
All Other Modes 134 1276 ps
td(Trace Mismatch Delay) Propagation delay mismatch across all traces UHS-I DDR50 20 ps
UHS-I SDR104 8 ps
All Other Modes 100 ps