SLAS955A March   2013  – July 2015 DRV10963

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Speed Input and Control
      2. 7.3.2  Spin up Settings
      3. 7.3.3  Motor Direction Change
      4. 7.3.4  Motor Frequency Feedback (FG)
      5. 7.3.5  Lock Detection
        1. 7.3.5.1 Lock1: Frequency Overflow
        2. 7.3.5.2 Lock2: BEMF Abnormal
        3. 7.3.5.3 Lock3: Speed Abnormal
        4. 7.3.5.4 Open Loop Stuck
      6. 7.3.6  Soft Current Limit
      7. 7.3.7  Short Circuit Current Protection
      8. 7.3.8  Anti-Voltage Surge (AVS)
        1. 7.3.8.1 Protecting Against the Return of Mechanical Energy
        2. 7.3.8.2 Protecting Against the Return of Inductive Energy
      9. 7.3.9  Control Advance Angle
      10. 7.3.10 Overtemperature Protection
      11. 7.3.11 Undervoltage Protection
      12. 7.3.12 OTP Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Standby Mode and Sleep Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VCC Pin supply voltage –0.3 6 V
Motor phase pins (U, V, W) –1 7.7 V
Direction, speed indicator input, and speed input (FR, FGS, PWM) –0.3 6 V
Speed output (FG) –0.3 7.7 V
TJ Junction temperature –40 150 °C
TSDR Maximum lead soldering temperature, 10 seconds 260 °C
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC VCC Pin supply voltage 2.1 5.5 V
U, V, W Motor phase pins –0.1 7 V
FR, FGS, PWM Direction, speed indicator input, and speed input –0.1 5.5 V
FG Speed output –0.1 7.5 V
TJ Junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) DRV10963 UNIT
DSN (USON)
10 PINS
RθJA Junction-to-ambient thermal resistance 40.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 46.6 °C/W
RθJB Junction-to-board thermal resistance 15.8 °C/W
ψJT Junction-to-top characterization parameter 0.5 °C/W
ψJB Junction-to-board characterization parameter 16 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

(VCC = 5 V, TA = 25°C unless otherwise noted)
PARAMETER TEST CONDITION MIN TYP MAX UNIT
SUPPLY CURRENT
IVCC Operating current PWM = VCC, no motor connected 5.5 mA
IVCC_SLEEP Sleep current PWM = 0 V 15 20 µA
UVLO
VUVLO_H Undervoltage threshold high 2 2.1 V
VUVLO_L Undervoltage threshold low 1.7 1.8 V
VUVLO_HYS Undervoltage threshold hysteresis 100 200 300 mV
INTEGRATED MOSFET
RDSON Series resistance (H+L) VCC = 5 V; IOUT = 0.5 A 1 1.5 Ω
PWM
VIH_PWM Input high threshold 2.3 V
VIL_PWM Input low threshold 0.8 V
FPWM PWM input frequency Duty cycle >0% and <100% 15 100 kHz
RPU_PWM_VCC PWM pin pullup resistor Active Mode 50 kΩ
Standby Mode 2 MΩ
TSLEEP Sleep entry time PWM = 0 V 500 µs
FG
IOL_FG FG sink current VFG = 0.3 V 5 mA
ISC_FG FG short circuit current VFG = 5 V 13 25 mA
FGS and FR
VIH_FGS Input high threshold 2.3 V
VIL_FGS Input low threshold 0.8 V
VIH_FR Input high threshold 2.3 V
VIL_FR Input low threshold 0.8 V
RPU_FGS_VCC FGS pin pullup resistor Active Mode 50 kΩ
Standby Mode 2 MΩ
RPU_FR_VCC FR pin pullup resistor 500 kΩ
LOCK PROTECTION
TON_LOCK Lock detect time 0.3 s
TOFF_LOCK Lock release time 5 s
CURRENT LIMIT
ILIMIT Soft current limit value 500 mA
SHORT CIRCUIT CURRENT PROTECTION [ILIMIT [2:0] = 4
ISHT Short circuit current protection 1.8 A
THERMAL SHUTDOWN
TSD Thermal shutdown temperature 160 °C
TSD_HYS Thermal shutdown hysteresis 10 °C

6.6 Typical Characteristics

DRV10963 C001_SLAS955.png
Figure 1. RDS(ON) vs Power Supply at 25°C