SLVSDN2E January   2018  – March 2021 DRV10974

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Speed Input and Control
      2. 7.3.2 Motor Direction Change
      3. 7.3.3 Motor-Frequency Feedback (FG)
      4. 7.3.4 Lock Detection
        1. 7.3.4.1 Lock Kt Measure
        2. 7.3.4.2 Lock No Motor
        3. 7.3.4.3 Lock Open Loop Abnormal
        4. 7.3.4.4 Lock BEMF Abnormal
        5. 7.3.4.5 Lock Closed Loop Abnormal
        6. 7.3.4.6 Lock Speed Abnormal
      5. 7.3.5 Soft Current-Limit
      6. 7.3.6 Short-Circuit Current Protection
      7. 7.3.7 Overtemperature Protection
      8. 7.3.8 Undervoltage Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Spin-Up Settings
        1. 7.4.1.1 Motor Start
        2. 7.4.1.2 Initial Speed Detect
        3. 7.4.1.3 Align
      2. 7.4.2 Open-Loop Acceleration
      3. 7.4.3 Start-Up Current Sensing
      4. 7.4.4 Closed Loop
      5. 7.4.5 Control Advance Angle
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

  • Use thick traces when routing to the VCC, GND, U, V, and W pins, because high current passes through these traces.
  • Place the 10-µF capacitor between VCC and GND, and as close to the VCC and GND pins as possible.
  • Place the 100-nF capacitor between VCP and VCC, and as close to the VCP and VCC pins as possible.
  • Connect GND and PGND under the thermal pad.
  • Keep the thermal pad connection as large as possible. It should be one piece of copper without any gaps.