SLVSBN6A June   2013  – August 2015 DRV201A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Data Transmission Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VCM Driver Output Stage Operation
      2. 7.3.2 Ringing Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C Bus Operation
        1. 7.5.1.1 Single Write to a Defined Location
        2. 7.5.1.2 Single Read from a Defined Location and Current Location
        3. 7.5.1.3 Sequential Read and Write
        4. 7.5.1.4 I2C Device Address, Start and Stop Condition
    6. 7.6 Register Maps
      1. 7.6.1 Control Register (Address - 0x02h)
      2. 7.6.2 VCM MSB Current Control Register (VCM_Current_MSB) Address - 0x03h
      3. 7.6.3 VCM LSB Current Control Register (VCM_Current_lSB) Address - 0x04h
      4. 7.6.4 Status Register (Status) Address - 0x05h
      5. 7.6.5 Mode Register (Mode) Address - 0x06h
      6. 7.6.6 VCM Resonance Frequency Register (VCM_FREQ) Address - 0x07h
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 VCM Mechanical Ringing Frequency
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 User Example 1
        2. 8.2.2.2 User Example 2
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Device Nomenclature

YMB package markings (see pinouts in Pin Configuration and Functions):

  • YM = YEAR / MONTH DATE CODE
  • D = DAY OF LASER MARK
  • S = ASSEMBLY SITE CODE
  • O = PinA1 (Filled Solid)

Table 16. YMB Package Dimensions

DIMENSION MIN TYP MAX UNIT
Length 1.49 mm
Width 0.806 mm
Height(1) 0.278 0.289 0.3 mm
Ball pitch 0.39 0.4 0.41 mm
Ball height 4.8 6 7.2 µm
Coating thickness(2) 0.39 0.4 0.41 mm
(1) Height tolerances valid for both coated and non-coated packages.
(2) Coating thickness only applies to DRV201AYMBRB (coated) package option.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.