SLOS916B June   2016  – June 2020 DRV2511-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input and Configurable Pre-amplifier
      2. 7.3.2 Pulse-Width Modulator (PWM)
      3. 7.3.3 Designed for low EMI
      4. 7.3.4 Device Protection Systems
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation in Shutdown Mode
      2. 7.4.2 Operation in Standby Mode
      3. 7.4.3 Operation in Active Mode
  8. Programming
    1. 8.1 Gain
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application, Single Ended Input
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Optional Components
        2. 9.2.2.2 Capacitor Selection
        3. 9.2.2.3 Solenoid Selection
        4. 9.2.2.4 Output Filter Considerations
      3. 9.2.3 Application Curves
      4. 9.2.4 Typical Application, Differential Input
  10. 10Power Supply Recommendations
    1. 10.1 Power Dissipation and Maximum Ambient Temperature
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Capacitor Selection

A bulk bypass capacitor should be mounted between VBAT and GND. The capacitance needs to be >22 uF with a X5R or better rating on the power pins to GND. Also include two ceramic capacitors in the ranges of 220 pF to 1 uF and 100 nF to 1 uF. The bootstrap capacitors, BSTA and BSTB, should be 220-nF ceramic capacitors of quality X5R or better rated for at least the maximum rating of the pin.