SLOS916B June   2016  – June 2020 DRV2511-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input and Configurable Pre-amplifier
      2. 7.3.2 Pulse-Width Modulator (PWM)
      3. 7.3.3 Designed for low EMI
      4. 7.3.4 Device Protection Systems
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation in Shutdown Mode
      2. 7.4.2 Operation in Standby Mode
      3. 7.4.3 Operation in Active Mode
  8. 8 Programming
    1. 8.1 Gain
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application, Single Ended Input
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Optional Components
        2. 9.2.2.2 Capacitor Selection
        3. 9.2.2.3 Solenoid Selection
        4. 9.2.2.4 Output Filter Considerations
      3. 9.2.3 Application Curves
      4. 9.2.4 Typical Application, Differential Input
  10. 10Power Supply Recommendations
    1. 10.1 Power Dissipation and Maximum Ambient Temperature
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) DRV2511-Q1 UNIT
DAP (HTSSOP)
32 PINS
RθJA Junction-to-ambient thermal resistance 32.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17.2 °C/W
RθJB Junction-to-board thermal resistance 17.3 °C/W
ψJT Junction-to-top characterization parameter 0.4 °C/W
ψJB Junction-to-board characterization parameter 17.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.