SLOS754C June   2012  – August 2016 DRV2603

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Setup for Graphs
    2. 7.2 Alternate Test Setup
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Supply Voltage Rejection for Constant Vibration Strength
      2. 8.3.2 Low-Voltage Control Logic for Constant Vibration Strength
      3. 8.3.3 Thermal Protection
      4. 8.3.4 Overcurrent Protection
      5. 8.3.5 Linear Resonance Actuators (LRA)
      6. 8.3.6 Auto Resonance Engine for LRA
      7. 8.3.7 Eccentric Rotating Mass Motors (ERM)
      8. 8.3.8 Edge Rate Control
    4. 8.4 Device Functional Modes
      1. 8.4.1 LRA Mode
      2. 8.4.2 ERM Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Actuator Selection
        2. 9.2.2.2 Power Supply Selection
        3. 9.2.2.3 Sending a Haptic Effect
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Decoupling Capacitor
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

The DRV2603 is featured in several TI Designs, available online at
http://www.ti.com/general/docs/refdesignsearch.tsp. TI Designs are analog solutions created by TI’s applications experts and offer the theory of operation, component selection, simulation, complete PCB schematic and layout, bill of materials, and measured performance of many useful circuits.

12.2 Documentation Support

12.2.1 Related Documentation

  • Haptic Energy Consumption – SLOA194
  • Benefits of LRA Auto-Resonance Tracking - SLOA188
  • Haptics: Solutions for ERM and LRA Actuators - SSZB151

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.5 Trademarks

E2E is a trademark of Texas Instruments.

TouchSense is a registered trademark of Immersion Corporation.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.