SLOS754C June   2012  – August 2016 DRV2603

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Setup for Graphs
    2. 7.2 Alternate Test Setup
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Supply Voltage Rejection for Constant Vibration Strength
      2. 8.3.2 Low-Voltage Control Logic for Constant Vibration Strength
      3. 8.3.3 Thermal Protection
      4. 8.3.4 Overcurrent Protection
      5. 8.3.5 Linear Resonance Actuators (LRA)
      6. 8.3.6 Auto Resonance Engine for LRA
      7. 8.3.7 Eccentric Rotating Mass Motors (ERM)
      8. 8.3.8 Edge Rate Control
    4. 8.4 Device Functional Modes
      1. 8.4.1 LRA Mode
      2. 8.4.2 ERM Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Actuator Selection
        2. 9.2.2.2 Power Supply Selection
        3. 9.2.2.3 Sending a Haptic Effect
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Decoupling Capacitor
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

over operating free-air temperature range, TA = 25°C (unless otherwise noted)
MIN MAX UNIT
Supply voltage VDD –0.3 6 V
VI Input voltage EN, PWM, LRA/ERM –0.3 VDD + 0.3 V
TA Operating free-air temperature range –40 85 °C
TJ Operating junction temperature range –40 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN TYP MAX UNIT
VDD Supply voltage VDD 2.5 5.2 V
fPWM PWM Input frequency 10 250 kHz
RL Load Impedance VDD = 5.2 V 8 Ω
F0 Supported LRA frequency Auto resonance tracking range for LRA 140 220 Hz
VIL Digital input low voltage EN, PWM, LRA/ERM 0.6 V
VIH Digital input high voltage EN, PWM, LRA/ERM 1.2 V
TA Operating free-air temperature range -40 85 °C

6.4 Thermal Information

THERMAL METRIC(1) DRV2603 UNIT
RUN (WQFN)
10 PINS
RθJA Junction-to-ambient thermal resistance 153.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 86 °C/W
RθJB Junction-to-board thermal resistance 70.4 °C/W
ψJT Junction-to-top characterization parameter 1.3 °C/W
ψJB Junction-to-board characterization parameter 70.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

TA = 25°C, VDD = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
|IIL| Digital input low current EN, PWM, LRA/ERM VDD = 5.0 V, VIN = 0 V 1 µA
|IIH| Digital input high current EN VDD = 5.0 V, VIN = VDD 6 µA
PWM, LRA/ERM VDD = 5.0 V, VIN = VDD 3 µA
ISD Shut down current VEN = 0 V 0.3 3 µA
IDDQ Quiescent current VEN = VDD, ERM Mode, 50% duty cycle input, No load 1.7 2.5 mA
ROUT Output impedance in shutdown OUT+ to GND, OUT– to GND 15 kΩ
tSU Start-up time Time from EN high to output signal 1.3 ms
fSW PWM output frequency 19.5 20.3 21.5 kHz
IBAT,AVG Average battery current during operation Duty Cycle = 100%, LRA Mode, Load = 25 Ω LRA 55 mA
Duty Cycle = 80%, ERM Mode, RL = 17 Ω, 2V rated ERM 59
RDS-HS Drain to source resistance, high-side 1.05 Ω
RDS-LS Drain to source resistance, low-side 0.85 Ω
VOUT Differential output voltage Duty Cycle = 100%, LRA Mode, Load = 25 Ω LRA 2.2 VRMS
Duty Cycle = 100%, ERM Mode, RL = 20 Ω ERM 3.3 V
Thermal threshold 145 °C
Thermal Hysteresis 18 °C

6.6 Typical Characteristics

DRV2603 G001_Startup_Waveform.png Figure 1. Startup Waveform
DRV2603 G003_LRA_Click.png Figure 3. LRA Click
DRV2603 G005_LRA_PWM_Modulation.png Figure 5. LRA PWM Modulation
DRV2603 G002_LRA_Full-Scale_Drive.png Figure 2. LRA Full-Scale Drive
DRV2603 G004_ERM_Click.png Figure 4. ERM Click
DRV2603 G006_ERM_PWM_Modulation.png Figure 6. ERM PWM Modulation