SLOS740C May   2012  – January 2023 DRV2665

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Support for Haptic Piezo Actuators
      2. 7.3.2  Flexible Front End Interface
      3. 7.3.3  Ramp Down Behavior
      4. 7.3.4  Low Latency Startup
      5. 7.3.5  Low Power Standby Mode
      6. 7.3.6  Device Reset
      7. 7.3.7  Amplifier Gain
      8. 7.3.8  Adjustable Boost Voltage
      9. 7.3.9  Adjustable Current Limit
      10. 7.3.10 Internal Charge Pump
      11. 7.3.11 Device Protection
        1. 7.3.11.1 Thermal Protection
        2. 7.3.11.2 Overcurrent Protection
        3. 7.3.11.3 Brownout Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 FIFO Mode
      2. 7.4.2 Analog Playback Mode
      3. 7.4.3 Low Voltage Operation Mode
    5. 7.5 Programming
      1. 7.5.1 Programming the Boost Voltage
      2. 7.5.2 Programming the Boost Current Limit
      3. 7.5.3 I2C Interface
        1. 7.5.3.1 General I2C Operation
        2. 7.5.3.2 Single-Byte and Multiple-Byte Transfers
        3. 7.5.3.3 Single-Byte Write
        4. 7.5.3.4 Multiple-Byte Write and Incremental Multiple-Byte Write
        5. 7.5.3.5 Single-Byte Read
        6. 7.5.3.6 Multiple-Byte Read
    6. 7.6 Register Map
      1. 7.6.1 Address: 0x00
      2. 7.6.2 Address: 0x01
      3. 7.6.3 Address: 0x02
      4. 7.6.4 Address: 0x0B
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Piezo Actuator Selection
        3. 8.2.2.3 Boost Capacitor Selection
        4. 8.2.2.4 Bulk Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Setup
      1. 8.3.1 Initialization Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-5FEE4489-E95B-4799-9610-346289D74A59-low.gif Figure 5-1 RGP Package20-Pin QFN With Exposed Thermal PadTop View
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NAME NO.1
PUMP 1 P Internal charge pump voltage
VDD 2 P 3- to 5.5-V supply input. A 1 µF-capacitor is required.
FB 3 I Boost feedback
GND 4, 5, 6 P Supply ground
SW 7, 8 P Internal boost switch pin
NC 9 — No connect
BST 10, 11 P Boost output voltage. A 0.1-µF capacitor is required.
PVDD 12 P High-voltage amplifier input voltage
OUT+ 13 O Positive haptic driver differential output
OUT- 14 O Negative haptic driver differential output
REXT 15 I Sets boost current limit. Resistor to ground.
IN- 16 I Negative analog input
IN+ 17 I Positive analog input
SCL 18 I I2C clock
SDA 19 I/O I2C data
REG 20 O 1.8-V regulator output. A 0.1-µF capacitor is required.
  1. I = Input, O = Output, P = Power