SLASF54 January   2023 DRV2901

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Block Diagrams
    2. 7.2 Feature Description
      1. 7.2.1 Error Reporting
      2. 7.2.2 Device Reset
      3. 7.2.3 Device Protection System
        1. 7.2.3.1 Overcurrent (OC) Protection With Current Limiting and Overload Detection
        2. 7.2.3.2 Overtemperature Protection
        3. 7.2.3.3 Undervoltage Protection (UVP) and Power-On Reset (POR)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
  9. 9 Power Supply Recommendations
    1. 9.1 System Power-up/power-down Sequence
      1. 9.1.1 Powering Up
      2. 9.1.2 Powering Down
    2. 9.2 System Design Recommendations
      1. 9.2.1 VDD Pin
      2. 9.2.2 VREG Pin
      3. 9.2.3 OTW Pin
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.3 OTW Pin

OTW reporting indicates the device approaching high junction temperature. This signal can be used with MCU to decrease system power when OTW is low in order to prevent OT shut down at a higher temperature.

No external pull up resistor or 3.3 V power supply is needed for 3.3 V logic. The OTW pin has an internal pullup resistor connecting to an internal 3.3 V to reduce external component count. For 5 V logic, an external pull up resistor to 5 V is needed.