SLVSHE3 June   2024 DRV2911-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings Auto
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Stage
      2. 6.3.2 Hardware Interface
      3. 6.3.3 AVDD Linear Voltage Regulator
      4. 6.3.4 Step-Down Mixed-Mode Buck Regulator
        1. 6.3.4.1 Buck in Inductor Mode
        2. 6.3.4.2 Buck in Resistor mode
        3. 6.3.4.3 Buck Regulator with External LDO
        4. 6.3.4.4 AVDD Power Sequencing with Buck Regulator
        5. 6.3.4.5 Mixed mode Buck Operation and Control
        6. 6.3.4.6 Buck Undervoltage Lockout
        7. 6.3.4.7 Buck Overcurrent Protection
      5. 6.3.5 Charge Pump
      6. 6.3.6 Slew Rate Control
      7. 6.3.7 Cross Conduction (Dead Time)
      8. 6.3.8 Propagation Delay
      9. 6.3.9 Protections
        1. 6.3.9.1 PVDD Supply Undervoltage Lockout
        2. 6.3.9.2 AVDD Undervoltage Lockout
        3. 6.3.9.3 VCP Charge Pump Undervoltage Lockout
        4. 6.3.9.4 Overcurrent Latched Protection
        5. 6.3.9.5 Thermal Shutdown (OTSD)
          1. 6.3.9.5.1 OTSD FET
          2. 6.3.9.5.2 OTSD (Non-FET)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Functional Modes
        1. 6.4.1.1 Reset Mode
        2. 6.4.1.2 Operating Mode
        3. 6.4.1.3 Fault Reset (RESETZ Pulse)
      2. 6.4.2 OUTOFF functionality
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Procedure
      2. 7.2.2 Voltage and Current Sense Circuitry
  9. 8 Power Supply Recommendations
    1. 8.1 Bulk Capacitance
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
      1. 9.3.1 Power Dissipation
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.