SLIS162I December   2014  – February 2023 DRV5013-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Magnetic Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Field Direction Definition
      2. 7.3.2 Device Output
      3. 7.3.3 Power-On Time
      4. 7.3.4 Output Stage
      5. 7.3.5 Protection Circuits
        1. 7.3.5.1 Overcurrent Protection (OCP)
        2. 7.3.5.2 Load Dump Protection
        3. 7.3.5.3 Reverse Supply Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Standard Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Configuration Example
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Alternative Two-Wire Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
      2. 9.1.2 Device Markings
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Typical Characteristics

GUID-E651CECF-D5B5-4632-A38C-5EF621905FD0-low.gif
Figure 6-1 ICC vs VCC
GUID-EF99D4B0-81B0-455B-BBA8-C272C41FEAD2-low.gif
TA = 25°C
Figure 6-3 BOP vs VCC
GUID-78897CDD-23FB-46FB-BC09-C1535E6D6C04-low.gif
TA = 25°C
Figure 6-5 BRP vs VCC
GUID-9751F238-E7D4-4C5B-8C1E-DC44B099ED40-low.gif
TA = 25°C
Figure 6-7 Hysteresis vs VCC
GUID-F8E37060-D473-4D06-9A18-234702F6E679-low.gif
TA = 25°C
Figure 6-9 Offset vs VCC
GUID-B18FE6B7-C48F-4A2D-BF5C-C710936F13F7-low.gif
Figure 6-2 ICC vs Temperature
GUID-DD0FA26C-3061-4304-84EF-C07DA58D118D-low.gif
VCC = 3.3 V
Figure 6-4 BOP vs Temperature
GUID-B870FE10-C984-46BE-A781-0B68BEF55674-low.gif
VCC = 3.3 V
Figure 6-6 BRP vs Temperature
GUID-E91E9A85-E172-4413-942D-8527D3A2F978-low.gif
VCC = 3.3 V
Figure 6-8 Hysteresis vs Temperature
GUID-3853B2A2-60A8-4293-B2A7-DD09025014E4-low.gif
VCC = 3.3 V
Figure 6-10 Offset vs Temperature