SLIS150M March   2014  – June 2024 DRV5013

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Magnetic Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Field Direction Definition
      2. 6.3.2 Device Output
      3. 6.3.3 Power-On Time
      4. 6.3.4 Output Stage
      5. 6.3.5 Protection Circuits
        1. 6.3.5.1 Overcurrent Protection (OCP)
        2. 6.3.5.2 Load Dump Protection
        3. 6.3.5.3 Reverse Supply Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Standard Circuit
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Configuration Example
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Alternative Two-Wire Application
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
      2. 8.1.2 Device Markings
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.8 Typical Characteristics

TA > 125°C data is valid for devices with the "E" temperature range designator only, (see Device Nomenclature)

DRV5013 ICC vs VCC
Versions: DRV5013AD, DRV5013AG, DRV5013BC, DRV5013FA
Figure 5-1 ICC vs VCC
DRV5013 ICC vs VCC
Version: DRV5013ND
Figure 5-3 ICC vs VCC
DRV5013 BOP vs VCC
TA = 25°C
Figure 5-5 BOP vs VCC
DRV5013 BRP vs VCC
TA = 25°C
Figure 5-7 BRP vs VCC
DRV5013 Hysteresis vs VCC
TA = 25°C
Figure 5-9 Hysteresis vs VCC
DRV5013 Offset vs VCC
TA = 25°C
Figure 5-11 Offset vs VCC
DRV5013 ICC vs Temperature
Versions: DRV5013AD, DRV5013AG, DRV5013BC, DRV5013FA
Figure 5-2 ICC vs Temperature
DRV5013 ICC vs Temperature
Version: DRV5013ND
Figure 5-4 ICC vs Temperature
DRV5013 BOP vs Temperature
VCC = 3.3 V
Figure 5-6 BOP vs Temperature
DRV5013 BRP vs Temperature
VCC = 3.3 V
Figure 5-8 BRP vs Temperature
DRV5013 Hysteresis vs Temperature
VCC = 3.3 V
Figure 5-10 Hysteresis vs Temperature
DRV5013 Offset vs Temperature
VCC = 3.3 V
Figure 5-12 Offset vs Temperature