SLIS163G December   2014  – March 2017 DRV5023-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Magnetic Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Field Direction Definition
      2. 7.3.2 Device Output
      3. 7.3.3 Power-On Time
      4. 7.3.4 Output Stage
      5. 7.3.5 Protection Circuits
        1. 7.3.5.1 Overcurrent Protection (OCP)
        2. 7.3.5.2 Load Dump Protection
        3. 7.3.5.3 Reverse Supply Protection
        4. 7.3.5.4 Output Jitter Characteristic
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Standard Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Configuration Example
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Alternative Two-Wire Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (September 2016) to G Revision

  • Added the output jitter parameter to the Switching Characteristics tableGo
  • Added the Output Jitter Characteristic sectionGo

Changes from E Revision (August 2016) to F Revision

Changes from D Revision (May 2016) to E Revision

  • Clarified the output description for the FI device version in the Device Output section Go
  • Added the Layout section Go
  • Added the Receiving Notification of Documentation Updates section Go

Changes from C Revision (February 2016) to D Revision

  • Revised preliminary limits for the FA versionGo

Changes from B Revision (December 2015) to C Revision

  • Added the FA and FI device options Go
  • Added the typical bandwidth value to the Magnetic Characteristics table Go

Changes from A Revision (May 2015) to B Revision

  • Corrected body size of SOT-23 package and SIP package name to TO-92 Go
  • Added BMAX to Absolute Maximum Ratings Go
  • Removed table notes regarding testing for the operating junction temperature in Absolute Maximum Ratings Go
  • Updated package tape and reel options for M and blank Go
  • Added Community Resources Go

Changes from * Revision (December 2014) to A Revision

  • Updated device status to production data Go