SLVSGJ9 May   2024 DRV7308

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Absolute Maximum Ratings
  7. 6 ESD Ratings
  8. 7 Recommended Operating Conditions
  9. 8 Thermal Information
  10. 9 Electrical Characteristics
  11. 10Timing Diagrams
  12. 11Typical Characteristics
  13. 12Detailed Description
    1. 12.1 Overview
    2. 12.2 Functional Block Diagram
    3. 12.3 Feature Description
      1. 12.3.1 Output Stage
      2. 12.3.2 Input Control Logic
      3. 12.3.3 ENABLE (EN) Pin Function
      4. 12.3.4 Temperature Sensor Output (VTEMP)
      5. 12.3.5 Brake Function
      6. 12.3.6 Slew Rate Control (SR)
      7. 12.3.7 Dead Time
      8. 12.3.8 Current Limit Functionaity (ILIMIT)
      9. 12.3.9 Pin Diagrams
        1. 12.3.9.1 Four-Level Input Pin
        2. 12.3.9.2 Open-Drain Pin
        3. 12.3.9.3 Logic-Level Input Pin (Internal Pulldown)
    4. 12.4 Protections
      1. 12.4.1 GVDD Undervoltage Lockout
      2. 12.4.2 Bootstrap Undervoltage Lockout
      3. 12.4.3 Current Limit Protection
      4. 12.4.4 GaNFET Overcurrent Protection
      5. 12.4.5 Thermal Shutdown (OTS)
  14. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  15. 14Revision History
  16. 15Mechanical, Packaging, and Orderable Information
    1. 15.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • REN|68
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Thermal Information

THERMAL METRIC(1) DEVICE UNIT
REN (VQFN)
40 PINS
RθJA Junction-to-ambient thermal resistance 21.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 5.5 °C/W
RθJB Junction-to-board thermal resistance 6.0 °C/W
ΨJT Junction-to-top characterization parameter 4.0 °C/W
ΨJB Junction-to-board characterization parameter 5.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance per GaNFET 1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.