SLVSH58 August   2024 DRV81004-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
      1. 5.5.1 SPI Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Control Pins
        1. 6.3.1.1 Input Pins
        2. 6.3.1.2 nSLEEP Pin
      2. 6.3.2 Power Supply
        1. 6.3.2.1 Modes of Operation
          1. 6.3.2.1.1 Power-up
          2. 6.3.2.1.2 Sleep mode
          3. 6.3.2.1.3 Idle mode
          4. 6.3.2.1.4 Active mode
          5. 6.3.2.1.5 Limp Home mode
          6. 6.3.2.1.6 Reset condition
      3. 6.3.3 Power Stage
        1. 6.3.3.1 Switching Resistive Loads
        2. 6.3.3.2 Inductive Output Clamp
        3. 6.3.3.3 Maximum Load Inductance
        4. 6.3.3.4 Switching Channels in parallel
      4. 6.3.4 Protection and Diagnostics
        1. 6.3.4.1 Undervoltage on VM
        2. 6.3.4.2 Overcurrent Protection
        3. 6.3.4.3 Over Temperature Protection
        4. 6.3.4.4 Over Temperature Warning
        5. 6.3.4.5 Over Temperature and Overcurrent Protection in Limp Home mode
        6. 6.3.4.6 Reverse Polarity Protection
        7. 6.3.4.7 Over Voltage Protection
        8. 6.3.4.8 Output Status Monitor
      5. 6.3.5 SPI Communication
        1. 6.3.5.1 SPI Signal Description
          1. 6.3.5.1.1 Chip Select (nSCS)
            1. 6.3.5.1.1.1 Logic high to logic low Transition
            2. 6.3.5.1.1.2 Logic low to logic high Transition
          2. 6.3.5.1.2 Serial Clock (SCLK)
          3. 6.3.5.1.3 Serial Input (SDI)
          4. 6.3.5.1.4 Serial Output (SDO)
        2. 6.3.5.2 Daisy Chain Capability
        3. 6.3.5.3 SPI Protocol
        4. 6.3.5.4 SPI Registers
          1. 6.3.5.4.1  Standard Diagnosis Register
          2. 6.3.5.4.2  Output control register
          3. 6.3.5.4.3  Input 0 Mapping Register
          4. 6.3.5.4.4  Input 1 Mapping Register
          5. 6.3.5.4.5  Input Status Monitor Register
          6. 6.3.5.4.6  Open Load Current Control Register
          7. 6.3.5.4.7  Output Status Monitor Register
          8. 6.3.5.4.8  Configuration Register
          9. 6.3.5.4.9  Output Clear Latch Register
          10. 6.3.5.4.10 Configuration Register 2
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Typical Application
      2. 7.1.2 Suggested External Components
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Package Footprint Compatibility
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings

VALUEUNIT
VESDElectrostatic dischargeHuman-body model (HBM), per AEC Q100-002(1)

OUT pins vs. VM or GND

±4000V

Other pins

±2000
Charged device model (CDM), per AECQ100-011

Corner pins (1, 7, 8, 14)

±750

Other pins

±500
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.