The VM pin should be bypassed to GND using
low-ESR ceramic bypass capacitor with a
recommended value of 68nF rated for VM. The
capacitor should be placed as close to the VM pin
as possible with a thick trace or ground plane
connection to the device GND pin.
Bypass the VDD pin to ground with a low-ESR
ceramic capacitor. A value of 100nF rated for 6.3V
is recommended. Place this bypassing capacitor as
close to the pin as possible.
In general, inductance between the power supply
pins and decoupling capacitors must be
avoided.
Connect series resistors between IN0, IN1,
nSLEEP, nSCS, SCLK, SDI, SDO and VDD pins of the
DRV81004-Q1 and corresponding pins of the
microcontroller. The recommended values of the
resistors are shown in Section 6.3.
The thermal PAD of the package must be connected
to system ground.
It is recommended to use a big unbroken single
ground plane for the whole system / board. The
ground plane can be made at bottom PCB layer.
In order to minimize the impedance and
inductance, the traces from ground pins should be
as short and wide as possible, before connecting
to bottom layer ground plane through vias.
Multiple vias are suggested to reduce the
impedance.
Try to clear the space around the device as much
as possible especially at bottom PCB layer to
improve the heat spreading.
Single or multiple internal ground planes
connected to the thermal PAD will also help
spreading the heat and reduce the thermal
resistance.