SLVSG63A January   2023  – March 2024 DRV8143-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
    1. 5.1 HW Variant
      1. 5.1.1 VQFN-HR (14) package
      2. 5.1.2 HVSSOP (28) package
    2. 5.2 SPI Variant
      1. 5.2.1 HVSSOP (28) package
      2. 5.2.2 VQFN-HR (14) package
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
      1. 6.5.1  Power Supply & Initialization
      2. 6.5.2  Logic I/Os
      3. 6.5.3  SPI I/Os
      4. 6.5.4  Configuration Pins - HW Variant Only
      5. 6.5.5  Power FET Parameters
      6. 6.5.6  Switching Parameters with High-Side Recirculation
      7. 6.5.7  Switching Parameters with Low-Side Recirculation
      8. 6.5.8  IPROPI & ITRIP Regulation
      9. 6.5.9  Over Current Protection (OCP)
      10. 6.5.10 Over Temperature Protection (TSD)
      11. 6.5.11 Voltage Monitoring
      12. 6.5.12 Load Monitoring
      13. 6.5.13 Fault Retry Setting
      14. 6.5.14 Transient Thermal Impedance & Current Capability
    6. 6.6 SPI Timing Requirements
    7. 6.7 Switching Waveforms
      1. 6.7.1 Output switching transients
        1. 6.7.1.1 High-Side Recirculation
        2. 6.7.1.2 Low-Side Recirculation
      2. 6.7.2 Wake-up Transients
        1. 6.7.2.1 HW Variant
        2. 6.7.2.2 SPI Variant
      3. 6.7.3 Fault Reaction Transients
        1. 6.7.3.1 Retry setting
        2. 6.7.3.2 Latch setting
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 HW Variant
      2. 7.2.2 SPI Variant
    3. 7.3 Feature Description
      1. 7.3.1 External Components
        1. 7.3.1.1 HW Variant
        2. 7.3.1.2 SPI Variant
      2. 7.3.2 Bridge Control
        1. 7.3.2.1 Register - Pin Control - SPI Variant Only
      3. 7.3.3 Device Configuration
        1. 7.3.3.1 Slew Rate (SR)
        2. 7.3.3.2 IPROPI
        3. 7.3.3.3 ITRIP Regulation
        4. 7.3.3.4 DIAG
          1. 7.3.3.4.1 HW variant
          2. 7.3.3.4.2 SPI variant
      4. 7.3.4 Protection and Diagnostics
        1. 7.3.4.1 Over Current Protection (OCP)
        2. 7.3.4.2 Over Temperature Protection (TSD)
        3. 7.3.4.3 Off-State Diagnostics (OLP)
        4. 7.3.4.4 On-State Diagnostics (OLA) - SPI Variant Only
        5. 7.3.4.5 VM Over Voltage Monitor
        6. 7.3.4.6 VM Under Voltage Monitor
        7. 7.3.4.7 Charge pump under voltage monitor
        8. 7.3.4.8 Power On Reset (POR)
        9. 7.3.4.9 Event Priority
    4. 7.4 Programming - SPI Variant Only
      1. 7.4.1 SPI Interface
      2. 7.4.2 Standard Frame
      3. 7.4.3 SPI Interface for Multiple Peripherals
        1. 7.4.3.1 Daisy Chain Frame for Multiple Peripherals
  9. 8 Register Map - SPI Variant Only
    1. 8.1 User Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Load Summary
    2. 9.2 Typical Application
      1. 9.2.1 HW Variant
      2. 9.2.2 SPI Variant
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Bulk Capacitance Sizing
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2.1 HVSSOP (28) package

DRV8143-Q1 DRV8143P-Q1 SPI(P) variant in HVSSOP (28) package Figure 5-3 DRV8143P-Q1 SPI(P) variant in HVSSOP (28) package
Table 5-3 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
1 SCLK I SPI - Serial Clock input.
2 nSCS I SPI - Chip Select. An active low on this pin enables the serial interface communication.
3 IN I Controller input pin for bridge operation. For details, see the Bridge Control section.
4 DRVOFF I Controller input pin for bridge Hi-Z. For details, see the Bridge Control section.
5 VCP P Charge Pump pin for storage cap. Connect a 6.3V, 1µF capacitor to VM supply.
6, 7, 8, 21, 22, 23 VM P Power supply. This pin is the motor supply voltage. Must combine with the rest of VM pins (6 total) to support device current capability. Bypass this pin to GND with a 0.1-µF ceramic capacitor and a bulk capacitor.
9, 10, 11, 18, 19, 20 OUT P Half-bridge output. Connect this pin to the motor or load. Must combine with the rest of OUT pins (6 total) to support device current capability.
12, 13, 14, 15, 16, 17 GND G Ground pin. Must combine with the rest of GND pins (6 total) to support device current capability.
24 VDD P Logic power supply to the device.
25 IPROPI I/O Driver load current analog feedback. For details, refer to IPROPI in the Device Configuration section.
26 nFAULT OD Fault indication to the controller. For details, refer to nFAULT in the Device Configuration section.
27 SDO PP SPI - Serial Data Output. Data is updated at the rising edge of SCLK.
28 SDI I SPI - Serial Data Input. Data is captured at the falling edge of SCLK.
(1) I = input, O = output, I/O = input/output, G = ground, P = power, OD = open-drain output, PP = push-pull output