SLVSGV9 august   2023 DRV8213

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Diagrams
    7. 7.7 Typical Operating Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 External Components
    4. 8.4 Feature Description
      1. 8.4.1 Bridge Control
      2. 8.4.2 Current Sense and Regulation (IPROPI)
        1. 8.4.2.1 Current Sensing and Current Mirror Gain Selection
        2. 8.4.2.2 Current Regulation
      3. 8.4.3 Hardware Stall Detection
      4. 8.4.4 Protection Circuits
        1. 8.4.4.1 Overcurrent Protection (OCP)
        2. 8.4.4.2 Thermal Shutdown (TSD)
        3. 8.4.4.3 VM Undervoltage Lockout (UVLO)
    5. 8.5 Device Functional Modes
      1. 8.5.1 Active Mode
      2. 8.5.2 Low-Power Sleep Mode
      3. 8.5.3 Fault Mode
    6. 8.6 Pin Diagrams
      1. 8.6.1 Logic-Level Inputs
      2. 8.6.2 Tri-Level Input
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Brushed DC Motor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Motor Voltage
          2. 9.2.1.2.2 Motor Current
        3. 9.2.1.3 Stall Detection
          1. 9.2.1.3.1 Detailed Design Procedure
            1. 9.2.1.3.1.1 Hardware Stall Detection Application Description
              1. 9.2.1.3.1.1.1 Hardware Stall Detection Timing
              2. 9.2.1.3.1.1.2 Hardware Stall Threshold Selection
            2. 9.2.1.3.1.2 Software Stall Detection Application Description
              1. 9.2.1.3.1.2.1 Software Stall Detection Timing
              2. 9.2.1.3.1.2.2 Software Stall Threshold Selection
        4. 9.2.1.4 Application Curves
        5. 9.2.1.5 Thermal Performance
          1. 9.2.1.5.1 Steady-State Thermal Performance
          2. 9.2.1.5.2 Transient Thermal Performance
  11. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  12. 11Layout
    1. 11.1 Layout Guidelines
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
9.2.1.5.2 Transient Thermal Performance

The motor driver may experience different transient driving conditions that cause large currents to flow for a short duration of time. These may include -

  • Motor start-up when the rotor is initially stationary.
  • Fault conditions when there is a supply or ground short to one of the motor outputs, and the overcurrent protection triggers.
  • Briefly energizing a motor or solenoid for a limited time, then de-energizing.

For these transient cases, the duration of drive time is another factor that impacts thermal performance in addition to copper area and thickness. In transient cases, the thermal impedance parameter ZθJA denotes the junction-to-ambient thermal performance. The figures in this section show the simulated thermal impedances for 1-oz and 2-oz copper layouts for the WSON and WQFN packages. These graphs indicate better thermal performance with short current pulses. For short periods of drive time, the device die size and package dominates the thermal performance. For longer drive pulses, board layout has a more significant impact on thermal performance. Both graphs show the curves for thermal impedance split due to number of layers and copper area as the duration of the drive pulse duration increases. Long pulses can be considered steady-state performance.

GUID-20230530-SS0I-VJS5-Q9QP-CRFBX9KWFDR6-low.svgFigure 9-16 WSON package junction-to-ambient thermal impedance for 1-oz copper layouts
GUID-20230530-SS0I-210V-FVT6-ZQJ4CJM4KJTJ-low.svgFigure 9-17 WSON package junction-to-ambient thermal impedance for 2-oz copper layouts
GUID-20230530-SS0I-CBPW-LWJ1-BGSVRDTHHRVX-low.svgFigure 9-18 WQFN package junction-to-ambient thermal impedance for 1-oz copper layouts
GUID-20230530-SS0I-SFNC-XLJ3-8DLHCRLWZF1B-low.svgFigure 9-19 WQFN package junction-to-ambient thermal impedance for 2-oz copper layouts