SLVSGV9 august   2023 DRV8213

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Diagrams
    7. 7.7 Typical Operating Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 External Components
    4. 8.4 Feature Description
      1. 8.4.1 Bridge Control
      2. 8.4.2 Current Sense and Regulation (IPROPI)
        1. 8.4.2.1 Current Sensing and Current Mirror Gain Selection
        2. 8.4.2.2 Current Regulation
      3. 8.4.3 Hardware Stall Detection
      4. 8.4.4 Protection Circuits
        1. 8.4.4.1 Overcurrent Protection (OCP)
        2. 8.4.4.2 Thermal Shutdown (TSD)
        3. 8.4.4.3 VM Undervoltage Lockout (UVLO)
    5. 8.5 Device Functional Modes
      1. 8.5.1 Active Mode
      2. 8.5.2 Low-Power Sleep Mode
      3. 8.5.3 Fault Mode
    6. 8.6 Pin Diagrams
      1. 8.6.1 Logic-Level Inputs
      2. 8.6.2 Tri-Level Input
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Brushed DC Motor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Motor Voltage
          2. 9.2.1.2.2 Motor Current
        3. 9.2.1.3 Stall Detection
          1. 9.2.1.3.1 Detailed Design Procedure
            1. 9.2.1.3.1.1 Hardware Stall Detection Application Description
              1. 9.2.1.3.1.1.1 Hardware Stall Detection Timing
              2. 9.2.1.3.1.1.2 Hardware Stall Threshold Selection
            2. 9.2.1.3.1.2 Software Stall Detection Application Description
              1. 9.2.1.3.1.2.1 Software Stall Detection Timing
              2. 9.2.1.3.1.2.2 Software Stall Threshold Selection
        4. 9.2.1.4 Application Curves
        5. 9.2.1.5 Thermal Performance
          1. 9.2.1.5.1 Steady-State Thermal Performance
          2. 9.2.1.5.2 Transient Thermal Performance
  11. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  12. 11Layout
    1. 11.1 Layout Guidelines
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) DEVICE DEVICE UNIT
DSG (WSON) RTE (WQFN)
8 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 65.9 50.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75.2 52.0 °C/W
RθJB Junction-to-board thermal resistance 28.7 25.5 °C/W
ΨJT Junction-to-top characterization parameter 2.0 1.8 °C/W
ΨJB Junction-to-board characterization parameter 28.7 25.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 12.0 11.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.