SLVSH03 December   2023 DRV8234

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Operating Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 External Components
      2. 7.3.2 Summary of Features
      3. 7.3.3 Bridge Control
      4. 7.3.4 Current Sense and Regulation (IPROPI)
        1. 7.3.4.1 Current Sensing
        2. 7.3.4.2 Current Regulation
          1. 7.3.4.2.1 Fixed Off-Time Current Regulation
          2. 7.3.4.2.2 Cycle-By-Cycle Current Regulation
      5. 7.3.5 Stall Detection
      6. 7.3.6 Ripple Counting
        1. 7.3.6.1 Ripple Counting Parameters
          1. 7.3.6.1.1  Motor Resistance Inverse
          2. 7.3.6.1.2  Motor Resistance Inverse Scale
          3. 7.3.6.1.3  KMC Scaling Factor
          4. 7.3.6.1.4  KMC
          5. 7.3.6.1.5  Filter Damping Constant
          6. 7.3.6.1.6  Filter Input Scaling Factor
          7. 7.3.6.1.7  Ripple Count Threshold
          8. 7.3.6.1.8  Ripple Count Threshold Scale
          9. 7.3.6.1.9  T_MECH_FLT
          10. 7.3.6.1.10 VSNS_SEL
          11. 7.3.6.1.11 Error Correction
            1. 7.3.6.1.11.1 EC_FALSE_PER
            2. 7.3.6.1.11.2 EC_MISS_PER
        2. 7.3.6.2 RC_OUT Output
        3. 7.3.6.3 Ripple Counting with nFAULT
      7. 7.3.7 Motor Voltage and Speed Regulation
        1. 7.3.7.1 Internal Bridge Control
        2. 7.3.7.2 Setting Speed/Voltage Regulation Parameters
          1. 7.3.7.2.1 Speed and Voltage Set
          2. 7.3.7.2.2 Speed Scaling Factor
        3. 7.3.7.3 Soft-Start and Soft-Stop
          1. 7.3.7.3.1 TINRUSH
      8. 7.3.8 Protection Circuits
        1. 7.3.8.1 Overcurrent Protection (OCP)
        2. 7.3.8.2 Thermal Shutdown (TSD)
        3. 7.3.8.3 VM Undervoltage Lockout (VM UVLO)
        4. 7.3.8.4 Overvoltage Protection (OVP)
        5. 7.3.8.5 nFAULT Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Low-Power Sleep Mode
      3. 7.4.3 Fault Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Communication
        1. 7.5.1.1 I2C Write
        2. 7.5.1.2 I2C Read
    6. 7.6 Register Map
      1. 7.6.1 DRV8234_STATUS Registers
      2. 7.6.2 DRV8234_CONFIG Registers
      3. 7.6.3 DRV8234_CTRL Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application: Brushed DC Motor
      1. 8.2.1 Design Requirements
      2. 8.2.2 Stall Detection
        1. 8.2.2.1 Application Description
          1. 8.2.2.1.1 Stall Detection Timing
          2. 8.2.2.1.2 Hardware Stall Threshold Selection
      3. 8.2.3 Ripple Counting Application
        1. 8.2.3.1 Tuning Ripple Counting Parameters
          1. 8.2.3.1.1 Resistance Parameters
          2. 8.2.3.1.2 KMC and KMC_SCALE
            1. 8.2.3.1.2.1 Case I
            2. 8.2.3.1.2.2 Case II
              1. 8.2.3.1.2.2.1 Method 1: Tuning from Scratch
                1. 8.2.3.1.2.2.1.1 Tuning KMC_SCALE
                2. 8.2.3.1.2.2.1.2 Tuning KMC
              2. 8.2.3.1.2.2.2 Method 2: Using the Proportionality factor
                1. 8.2.3.1.2.2.2.1 Working Example
          3. 8.2.3.1.3 Advanced Parameters
            1. 8.2.3.1.3.1 Filter Constants
              1. 8.2.3.1.3.1.1 FLT_GAIN_SEL
              2. 8.2.3.1.3.1.2 FLT_K
            2. 8.2.3.1.3.2 T_MECH_FLT
            3. 8.2.3.1.3.3 VSNS_SEL
            4. 8.2.3.1.3.4 Additional Error Corrector Parameters
              1. 8.2.3.1.3.4.1 EC_FALSE_PER
              2. 8.2.3.1.3.4.2 EC_MISS_PER
      4. 8.2.4 Motor Voltage
      5. 8.2.5 Motor Current
      6. 8.2.6 Application Curves
  10. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  11. 10Layout
    1. 10.1 Layout Guidelines
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

4.5 V ≤ VVM ≤ 38 V, –40°C ≤ TJ ≤ 150°C (unless otherwise noted). Typical values are at TJ = 27°C, VVM = 24 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLIES (VM)
IVMQ VM sleep mode current nSLEEP = 0 V, VVM = 24 V, TJ = 27°C 0.1 1 µA
IVM VM active mode current nSLEEP = 3.3 V, IN1 = 3.3 V, IN2 = 0 V, VVM = 24 V 3.5 4 mA
tWAKE Turnon time nSLEEP = 1 to I2C ready 410 μs
LOGIC-LEVEL INPUTS (IN1, IN2, SDA, SCL, nSLEEP)
VIL Input logic low voltage 0 0.5 V
VIH Input logic high voltage 1.5 5.5 V
VHYS Input hysteresis 160 mV
VHYS Input hysterisis nSLEEP pin 60
IIL Input logic low current VI = 0 V -1 1 µA
IIH Input logic high current VI = 5 V 33 100 µA
RPD Input pulldown resistance, INx To GND 100 kΩ
tDEGLITCH Input logic deglitch, INx 50 ns
TRI-LEVEL INPUTS (A1, A0)
VTIL Tri-level input logic low voltage 0 0.6 V
VTIHZ Tri-level input Hi-Z voltage 1.8 2 2.2 V
VTIH Tri-level input logic high voltage 2.7 5.5 V
RTPD Tri-level pulldown resistance to GND 200 kΩ
ITPU Tri-level pullup current to 3.3 V 10 µA
OPEN-DRAIN OUTPUTS (nFAULT, RC_OUT, SDA)
VOL Output logic low voltage IOD = 5 mA 0.3 V
IOZ Output logic high current VOD = 3.3 V -1 1 µA
tPW_RC RC_OUT pulse width 30 50 70 µs
tPW_nFAULT nFAULT low pulse width RC Count overflow, RC_REP = 11b 30 50 70 µs
CB SDA capacitive load for each bus line 400 pF
DRIVER OUTPUTS (OUTx)
RDS(ON)_HS High-side MOSFET on resistance IOUTx = 1 A; TJ = 25 °C 300 360 mΩ
RDS(ON)_HS High-side MOSFET on resistance IOUTx = 1 A; TJ = 125 °C 450 540 mΩ
RDS(ON)_HS High-side MOSFET on resistance IOUTx = 1 A; TJ = 150 °C 500 600 mΩ
RDS(ON)_LS Low-side MOSFET on resistance IOUTx = -1 A; TJ = 25 °C 300 360 mΩ
RDS(ON)_LS Low-side MOSFET on resistance IOUTx = -1 A; TJ = 125 °C 450 540 mΩ
RDS(ON)_LS Low-side MOSFET on resistance IOUTx = -1 A; TJ = 150 °C 500 600 mΩ
VSD Body diode forward voltage IOUTx = -1 A 0.8 V
tRISE Output rise time VOUTx rising from 10% to 90% of VVM 200 ns
tFALL Output fall time VOUTx falling from 90% to 10% of VVM 140 ns
tPD Input to output propagation delay Input to OUTx 650 ns
tDEAD Output dead time 200 ns
CURRENT SENSE AND REGULATION (IPROPI, VREF)
VREF_INT Internal reference voltage INT_VREF = 1b 2.88 3 3.12 V
AIPROPI Current scaling factor 1500 µA/A
AERR Current mirror total error IOUT = 0.1 A, VVM ≥ 5.5 V -10 10 %
AERR Current mirror total error 0.15 A ≤ IOUT < 0.5 A, VVM ≥ 5.5 V -7 7 %
AERR Current mirror total error IOUT ≥ 0.5 A, VVM ≥ 5.5 V -5 5 %
tOFF Current regulation off time 20 µs
tBLANK Current sense blanking time TBLANK = 0b 1.8 µs
tBLANK Current sense blanking time TBLANK = 1b 1 µs
tDEG Current regulation and stall detection deglitch time TDEG = 0b 2 µs
tDEG Current regulation and stall detection deglitch time TDEG = 1b 1 µs
tINRUSH Inrush time blanking for stall detection 5 6716 ms
Voltage regulation
ΔVLINE Line regulation 5.5 V ≤ VVM ≤ 38 V, VOUT = 5 V, IOUT = 2 A ±2%
ΔVLOAD Load regulation VVM = 24 V, VOUT = 5 V, IOUT = 100 mA to 2 A ±1%
PROTECTION CIRCUITS
VUVLO_VM VM supply undervoltage lockout (UVLO) Supply rising 4.15 4.3 4.45 V
Supply falling 4.05 4.2 4.35 V
VUVLO_HYS Supply UVLO hysteresis Rising to falling threshold 100 mV
tUVLO Supply undervoltage deglitch time VVM falling to OUTx disabled 10 µs
VRST VM UVLO reset VM falling, device reset, no I2C communications 3.9 V
VOVP_TH Overvoltage protection threshold VOUT - VVM 200 mV
tOVP_ON Overvoltage protection turn-on time 10 µs
tOVP_OFF Overvoltage protection turn-off time 250 µs
IOCP Overcurrent protection trip point 3.7 A
tOCP Overcurrent protection deglitch time 2 µs
tRETRY Retry time 1.7 ms
TTSD Thermal shutdown temperature 150 175 °C
THYS Thermal shutdown hysteresis 40 °C