SLVSHO3 April   2024 DRV8235

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Operating Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 External Components
      2. 7.3.2 Summary of Features
      3. 7.3.3 Bridge Control
      4. 7.3.4 Current Sense and Regulation (IPROPI)
        1. 7.3.4.1 Current Sensing
        2. 7.3.4.2 Current Regulation
          1. 7.3.4.2.1 Fixed Off-Time Current Regulation
          2. 7.3.4.2.2 Cycle-By-Cycle Current Regulation
      5. 7.3.5 Stall Detection
      6. 7.3.6 Motor Voltage and Speed Regulation
        1. 7.3.6.1 Internal Bridge Control
        2. 7.3.6.2 Setting Speed/Voltage Regulation Parameters
          1. 7.3.6.2.1 Speed and Voltage Set
          2. 7.3.6.2.2 Speed Scaling Factor
            1. 7.3.6.2.2.1 Target Speed Setting Example
          3. 7.3.6.2.3 Motor Resistance Inverse
          4. 7.3.6.2.4 Motor Resistance Inverse Scale
          5. 7.3.6.2.5 KMC Scaling Factor
          6. 7.3.6.2.6 KMC
          7. 7.3.6.2.7 VSNS_SEL
        3. 7.3.6.3 Soft-Start and Soft-Stop
          1. 7.3.6.3.1 TINRUSH
      7. 7.3.7 Protection Circuits
        1. 7.3.7.1 Overcurrent Protection (OCP)
        2. 7.3.7.2 Thermal Shutdown (TSD)
        3. 7.3.7.3 VM Undervoltage Lockout (VM UVLO)
        4. 7.3.7.4 Overvoltage Protection (OVP)
        5. 7.3.7.5 nFAULT Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Low-Power Sleep Mode
      3. 7.4.3 Fault Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Communication
        1. 7.5.1.1 I2C Write
        2. 7.5.1.2 I2C Read
  9. 8 Register Map
    1. 8.1 DRV8235_STATUS Registers
    2. 8.2 DRV8235_CONFIG Registers
    3. 8.3 DRV8235_CTRL Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application: Brushed DC Motor
      1. 9.2.1 Design Requirements
      2. 9.2.2 Stall Detection
        1. 9.2.2.1 Application Description
          1. 9.2.2.1.1 Stall Detection Timing
          2. 9.2.2.1.2 Hardware Stall Threshold Selection
      3. 9.2.3 Motor Speed and Voltage Regulation Application
        1. 9.2.3.1 Tuning Parameters
          1. 9.2.3.1.1 Resistance Parameters
          2. 9.2.3.1.2 KMC and KMC_SCALE
            1. 9.2.3.1.2.1 Case I
            2. 9.2.3.1.2.2 Case II
              1. 9.2.3.1.2.2.1 Method 1: Tuning from Scratch
                1. 9.2.3.1.2.2.1.1 Tuning KMC_SCALE
                2. 9.2.3.1.2.2.1.2 Tuning KMC
              2. 9.2.3.1.2.2.2 Method 2: Using the Proportionality factor
                1. 9.2.3.1.2.2.2.1 Working Example
      4. 9.2.4 Motor Voltage
      5. 9.2.5 Motor Current
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Bulk Capacitance
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.1 Layout Guidelines

Since the DRV8235 integrates power MOSFETs capable of driving high current, careful attention should be paid to the layout design and external component placement. Some design and layout guidelines are provided below.

  • Low ESR ceramic capacitors should be utilized for the VM to GND bypass capacitor. X5R and X7R types are recommended.
  • The VM power supply capacitors should be placed as close to the device as possible to minimize the loop inductance.
  • The VM power supply bulk capacitor can be of ceramic or electrolytic type, but should also be placed as close as possible to the device to minimize the loop inductance.
  • VM, OUT1, OUT2, and GND carry the high current from the power supply to the outputs and back to ground. Thick metal routing should be utilized for these traces as is feasible.
  • The device thermal pad should be attached to the PCB top layer ground plane and internal ground plane (when available) through thermal vias to maximize the PCB heat sinking.
  • A recommended land pattern for the thermal vias is provided in the package drawing section.
  • The copper plane area attached to the thermal pad should be maximized to ensure optimal heat sinking.